NXP Productos

AFT09H310-03SR6

NXP

FET RF 2CH 70V 920MHZ NI1230S-4S

• Transistor Type: LDMOS
• Frequency: 920MHz
• Gain: 17.9dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 680mA
• Power - Output: 56W
• Voltage - Rated: 70V
• Package / Case: NI-1230S
• Supplier Device Package: NI-1230S

Paquete: NI-1230S

PDTA124ES,126

NXP

TRANS PREBIAS PNP 500MW TO92-3

• Transistor Type: PNP - Pre-Biased
• Current - Collector (Ic) (Max): 100mA
• Voltage - Collector Emitter Breakdown (Max): 50V
• Resistor - Base (R1) (Ohms): 22k
• Resistor - Emitter Base (R2) (Ohms): 22k
• DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V
• Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
• Current - Collector Cutoff (Max): 1µA
• Frequency - Transition: -
• Power - Max: 500mW
• Mounting Type: Through Hole
• Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
• Supplier Device Package: TO-92-3

Paquete: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

LD6835K/285PX

NXP

IC REG LIN 2.85V 300MA 4HXSON

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 2.85V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.24V @ 300mA (Typ)
• Current - Output: 300mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 75µA
• PSRR: 75dB (1kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature, Soft Start
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 4-XDFN Exposed Pad
• Supplier Device Package: 4-HXSON (1x1)

Paquete: 4-XDFN Exposed Pad

MC34848EP

NXP

IC LED DRVR CTRLR DIM 80MA 48QFN

• Type: DC DC Controller
• Topology: Step-Up (Boost)
• Internal Switch(s): No
• Number of Outputs: 8
• Voltage - Supply (Min): 6V
• Voltage - Supply (Max): 14V
• Voltage - Output: 45V
• Current - Output / Channel: 80mA, 160mA
• Frequency: 200kHz ~ 1.2MHz
• Dimming: PWM
• Applications: Backlight
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN-EP (7x7)

Paquete: 48-VFQFN Exposed Pad

74ABT821D,602

NXP

IC D-TYPE POS TRG SNGL 24SOIC

• Function: Standard
• Type: D-Type
• Output Type: Tri-State, Non-Inverted
• Number of Elements: 1
• Number of Bits per Element: 10
• Clock Frequency: 185MHz
• Max Propagation Delay @ V, Max CL: 6.2ns @ 5V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Quiescent (Iq): 250µA
• Input Capacitance: 4pF
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (0.295", 7.50mm Width)

Paquete: 24-SOIC (0.295", 7.50mm Width)

74LVT74PW,118

NXP

IC D-TYPE POS TRG DUAL 14TSSOP

• Function: Set(Preset) and Reset
• Type: D-Type
• Output Type: Differential
• Number of Elements: 2
• Number of Bits per Element: 1
• Clock Frequency: 345MHz
• Max Propagation Delay @ V, Max CL: 3.6ns @ 3.3V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 20mA, 32mA
• Voltage - Supply: 2.7 V ~ 3.6 V
• Current - Quiescent (Iq): 1mA
• Input Capacitance: 3pF
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 14-TSSOP (0.173", 4.40mm Width)

Paquete: 14-TSSOP (0.173", 4.40mm Width)

74LV4020D,118

NXP

IC 14STAGE BINARY RIPPLE 16SOIC

• Logic Type: Binary Counter
• Direction: Up
• Number of Elements: 1
• Number of Bits per Element: 14
• Reset: Asynchronous
• Timing: -
• Count Rate: 100MHz
• Trigger Type: Negative Edge
• Voltage - Supply: 1 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

Paquete: 16-SOIC (0.154", 3.90mm Width)

74LVC544ADB,112

NXP

IC TRANSCEIVER 8BIT INV 24SSOP

• Logic Type: Transceiver, Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 24mA, 24mA
• Voltage - Supply: 1.2 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 24-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 24-SSOP

Paquete: 24-SSOP (0.209", 5.30mm Width)

MPC8544EVTALFA

NXP

IC MPU MPC85XX 667MHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 667MHz
• Co-Processors/DSP: Signal Processing; SPE, Security; SEC
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

Paquete: 783-BBGA, FCBGA

MC68EC040RC40A

NXP

IC MPU M680X0 40MHZ 179PGA

• Core Processor: 68040
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 40MHz
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 179-BPGA
• Supplier Device Package: 179-PGA (47.24x47.24)

Paquete: 179-BPGA

MC68HC000EI16R2

NXP

IC MPU M680X0 16MHZ 68PLCC

• Core Processor: EC000
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 16MHz
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 68-LCC (J-Lead)
• Supplier Device Package: 68-PLCC (25x25)

Paquete: 68-LCC (J-Lead)

MPC8379VRAJFA

NXP

IC MPU MPC83XX 533MHZ 689TEBGA

• Core Processor: PowerPC e300c4s
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 533MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: SATA 3Gbps (4)
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 125°C (TA)
• Security Features: -
• Package / Case: 689-BBGA Exposed Pad
• Supplier Device Package: 689-TEPBGA II (31x31)

Paquete: 689-BBGA Exposed Pad

MC908GR60AMFJE

NXP

IC MCU 8BIT 60KB FLASH 32LQFP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: LVD, POR, PWM
• Number of I/O: 21
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 24x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

Paquete: 32-LQFP

LPC2105BBD48,151

NXP

IC MCU 32BIT 128KB FLASH 48LQFP

• Core Processor: ARM7?
• Core Size: 16/32-Bit
• Speed: 60MHz
• Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 32
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.65 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

Paquete: 48-LQFP

MCF5275LCVM133

NXP

IC MCU 32BIT ROMLESS 196MAPBGA

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 133MHz
• Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
• Peripherals: DMA, WDT
• Number of I/O: 61
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.4 V ~ 1.6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 196-LBGA
• Supplier Device Package: 196-MAPBGA (15x15)

Paquete: 196-LBGA

S912ZVHY32F1VLL

NXP

IC MCU 16BIT 32KB FLASH 100LQFP

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: CAN, I2C, LIN, SCI, SPI
• Peripherals: DMA, LCD, POR, PWM, WDT
• Number of I/O: 73
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

Paquete: 100-LQFP

MK22FN256VMP12

NXP

IC MCU 32BIT 256KB FLASH 64BGA

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 40
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 48K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 22x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LFBGA
• Supplier Device Package: 64-MAPBGA (5x5)

Paquete: 64-LFBGA

OM7802/BGU7003/CMMB,598

NXP

RF EVAL FOR BGU7003

• Type: Amplifier
• Frequency: 400MHz ~ 800MHz
• For Use With/Related Products: BGU7003
• Supplied Contents: Board

Paquete: -

S9S12VR32F0VLCR

NXP

MAGNIV 16-BIT MCU S12 CORE 32K

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 16
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 128 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 2x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

Paquete: 32-LQFP

MK65FN2M0VMI18R

NXP

KINETIS K65: 180MHZ CORTEX-M4F M

• Core Processor: ARM® Cortex®-M4
• Core Size: 32-Bit
• Speed: 180MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I²S, LVD, POR, PWM, WDT
• Number of I/O: 116
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 2x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 169-LFBGA
• Supplier Device Package: 169-MAPBGA (9x9)

Paquete: 169-LFBGA

FS32K146HAT0VLHR

NXP

S32K146 32-BIT MCU ARM

• Core Processor: ARM® Cortex®-M4F
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 24x12b, D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

Paquete: 64-LQFP

MC33PF8200A0ES

NXP

IC POWER MANAGEMENT

• Applications: High Performance i.MX 8, S32x Processor Based
• Current - Supply: -
• Voltage - Supply: 2.5V ~ 5.5V
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-HVQFN (8x8)

Paquete: 56-VFQFN Exposed Pad

TFA9914UK/N1Z

NXP

HIGH EFFICIENCY CLASS-D AMPLIFIE

• Type: Class D
• Output Type: 1-Channel (Mono)
• Max Output Power x Channels @ Load: 5.6W x 1 @ 8Ohm
• Voltage - Supply: 2.7V ~ 10.2V
• Features: -
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C
• Supplier Device Package: 48-WLCSP (2.51x3.55)
• Package / Case: 48-UFBGA, WLCSP

Paquete: 48-UFBGA, WLCSP

TJA1448ATK-0Z

NXP

IC TRANSCEIVER HALF 2/2 14HVSON

• Type: Transceiver
• Protocol: CANbus
• Number of Drivers/Receivers: 2/2
• Duplex: Half
• Receiver Hysteresis: 50 mV
• Data Rate: 5Mbps
• Voltage - Supply: 4.5V ~ 5.5V
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 14-VDFN Exposed Pad
• Supplier Device Package: 14-HVSON (3x4.5)

Paquete: -

LS2084AXE711B

NXP

IC MPU QORIQ 2.1GHZ 1292FCPBGA

• Core Processor: ARM® Cortex®-A72
• Number of Cores/Bus Width: 8 Core, 64-Bit
• Speed: 2.1GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR4
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: 10GbE (8), 2.5GbE (16)
• SATA: SATA (2)
• USB: USB 3.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Secure Boot, TrustZone®
• Package / Case: 1292-BBGA, FCBGA
• Supplier Device Package: 1292-FCPBGA (37.5x37.5)

Paquete: -

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FS32K144UAT0VLFT

NXP

IC MCU 32BIT 512KB FLASH 48LQFP

• Core Processor: ARM® Cortex®-M4F
• Core Size: 32-Bit Single-Core
• Speed: 112MHz
• Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 43
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 16x12b SAR; D/A1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

Paquete: -

MC33FS6526CAER2

NXP

SYSTEM BASIS CHIP, DCDC 2.2A VCO

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: 2.7V ~ 40V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-HLQFP (7x7)

Paquete: -

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FH32K116LFT0VLFT

NXP

S32K116 32-BIT MCU, ARM CORTEX-M

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paquete: -

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