Página 16 - NXP Productos | Heisener Electronics
Contáctenos
SalesDept@heisener.com +86-755-83210559-827
Iniciar sesión/Registrar
Language Translation

* Please refer to the English Version as our Official Version.

BOM
Carro 0

NXP Productos

Registros 26.590
Página  16/950
Imagen
Nº de pieza
Fabricantes
Descripción
Paquete
En existencias
Cantidad
AFV121KGSR5
NXP

IC TRANS RF LDMOS

  • Transistor Type: LDMOS (Dual)
  • Frequency: 960MHz ~ 1.22GHz
  • Gain: 19.6dB
  • Voltage - Test: 50V
  • Current Rating: -
  • Noise Figure: -
  • Current - Test: 100mA
  • Power - Output: 1000W
  • Voltage - Rated: 112V
  • Package / Case: NI-1230-4S GW
  • Supplier Device Package: NI-1230-4S Gull Wing
Paquete: NI-1230-4S GW
En existencias4.000
MRFE6S9125NBR1
NXP

FET RF 66V 880MHZ TO-272-4

  • Transistor Type: LDMOS
  • Frequency: 880MHz
  • Gain: 20.2dB
  • Voltage - Test: 28V
  • Current Rating: -
  • Noise Figure: -
  • Current - Test: 950mA
  • Power - Output: 27W
  • Voltage - Rated: 66V
  • Package / Case: TO-272BB
  • Supplier Device Package: TO-272 WB-4
Paquete: TO-272BB
En existencias6.192
BC618,112
NXP

TRANS NPN DARL 55V 0.5A TO-92

  • Transistor Type: NPN - Darlington
  • Current - Collector (Ic) (Max): 500mA
  • Voltage - Collector Emitter Breakdown (Max): 55V
  • Vce Saturation (Max) @ Ib, Ic: 1.1V @ 200µA, 200mA
  • Current - Collector Cutoff (Max): 50µA
  • DC Current Gain (hFE) (Min) @ Ic, Vce: 10000 @ 200mA, 5V
  • Power - Max: 625mW
  • Frequency - Transition: 155MHz
  • Operating Temperature: 150°C (TJ)
  • Mounting Type: Through Hole
  • Package / Case: TO-226-3, TO-92-3 (TO-226AA)
  • Supplier Device Package: TO-92-3
Paquete: TO-226-3, TO-92-3 (TO-226AA)
En existencias3.264
BFG540W,115
NXP

TRANS RF NPN 15V 9GHZ SOT343N

  • Transistor Type: NPN
  • Voltage - Collector Emitter Breakdown (Max): 15V
  • Frequency - Transition: 9GHz
  • Noise Figure (dB Typ @ f): 1.3dB ~ 1.8dB @ 900MHz
  • Gain: -
  • Power - Max: 500mW
  • DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 40mA, 8V
  • Current - Collector (Ic) (Max): 120mA
  • Operating Temperature: 175°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: SOT-343 Reverse Pinning
  • Supplier Device Package: 4-SO
Paquete: SOT-343 Reverse Pinning
En existencias5.312
PZM4.3NB3,115
NXP

DIODE ZENER 4.3V 300MW SMT3

  • Voltage - Zener (Nom) (Vz): 4.3V
  • Tolerance: ±2%
  • Power - Max: 300mW
  • Impedance (Max) (Zzt): 90 Ohms
  • Current - Reverse Leakage @ Vr: 3µA @ 1V
  • Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
  • Operating Temperature: -65°C ~ 150°C
  • Mounting Type: Surface Mount
  • Package / Case: TO-236-3, SC-59, SOT-23-3
  • Supplier Device Package: SMT3; MPAK
Paquete: TO-236-3, SC-59, SOT-23-3
En existencias6.448
BZX284-C2V4,115
NXP

DIODE ZENER 2.4V 400MW SOD2

  • Voltage - Zener (Nom) (Vz): 2.4V
  • Tolerance: ±5%
  • Power - Max: 400mW
  • Impedance (Max) (Zzt): 100 Ohms
  • Current - Reverse Leakage @ Vr: 50µA @ 1V
  • Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
  • Operating Temperature: -65°C ~ 150°C
  • Mounting Type: Surface Mount
  • Package / Case: SOD-110
  • Supplier Device Package: SOD110
Paquete: SOD-110
En existencias3.296
MMPF0100F5AZES
NXP

IC PWR MGMT I.MX6 56QFN

  • Applications: Converter, i.MX6
  • Voltage - Input: 2.8 V ~ 4.5 V
  • Number of Outputs: 12
  • Voltage - Output: Multiple
  • Operating Temperature: -40°C ~ 105°C
  • Mounting Type: Surface Mount
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-QFN (8x8)
Paquete: 56-VFQFN Exposed Pad
En existencias7.680
MC17XS6500EK
NXP

IC SWITCH PENTA 32SOIC

  • Switch Type: General Purpose
  • Number of Outputs: 6
  • Ratio - Input:Output: 1:1
  • Output Configuration: High Side
  • Output Type: N-Channel
  • Interface: SPI
  • Voltage - Load: 7 V ~ 18 V
  • Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
  • Current - Output (Max): -
  • Rds On (Typ): 17 mOhm
  • Input Type: -
  • Features: Internal PWM
  • Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
  • Operating Temperature: -40°C ~ 150°C (TJ)
  • Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
  • Supplier Device Package: 32-SOIC EP
Paquete: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
En existencias7.664
hot MC34845DEP
NXP

IC LED DRVR RGLTR DIM 2.6A 24QFN

  • Type: DC DC Regulator
  • Topology: Step-Up (Boost)
  • Internal Switch(s): Yes
  • Number of Outputs: 6
  • Voltage - Supply (Min): 5V
  • Voltage - Supply (Max): 21V
  • Voltage - Output: 8 V ~ 60 V
  • Current - Output / Channel: 2.6A (Switch)
  • Frequency: 300kHz
  • Dimming: PWM
  • Applications: Backlight
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 24-UFQFN Exposed Pad
  • Supplier Device Package: 24-QFN-EP (4x4)
Paquete: 24-UFQFN Exposed Pad
En existencias6.600
TDA1519C/N3,112
NXP

IC AMP AUDIO PWR 12W STER 9SIL

  • Type: Class B
  • Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
  • Max Output Power x Channels @ Load: 22W x 1 @ 4 Ohm; 11W x 2 @ 2 Ohm
  • Voltage - Supply: 6 V ~ 17.5 V
  • Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
  • Mounting Type: Through Hole
  • Operating Temperature: -25°C ~ 150°C (TJ)
  • Supplier Device Package: 9-SIL
  • Package / Case: 9-SIP
Paquete: 9-SIP
En existencias6.416
PCA9674PW,112
NXP

IC I/O EXPANDER I2C 8B 16TSSOP

  • Number of I/O: 8
  • Interface: I2C
  • Interrupt Output: Yes
  • Features: POR
  • Output Type: Push-Pull
  • Current - Output Source/Sink: 100µA, 25mA
  • Clock Frequency: 1MHz
  • Voltage - Supply: 2.3 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 16-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 16-TSSOP
Paquete: 16-TSSOP (0.173", 4.40mm Width)
En existencias4.592
MPC8347ECZUAJFB
NXP

IC MPU MPC83XX 533MHZ 672TBGA

  • Core Processor: PowerPC e300
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 533MHz
  • Co-Processors/DSP: Security; SEC
  • RAM Controllers: DDR
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 672-LBGA
  • Supplier Device Package: 672-TBGA (35x35)
Paquete: 672-LBGA
En existencias6.528
MPC8360VVADDH
NXP

IC MPU MPC83XX 266MHZ 740TBGA

  • Core Processor: PowerPC e300
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 266MHz
  • Co-Processors/DSP: Communications; QUICC Engine
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (1)
  • SATA: -
  • USB: USB 1.x (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 740-LBGA
  • Supplier Device Package: 740-TBGA (37.5x37.5)
Paquete: 740-LBGA
En existencias3.488
hot MPC8560PX833LB
NXP

IC MPU MPC85XX 833MHZ 783FCBGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 833MHz
  • Co-Processors/DSP: Communications; CPM
  • RAM Controllers: DDR, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: -
  • Voltage - I/O: 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
Paquete: 784-BBGA, FCBGA
En existencias7.572
hot MC68HC908JB8JPE
NXP

IC MCU 8BIT 8KB FLASH 20DIP

  • Core Processor: HC08
  • Core Size: 8-Bit
  • Speed: 3MHz
  • Connectivity: USB
  • Peripherals: LVD, POR, PWM
  • Number of I/O: 13
  • Program Memory Size: 8KB (8K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 256 x 8
  • Voltage - Supply (Vcc/Vdd): 4 V ~ 5.5 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: -
  • Package / Case: 20-DIP (0.300", 7.62mm)
  • Supplier Device Package: 20-DIP
Paquete: 20-DIP (0.300", 7.62mm)
En existencias6.608
hot SPC5675KFF0MMM2
NXP

IC MCU 32BIT 2MB FLASH 257MAPBGA

  • Core Processor: e200z7d
  • Core Size: 32-Bit
  • Speed: 180MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, FlexRay, I2C, LIN, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 1.14 V ~ 1.32 V
  • Data Converters: A/D 22x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 257-LFBGA
  • Supplier Device Package: 257-MAPBGA (14x14)
Paquete: 257-LFBGA
En existencias6.816
hot S9S08LG32J0VLF
NXP

IC MCU 8BIT 32KB FLASH 48LQFP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 40MHz
  • Connectivity: I2C, LIN, SCI, SPI
  • Peripherals: LCD, LVD, POR, PWM, WDT
  • Number of I/O: 39
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 1.9K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 9x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
Paquete: 48-LQFP
En existencias9.552
hot S9S12G128F0MLL
NXP

IC MCU 16BIT 128KB FLASH 100LQFP

  • Core Processor: 12V1
  • Core Size: 16-Bit
  • Speed: 25MHz
  • Connectivity: CAN, IrDA, LIN, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 86
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
  • Data Converters: A/D 12x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
Paquete: 100-LQFP
En existencias10.632
LPC11E14FHN33/401,
NXP

IC MCU 32BIT 32KB FLASH 33HVQFN

  • Core Processor: ARM? Cortex?-M0
  • Core Size: 32-Bit
  • Speed: 50MHz
  • Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
  • Peripherals: Brown-out Detect/Reset, POR, WDT
  • Number of I/O: 28
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 10K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 32-VQFN Exposed Pad
  • Supplier Device Package: 32-HVQFN (7x7)
Paquete: 32-VQFN Exposed Pad
En existencias10.872
MMA5148NPKGCWR2
NXP

ACCELEROMETER PSI5 16QFN

  • Type: -
  • Axis: -
  • Acceleration Range: -
  • Sensitivity (LSB/g): -
  • Sensitivity (mV/g): -
  • Bandwidth: -
  • Output Type: -
  • Voltage - Supply: -
  • Features: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
Paquete: -
En existencias7.002
MMA1631NKWR2
NXP

ACCELEROMETER 312G PCM 16QFN

  • Type: Digital
  • Axis: Z
  • Acceleration Range: ±312g
  • Sensitivity (LSB/g): 1638
  • Sensitivity (mV/g): -
  • Bandwidth: -
  • Output Type: PCM
  • Voltage - Supply: 6.3 V ~ 30 V
  • Features: Selectable Low Pass Filter
  • Operating Temperature: -
  • Mounting Type: Surface Mount
  • Package / Case: 16-QFN Exposed Pad
  • Supplier Device Package: 16-QFN-EP (6x6)
Paquete: 16-QFN Exposed Pad
En existencias4.770
HTMS1001FTK/AF,115
NXP

RFID HITAG 128BIT MEM 2HVSON

  • Style: Encapsulated
  • Technology: Passive
  • Frequency: 100kHz ~ 150kHz
  • Memory Type: Read/Write
  • Writable Memory: 1.76kb (User)
  • Standards: ISO 11784, ISO 11785
  • Operating Temperature: -
  • Size / Dimension: 1.45mm x 1.00mm x 0.50mm
Paquete: -
En existencias5.256
MCIMX6D5EYM12CE
NXP

I.MX6DQ 1ROM PERF ENHAN

  • Core Processor: ARM® Cortex®-A9
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 1.2GHz
  • Co-Processors/DSP: Multimedia; NEON™ SIMD
  • RAM Controllers: LPDDR2, LVDDR3, DDR3
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: Keypad, LCD
  • Ethernet: 10/100/1000 Mbps (1)
  • SATA: SATA 3Gbps (1)
  • USB: USB 2.0 + PHY (4)
  • Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
  • Operating Temperature: -20°C ~ 105°C (TJ)
  • Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
  • Package / Case: 624-FBGA, FCBGA
  • Supplier Device Package: 624-FCBGA (21x21)
Paquete: 624-FBGA, FCBGA
En existencias4.912
SPC5777CDK3MME4R
NXP

POWER ARCH CORES 8MB FL

  • Core Processor: e200z7
  • Core Size: 32-Bit Tri-Core
  • Speed: 264MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
  • Peripherals: DMA, LVD, POR, Zipwire
  • Number of I/O: -
  • Program Memory Size: 8MB (8M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 16b Sigma-Delta, eQADC
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 416-BGA
  • Supplier Device Package: 416-MAPBGA (27x27)
Paquete: 416-BGA
En existencias2.592
SPC5645BCK0VLU1
NXP

NXP 32-BIT MCU POWER ARCH CORE

  • Core Processor: e200z4d
  • Core Size: 32-Bit
  • Speed: 120MHz
  • Connectivity: CANbus, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 147
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 160K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 27x10b, 5x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP
  • Supplier Device Package: 176-LQFP (24x24)
Paquete: 176-LQFP
En existencias3.344
LPC5536JHI48-00E
NXP

IC MCU 32BIT 256KB FLASH 48HVQFN

  • Core Processor: ARM® Cortex®-M33
  • Core Size: 32-Bit Single-Core
  • Speed: 150MHz
  • Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
  • Number of I/O: 32
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
  • Data Converters: A/D 10x16b
  • Oscillator Type: External, Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-HVQFN (7x7)
Paquete: -
En existencias780
MKW37A512VFT4R
NXP

IC MCU 32BIT 512KB FLASH 48VFQFN

  • Core Processor: ARM® Cortex®-M0+
  • Core Size: 32-Bit
  • Speed: 48MHz
  • Connectivity: I2C, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-HVQFN (7x7)
Paquete: -
Request a Quote
SPC5744BK1AVMH6
NXP

IC MCU 32B 1.5MB FLASH 100MAPBGA

  • Core Processor: e200z4
  • Core Size: 32-Bit Single-Core
  • Speed: 160MHz
  • Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
  • Peripherals: DMA, I2S, POR, WDT
  • Number of I/O: 65
  • Program Memory Size: 1.5MB (1.5M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 192K x 8
  • Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
  • Data Converters: A/D 36x10b, 16x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-LFBGA
  • Supplier Device Package: 100-MAPBGA (11x11)
Paquete: -
Request a Quote