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NXP Productos

Registros 26.590
Página  479/950
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En existencias
Cantidad
BUK7575-55,127
NXP

MOSFET N-CH 55V 19.7A TO220AB

  • FET Type: N-Channel
  • Technology: MOSFET (Metal Oxide)
  • Drain to Source Voltage (Vdss): 55V
  • Current - Continuous Drain (Id) @ 25°C: 19.7A (Tc)
  • Drive Voltage (Max Rds On, Min Rds On): 10V
  • Vgs(th) (Max) @ Id: 4V @ 1mA
  • Gate Charge (Qg) (Max) @ Vgs: -
  • Input Capacitance (Ciss) (Max) @ Vds: 500pF @ 25V
  • Vgs (Max): ±16V
  • FET Feature: -
  • Power Dissipation (Max): 61W (Tc)
  • Rds On (Max) @ Id, Vgs: 75 mOhm @ 10A, 10V
  • Operating Temperature: -55°C ~ 175°C (TJ)
  • Mounting Type: Through Hole
  • Supplier Device Package: TO-220AB
  • Package / Case: TO-220-3
Paquete: TO-220-3
En existencias4.368
BZX84-A13/LF1R
NXP

DIODE ZENER TO-236AB SOT23

  • Voltage - Zener (Nom) (Vz): 13V
  • Tolerance: ±1%
  • Power - Max: 250mW
  • Impedance (Max) (Zzt): 30 Ohms
  • Current - Reverse Leakage @ Vr: 100nA @ 8V
  • Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
  • Operating Temperature: -65°C ~ 150°C
  • Mounting Type: Surface Mount
  • Package / Case: TO-236-3, SC-59, SOT-23-3
  • Supplier Device Package: TO-236AB (SOT23)
Paquete: TO-236-3, SC-59, SOT-23-3
En existencias7.584
UBA2070T/N1,518
NXP

IC CCFL DRIVER 16-SOIC

  • Type: CCFL Controller
  • Frequency: 40.5kHz ~ 100kHz
  • Voltage - Supply: 12.4 V ~ 13.6 V
  • Current - Supply: 1.5mA
  • Current - Output Source/Sink: -
  • Dimming: No
  • Operating Temperature: -25°C ~ 80°C
  • Mounting Type: Surface Mount
  • Package / Case: 16-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 16-SO
Paquete: 16-SOIC (0.154", 3.90mm Width)
En existencias2.800
PCF8577CT/3,112
NXP

IC LCD DRIVER 32/64SEG 40-VSOP

  • Display Type: LCD
  • Configuration: 32 Segment
  • Interface: I2C
  • Digits or Characters: -
  • Current - Supply: -
  • Voltage - Supply: 2.5 V ~ 6 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 40-BSOP (0.295", 7.50mm Width)
  • Supplier Device Package: 40-VSOP
Paquete: 40-BSOP (0.295", 7.50mm Width)
En existencias13.710
74ABT00N,112
NXP

IC GATE NAND 4CH 2-INP 14-DIP

  • Logic Type: NAND Gate
  • Number of Circuits: 4
  • Number of Inputs: 2
  • Features: -
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Current - Quiescent (Max): 50µA
  • Current - Output High, Low: 15mA, 20mA
  • Logic Level - Low: 0.8V
  • Logic Level - High: 2V
  • Max Propagation Delay @ V, Max CL: 3.6ns @ 5V, 50pF
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Through Hole
  • Supplier Device Package: 14-DIP
  • Package / Case: 14-DIP (0.300", 7.62mm)
Paquete: 14-DIP (0.300", 7.62mm)
En existencias5.376
SCC2681TC1A44,512
NXP

IC DUART 44PLCC

  • Features: Configurable GPIO, Internal Oscillator, Timer/Counter
  • Number of Channels: 2, DUART
  • FIFO's: -
  • Protocol: -
  • Data Rate (Max): 1Mbps
  • Voltage - Supply: 5V
  • With Auto Flow Control: Yes
  • With IrDA Encoder/Decoder: -
  • With False Start Bit Detection: Yes
  • With Modem Control: -
  • Mounting Type: Surface Mount
  • Package / Case: 44-LCC (J-Lead)
  • Supplier Device Package: 44-PLCC (16.59x16.59)
Paquete: 44-LCC (J-Lead)
En existencias7.232
PCA9509PGM,125
NXP

IC REDRIVER I2C 1CH 400KHZ 8XQFN

  • Type: Buffer, ReDriver
  • Applications: I2C
  • Input: 2-Wire Bus
  • Output: 2-Wire Bus
  • Data Rate (Max): 400kHz
  • Number of Channels: 1
  • Delay Time: -
  • Signal Conditioning: -
  • Capacitance - Input: 10pF
  • Voltage - Supply: 2.3 V ~ 5.5 V
  • Current - Supply: 5µA
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: -
  • Package / Case: 8-XFQFN Exposed Pad
  • Supplier Device Package: 8-XQFN (1.6x1.6)
Paquete: 8-XFQFN Exposed Pad
En existencias5.952
TJA1050T/V,118
NXP

IC TXRX CAN HS 5.25V 8-SOIC

  • Type: Transceiver
  • Protocol: CAN
  • Number of Drivers/Receivers: 1/1
  • Duplex: Half
  • Receiver Hysteresis: 70mV
  • Data Rate: -
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Operating Temperature: -40°C ~ 150°C
  • Mounting Type: Surface Mount
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SO
Paquete: 8-SOIC (0.154", 3.90mm Width)
En existencias6.480
MPC8544EVTALF
NXP

IC MPU MPC85XX 667MHZ 783FCBGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 667MHz
  • Co-Processors/DSP: Signal Processing; SPE, Security; SEC
  • RAM Controllers: DDR, DDR2, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 783-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
Paquete: 783-BBGA, FCBGA
En existencias3.824
KMPC8358EVRAGDDA
NXP

IC MPU MPC83XX 400MHZ 668BGA

  • Core Processor: PowerPC e300
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 400MHz
  • Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (1)
  • SATA: -
  • USB: USB 1.x (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 668-BBGA Exposed Pad
  • Supplier Device Package: 668-PBGA-PGE (29x29)
Paquete: 668-BBGA Exposed Pad
En existencias6.448
MCIMX6U5EVM10ABR
NXP

IC MPU I.MX6DL 1.0GHZ 624MAPBGA

  • Core Processor: ARM? Cortex?-A9
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 1.0GHz
  • Co-Processors/DSP: Multimedia; NEON? SIMD
  • RAM Controllers: LPDDR2, LVDDR3, DDR3
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: Keypad, LCD
  • Ethernet: 10/100/1000 Mbps (1)
  • SATA: -
  • USB: USB 2.0 + PHY (4)
  • Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
  • Operating Temperature: -20°C ~ 105°C (TJ)
  • Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
  • Package / Case: 624-LFBGA
  • Supplier Device Package: 624-MAPBGA (21x21)
Paquete: 624-LFBGA
En existencias3.984
PK51X256CLK100
NXP

IC MCU 32BIT 256KB FLASH 80LQFP

  • Core Processor: ARM? Cortex?-M4
  • Core Size: 32-Bit
  • Speed: 100MHz
  • Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
  • Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
  • Number of I/O: 39
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 23x16b, D/A 2x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 80-LQFP
  • Supplier Device Package: 80-LQFP (12x12)
Paquete: 80-LQFP
En existencias4.048
hot S9S08SG16E1CTG
NXP

IC MCU 8BIT 16KB FLASH 16TSSOP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 40MHz
  • Connectivity: I2C, LIN, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 12
  • Program Memory Size: 16KB (16K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 1K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 16-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 16-TSSOP
Paquete: 16-TSSOP (0.173", 4.40mm Width)
En existencias5.072
MC9S08PA16AVLD
NXP

IC MCU 8BIT 16KB FLASH 44LQFP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 20MHz
  • Connectivity: I2C, LIN, SPI, UART/USART
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 37
  • Program Memory Size: 16KB (16K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 256 x 8
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 12x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 44-LQFP
  • Supplier Device Package: 44-LQFP (10x10)
Paquete: 44-LQFP
En existencias5.376
MK22FX512AVLL12
NXP

IC MCU 32BIT 512KB FLASH 100LQFP

  • Core Processor: ARM? Cortex?-M4
  • Core Size: 32-Bit
  • Speed: 120MHz
  • Connectivity: CAN, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
  • Peripherals: DMA, I2S, LVD, POR, PWM, WDT
  • Number of I/O: 66
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 33x16b, D/A 1x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
Paquete: 100-LQFP
En existencias3.488
LPC1787FBD208,551
NXP

IC MCU 32BIT 512KB FLASH 208LQFP

  • Core Processor: ARM? Cortex?-M3
  • Core Size: 32-Bit
  • Speed: 120MHz
  • Connectivity: CAN, EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
  • Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
  • Number of I/O: 165
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 96K x 8
  • Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
  • Data Converters: A/D 8x12b, D/A 1x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 208-LQFP
  • Supplier Device Package: 208-LQFP (28x28)
Paquete: 208-LQFP
En existencias13.242
SPAKDSP321VF240
NXP

IC DSP 24BIT 196-MAPBGA

  • Type: Fixed Point
  • Interface: Host Interface, SSI, SCI
  • Clock Rate: 240MHz
  • Non-Volatile Memory: ROM (576 B)
  • On-Chip RAM: 576kB
  • Voltage - I/O: 3.30V
  • Voltage - Core: 1.60V
  • Operating Temperature: -40°C ~ 105°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 196-BGA
  • Supplier Device Package: 196-MAPBGA (15x15)
Paquete: 196-BGA
En existencias2.720
PC8144EVT1000
NXP

DSP 1GHZ LOW TEMP 783BGA

  • Type: SC3400 Core
  • Interface: Ethernet, I2C, SPI, TDM, UART, UTOPIA
  • Clock Rate: 1GHz
  • Non-Volatile Memory: External
  • On-Chip RAM: 10.5MB
  • Voltage - I/O: 3.30V
  • Voltage - Core: 1.00V
  • Operating Temperature: 0°C ~ 90°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 783-BFBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
Paquete: 783-BFBGA, FCBGA
En existencias3.152
MC13203FCR2
NXP

IC RF TXRX 802.15.4/ISM 32-VFQFN

  • Type: TxRx Only
  • RF Family/Standard: 802.15.4, General ISM > 1GHz
  • Protocol: Zigbee?
  • Modulation: DSSS, O-QPSK
  • Frequency: 2.4GHz
  • Data Rate (Max): 250kbps
  • Power - Output: 0dBm
  • Sensitivity: -92dBm
  • Memory Size: -
  • Serial Interfaces: SPI
  • GPIO: 7
  • Voltage - Supply: 2 V ~ 3.4 V
  • Current - Receiving: 37mA
  • Current - Transmitting: 30mA
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 32-VFQFN Exposed Pad
Paquete: 32-VFQFN Exposed Pad
En existencias4.464
BGA2874,115
NXP

IC AMP MMIC WIDEBANK SOT363

  • Frequency: 0Hz ~ 750MHz
  • P1dB: 5dBm
  • Gain: 31dB
  • Noise Figure: 3.1dB
  • RF Type: General Purpose
  • Voltage - Supply: 2.3 V ~ 2.7 V
  • Current - Supply: 16.5mA
  • Test Frequency: 500MHz
  • Package / Case: 6-TSSOP, SC-88, SOT-363
  • Supplier Device Package: 6-TSSOP
Paquete: 6-TSSOP, SC-88, SOT-363
En existencias6.642
MC35FS6501CAER2
NXP

FS6500

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 150°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
Paquete: 48-LQFP Exposed Pad
En existencias4.320
LPC54628J512ET180E
NXP

32-BIT ARM CORTEX-M4

  • Core Processor: ARM® Cortex®-M4
  • Core Size: 32-Bit
  • Speed: 220MHz
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
  • Number of I/O: 145
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 16K x 8
  • RAM Size: 200K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 12x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 180-TFBGA
  • Supplier Device Package: 180-TFBGA (12x12)
Paquete: 180-TFBGA
En existencias9.492
SPC5606BK0VLQ6R
NXP

NXP 32-BIT MCU POWER ARCH CORE

  • Core Processor: e200z0h
  • Core Size: 32-Bit
  • Speed: 64MHz
  • Connectivity: CANbus, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 121
  • Program Memory Size: 1MB (1M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 80K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 15x10b, 5x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-LQFP (20x20)
Paquete: 144-LQFP
En existencias4.528
SAF4010EL-101SK
NXP

SAF4010EL

  • Type: -
  • Interface: -
  • Clock Rate: -
  • Non-Volatile Memory: -
  • On-Chip RAM: -
  • Voltage - I/O: -
  • Voltage - Core: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
Paquete: -
Request a Quote
LX2162RE82029B
NXP

IC MPU QORIQ LX 2GHZ 1150FBGA

  • Core Processor: ARM® Cortex®-A72
  • Number of Cores/Bus Width: 16 Core, 64-Bit
  • Speed: 2GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR4, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: SATA 6Gbps (4)
  • USB: USB 3.0 (1)
  • Voltage - I/O: -
  • Operating Temperature: 5°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 1150-FBGA
  • Supplier Device Package: 1150-FBGA (23x23)
Paquete: -
En existencias174
MC908KX2CDWER-NXP
NXP

MICROCONTROLLER, 8 BIT, HC08/S08

  • Core Processor: HC08
  • Core Size: 8-Bit
  • Speed: 8MHz
  • Connectivity: SCI
  • Peripherals: LVD, POR, PWM
  • Number of I/O: 13
  • Program Memory Size: 2KB (2K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 192 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
  • Data Converters: A/D 4x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 16-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 16-SOIC
Paquete: -
Request a Quote
S9S12ZVL32AMLFR
NXP

S12Z CPU, 32K FLASH

  • Core Processor: S12Z
  • Core Size: 16-Bit
  • Speed: 32MHz
  • Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 34
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 128 x 8
  • RAM Size: 1K x 8
  • Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
  • Data Converters: A/D 10x10b
  • Oscillator Type: External, Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
Paquete: -
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MC34PF8100CHEPR2
NXP

POWER MANAGEMENT IC, I.MX8, PRE-

  • Applications: -
  • Current - Supply: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
Paquete: -
Request a Quote