Microchip Technology Productos

DSC1123AI5-110.0000

Microchip Technology

OSC MEMS 110.0000MHZ LVDS SMD

• Type: MEMS (Silicon)
• Frequency: 110MHz
• Function: Enable/Disable
• Output: LVDS
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±10ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 32mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead, Exposed Pad
• Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

Paquete: 6-SMD, No Lead, Exposed Pad

DSC1001DE1-090.0000T

Microchip Technology

OSC MEMS 90.0000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 90MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±50ppm
• Operating Temperature: -20°C ~ 70°C
• Current - Supply (Max): 8.7mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

Paquete: 4-SMD, No Lead

MIC2774L-31BM5-TR

Microchip Technology

IC SUPERVISOR DUAL LV SOT23-5

• Type: Multi-Voltage Supervisor
• Number of Voltages Monitored: 2
• Output: Complementary
• Reset: Active Low
• Reset Timeout: 140 ms Minimum
• Voltage - Threshold: 3.09V, Adj
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: SC-74A, SOT-753
• Supplier Device Package: SOT-23-5

Paquete: SC-74A, SOT-753

MIC2586-1BM TR

Microchip Technology

IC CTRLR/SEQ HOT SWAP 14-SOIC

• Type: Hot Swap Controller, Sequencer
• Number of Channels: 1
• Internal Switch(s): No
• Applications: General Purpose
• Features: Latched Fault
• Programmable Features: Current Limit, Fault Timeout, Slew Rate, UVLO
• Voltage - Supply: 10 V ~ 80 V
• Current - Output (Max): -
• Operating Temperature: -40°C ~ 85°C
• Current - Supply: 2mA
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SOIC

Paquete: 14-SOIC (0.154", 3.90mm Width)

93LC76BT-E/ST

Microchip Technology

IC EEPROM 8KBIT 3MHZ 8TSSOP

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 8Kb (512 x 16)
• Memory Interface: SPI
• Clock Frequency: 3MHz
• Write Cycle Time - Word, Page: 5ms
• Access Time: -
• Voltage - Supply: 2.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 8-TSSOP

Paquete: 8-TSSOP (0.173", 4.40mm Width)

AT27C512R-45RU

Microchip Technology

IC OTP 512KBIT 45NS 28SOIC

• Memory Type: Non-Volatile
• Memory Format: EPROM
• Technology: EPROM - OTP
• Memory Size: 512Kb (64K x 8)
• Memory Interface: Parallel
• Clock Frequency: -
• Write Cycle Time - Word, Page: -
• Access Time: 45ns
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TC)
• Mounting Type: Surface Mount
• Package / Case: 28-SOIC (0.342", 8.69mm Width)
• Supplier Device Package: 28-SOIC

Paquete: 28-SOIC (0.342", 8.69mm Width)

AT24C02N-10SI-2.7

Microchip Technology

IC EEPROM 2KBIT 400KHZ 8SOIC

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 2Kb (256 x 8)
• Memory Interface: I2C
• Clock Frequency: 400kHz
• Write Cycle Time - Word, Page: 5ms
• Access Time: 900ns
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

Paquete: 8-SOIC (0.154", 3.90mm Width)

93AA66B-I/SN

Microchip Technology

IC EEPROM 4KBIT 2MHZ 8SOIC

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 4Kb (256 x 16)
• Memory Interface: SPI
• Clock Frequency: 2MHz
• Write Cycle Time - Word, Page: 6ms
• Access Time: -
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

Paquete: 8-SOIC (0.154", 3.90mm Width)

SY10EPT21LKG

Microchip Technology

IC TRANSLATOR LVPECL-LVTTL 8MSOP

• Translator Type: Mixed Signal
• Channel Type: -
• Number of Circuits: -
• Channels per Circuit: -
• Voltage - VCCA: -
• Voltage - VCCB: -
• Input Signal: LVPECL
• Output Signal: LVTTL
• Output Type: -
• Data Rate: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Features: -
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 8-MSOP

Paquete: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

SY10EP31VKG-TR

Microchip Technology

IC D-TYPE POS TRG SNGL 8MSOP

• Function: Set(Preset) and Reset
• Type: D-Type
• Output Type: Differential
• Number of Elements: 1
• Number of Bits per Element: 1
• Clock Frequency: 3GHz
• Max Propagation Delay @ V, Max CL: -
• Trigger Type: Positive Edge
• Current - Output High, Low: -
• Voltage - Supply: -3.3 V ~ -5 V
• Current - Quiescent (Iq): 45mA
• Input Capacitance: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

Paquete: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

KSZ8051MNL

Microchip Technology

IC TXRX ETHERNET 32QFN

• Type: Transceiver
• Protocol: MII
• Number of Drivers/Receivers: 1/1
• Duplex: Full
• Receiver Hysteresis: -
• Data Rate: -
• Voltage - Supply: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-QFN (5x5)

Paquete: 32-VFQFN Exposed Pad

PIC18F4685-E/P

Microchip Technology

IC MCU 8BIT 96KB FLASH 40DIP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CAN, I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number of I/O: 36
• Program Memory Size: 96KB (48K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 3.25K x 8
• Voltage - Supply (Vcc/Vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 11x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 40-DIP (0.600", 15.24mm)
• Supplier Device Package: 40-PDIP

Paquete: 40-DIP (0.600", 15.24mm)

PIC18F25K20-E/SO

Microchip Technology

IC MCU 8BIT 32KB FLASH 28SOIC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number of I/O: 24
• Program Memory Size: 32KB (16K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 1.5K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 11x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

Paquete: 28-SOIC (0.295", 7.50mm Width)

PIC16F1508-I/ML

Microchip Technology

IC MCU 8BIT 7KB FLASH 20QFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 17
• Program Memory Size: 7KB (4K x 14)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 5.5 V
• Data Converters: A/D 12x10b, D/A 1x5b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-VFQFN Exposed Pad
• Supplier Device Package: 20-QFN (4x4)

Paquete: 20-VFQFN Exposed Pad

ATPL250AG55J19-Y

Microchip Technology

PL250A-AKU-Y SAMG55J19A-MU LQFP

• Applications: Power Line Communications
• Core Processor: External
• Program Memory Type: -
• Controller Series: -
• RAM Size: -
• Interface: SPI
• Number of I/O: -
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paquete: -

LE57D122BTC

Microchip Technology

IC SLIC 2CH 63DB 44TQFP

• Function: Subscriber Line Interface Concept (SLIC)
• Interface: 2-Wire
• Number of Circuits: 2
• Voltage - Supply: 4.75V ~ 5.25V
• Current - Supply: -
• Power (Watts): -
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 44-TQFP Exposed Pad
• Supplier Device Package: 44-TQFP-EP (10x10)

Paquete: 44-TQFP Exposed Pad

MCP33111-10T-E/MN

Microchip Technology

IC ADC 12BIT SAR 10TDFN

• Number of Bits: 12
• Sampling Rate (Per Second): 1M
• Number of Inputs: 1
• Input Type: Single Ended
• Data Interface: SPI
• Configuration: ADC
• Ratio - S/H:ADC: 0:1
• Number of A/D Converters: 1
• Architecture: SAR
• Reference Type: External
• Voltage - Supply, Analog: 1.7V ~ 1.9V
• Voltage - Supply, Digital: 1.7V ~ 5.5V
• Features: -
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 10-WFDFN Exposed Pad
• Supplier Device Package: 10-TDFN (3x3)
• Mounting Type: Surface Mount

Paquete: 10-WFDFN Exposed Pad

MCP6546UT-E/OTVAO

Microchip Technology

SNG 1.6V OPEN DTAIN COMPATATOT E

• Type: General Purpose
• Number of Elements: 1
• Output Type: CMOS, Open-Drain, Rail-to-Rail, TTL
• Voltage - Supply, Single/Dual (±): 1.6V ~ 5.5V
• Voltage - Input Offset (Max): 7mV @ 5.5V
• Current - Input Bias (Max): 1pA @ 5.5V
• Current - Output (Typ): 30mA
• Current - Quiescent (Max): 1µA
• CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
• Propagation Delay (Max): 8µs
• Hysteresis: 6.5mV
• Operating Temperature: -40°C ~ 125°C
• Package / Case: SC-74A, SOT-753
• Mounting Type: Surface Mount
• Supplier Device Package: SOT-23-5

Paquete: SC-74A, SOT-753

JANS1N4576A-1

Microchip Technology

ZENER DIODE

• Voltage - Zener (Nom) (Vz): 6.4 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 50 Ohms
• Current - Reverse Leakage @ Vr: 2 µA @ 3 V
• Voltage - Forward (Vf) (Max) @ If: -
• Operating Temperature: -65°C ~ 175°C (TA)
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

Paquete: -

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1N941A-TR

Microchip Technology

TEMPERATURE COMPENSATED

• Voltage - Zener (Nom) (Vz): 11.7 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 30 Ohms
• Current - Reverse Leakage @ Vr: 15 µA @ 8 V
• Voltage - Forward (Vf) (Max) @ If: -
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Through Hole
• Package / Case: DO-204AA, DO-7, Axial
• Supplier Device Package: DO-7

Paquete: -

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JANTXV2N2432AUB-TR

Microchip Technology

SMALL-SIGNAL BJT

• Transistor Type: NPN
• Current - Collector (Ic) (Max): 100 mA
• Voltage - Collector Emitter Breakdown (Max): 45 V
• Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
• Current - Collector Cutoff (Max): 10nA
• DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 1mA, 5V
• Power - Max: 360 mW
• Frequency - Transition: -
• Operating Temperature: -65°C ~ 200°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 3-SMD, No Lead
• Supplier Device Package: UB

Paquete: -

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EQCO31X20C1T-I-8EX

Microchip Technology

3.125GBPS COAXPRESS 2.0 TXRC

• Type: Equalizer
• Applications: Professional Video
• Mounting Type: Surface Mount
• Package / Case: 16-VQFN Exposed Pad
• Supplier Device Package: 16-QFN (4x4)

Paquete: -

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JANTXV1N7055UR-1

Microchip Technology

ZENER DIODE

• Voltage - Zener (Nom) (Vz): -
• Tolerance: -
• Power - Max: -
• Impedance (Max) (Zzt): -
• Current - Reverse Leakage @ Vr: -
• Voltage - Forward (Vf) (Max) @ If: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paquete: -

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JANTXV1N5712UBCA

Microchip Technology

DIODE ARRAY SCHOTTKY 16V 75MA UB

• Diode Configuration: 1 Pair Common Anode
• Diode Type: Schottky
• Voltage - DC Reverse (Vr) (Max): 16 V
• Current - Average Rectified (Io) (per Diode): 75mA
• Voltage - Forward (Vf) (Max) @ If: 1 V @ 35 mA
• Speed: Small Signal =< 200mA (Io), Any Speed
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: 150 nA @ 16 V
• Operating Temperature - Junction: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Supplier Device Package: UB

Paquete: -

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GC2510-00

Microchip Technology

SI SRD NON HERMETIC CHIP

• Capacitance @ Vr, F: 0.4pF @ 6V, 1MHz
• Capacitance Ratio: -
• Capacitance Ratio Condition: -
• Voltage - Peak Reverse (Max): 15 V
• Diode Type: Single
• Q @ Vr, F: -
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Chip

Paquete: -

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R3660

Microchip Technology

DIODE GEN PURP 600V 70A DO5

• Diode Type: Standard, Reverse Polarity
• Voltage - DC Reverse (Vr) (Max): 600 V
• Current - Average Rectified (Io): 70A
• Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 200 A
• Speed: Standard Recovery >500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 5 µs
• Current - Reverse Leakage @ Vr: 25 µA @ 600 V
• Capacitance @ Vr, F: -
• Mounting Type: Stud Mount
• Package / Case: DO-203AB, DO-5, Stud
• Supplier Device Package: DO-5 (DO-203AB)
• Operating Temperature - Junction: -55°C ~ 175°C

Paquete: -

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JANS1N5620US

Microchip Technology

DIODE GEN PURP 800V 1A A SQ-MELF

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 800 V
• Current - Average Rectified (Io): 1A
• Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 3 A
• Speed: Standard Recovery >500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 2 µs
• Current - Reverse Leakage @ Vr: -
• Capacitance @ Vr, F: -
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, A
• Supplier Device Package: A, SQ-MELF
• Operating Temperature - Junction: -65°C ~ 200°C

Paquete: -

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JANTXV1N3026BUR-1-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 18 V
• Tolerance: ±5%
• Power - Max: 1 W
• Impedance (Max) (Zzt): 20 Ohms
• Current - Reverse Leakage @ Vr: 10 µA @ 13.7 V
• Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
• Operating Temperature: -55°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: DO-213AB, MELF (Glass)
• Supplier Device Package: DO-213AB (MELF, LL41)

Paquete: -

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