Microchip Technology Productos

DSC1101CE2-020.0000T

Microchip Technology

OSC MEMS 20.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 20MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±25ppm
• Operating Temperature: -20°C ~ 70°C
• Current - Supply (Max): 35mA
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (Max): 0.035" (0.90mm)

Paquete: 6-SMD, No Lead

DSC1001DL1-010.0000T

Microchip Technology

OSC MEMS 10.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 10MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±50ppm
• Operating Temperature: -40°C ~ 105°C
• Current - Supply (Max): 6.3mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

Paquete: 4-SMD, No Lead

DSC1001BI2-012.0000

Microchip Technology

OSC MEMS 12.0000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 12MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±25ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 6.3mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
• Height - Seated (Max): 0.035" (0.90mm)

Paquete: 4-SMD, No Lead

DSC1001BI2-014.7456

Microchip Technology

OSC MEMS 14.7456MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 14.7456MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±25ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 6.3mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
• Height - Seated (Max): 0.035" (0.90mm)

Paquete: 4-SMD, No Lead

DSC1101DL5-052.8000

Microchip Technology

OSC MEMS 52.8000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 52.8MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±10ppm
• Operating Temperature: -40°C ~ 105°C
• Current - Supply (Max): 35mA
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

Paquete: 6-SMD, No Lead

TC1304-VP0EMFTR

Microchip Technology

IC REG DL BUCK/LINEAR SYNC 10DFN

• Topology: Step-Down (Buck) Synchronous (1), Linear (LDO) (1)
• Function: Any Function
• Number of Outputs: 2
• Frequency - Switching: 2MHz
• Voltage/Current - Output 1: 1.2V, 500mA
• Voltage/Current - Output 2: 1.8V, 300mA
• Voltage/Current - Output 3: -
• w/LED Driver: No
• w/Supervisor: No
• w/Sequencer: Yes
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 10-VFDFN Exposed Pad
• Supplier Device Package: 10-DFN (3x3)

Paquete: 10-VFDFN Exposed Pad

MCP121-315E/TO

Microchip Technology

IC SUPERVISOR 3.08V LOW TO-92

• Type: Simple Reset/Power-On Reset
• Number of Voltages Monitored: 1
• Output: Open Drain or Open Collector
• Reset: Active Low
• Reset Timeout: 80 ms Minimum
• Voltage - Threshold: 3.08V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Through Hole
• Package / Case: TO-226-3, TO-92-3 (TO-226AA)
• Supplier Device Package: TO-92-3

Paquete: TO-226-3, TO-92-3 (TO-226AA)

U6820BM-MFP

Microchip Technology

IC DRIVER BCDMOS DUAL/QD 16-SOIC

• Output Configuration: Half Bridge (4)
• Applications: General Purpose
• Interface: SPI
• Load Type: Inductive
• Technology: BCDMOS
• Rds On (Typ): 4 Ohm LS, 6.25 Ohm HS
• Current - Output / Channel: -
• Current - Peak Output: 50mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Voltage - Load: 6 V ~ 18 V
• Operating Temperature: -40°C ~ 150°C (TJ)
• Features: Auto Restart, Status Flag
• Fault Protection: Current Limiting, ESD, Short Circuit, Over Temperature, Over Voltage, UVLO
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

Paquete: 16-SOIC (0.154", 3.90mm Width)

AT28C040-25BC

Microchip Technology

IC EEPROM 4MBIT 250NS 32CDIP

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 4Mb (512K x 8)
• Memory Interface: Parallel
• Clock Frequency: -
• Write Cycle Time - Word, Page: 10ms
• Access Time: 250ns
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C (TC)
• Mounting Type: Through Hole
• Package / Case: 32-CDIP (0.600", 15.24mm)
• Supplier Device Package: 32-CDIP

Paquete: 32-CDIP (0.600", 15.24mm)

25C320T-E/SN

Microchip Technology

IC EEPROM 32KBIT 3MHZ 8SOIC

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 32Kb (4K x 8)
• Memory Interface: SPI
• Clock Frequency: 3MHz
• Write Cycle Time - Word, Page: 5ms
• Access Time: -
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

Paquete: 8-SOIC (0.154", 3.90mm Width)

SST89V516RD2-33-I-NJE-T-NXX

Microchip Technology

IC MCU 8BIT 8051 FLASH 44PLCC

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 33MHz
• Connectivity: EBI/EMI, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 36
• Program Memory Size: 72KB (72K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paquete: -

PIC16F87-E/ML

Microchip Technology

IC MCU 8BIT 7KB FLASH 28QFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 16
• Program Memory Size: 7KB (4K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 368 x 8
• Voltage - Supply (Vcc/Vdd): 4 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 28-VQFN Exposed Pad
• Supplier Device Package: 28-QFN (6x6)

Paquete: 28-VQFN Exposed Pad

DSPIC33EP256GP506-I/MR

Microchip Technology

IC MCU 16BIT 256KB FLASH 64QFN

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 70 MIPs
• Connectivity: CAN, I2C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 53
• Program Memory Size: 256KB (85.5K x 24)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 16
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-VFQFN Exposed Pad
• Supplier Device Package: 64-QFN (9x9)

Paquete: 64-VFQFN Exposed Pad

ATSAMC21G15A-MUT

Microchip Technology

IC MCU 32BIT 32KB FLASH 48VQFN

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: CAN, I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
• Number of I/O: 38
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 14x12b, 2x16b, D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN (7x7)

Paquete: 48-VFQFN Exposed Pad

ATSAMC21G15A-ANT

Microchip Technology

IC MCU 32BIT 32KB FLASH 48TQFP

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: CAN, I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
• Number of I/O: 38
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 14x12b, 2x16b, D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 48-TQFP
• Supplier Device Package: 48-TQFP (7x7)

Paquete: 48-TQFP

PIC16LF1902T-I/MV

Microchip Technology

IC MCU 8BIT 3.5KB FLASH 28UQFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: -
• Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 3.5KB (2K x 14)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 11x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-UFQFN Exposed Pad
• Supplier Device Package: 28-UQFN (4x4)

Paquete: 28-UFQFN Exposed Pad

PIC18LF25K40T-I/ML

Microchip Technology

IC MCU 8BIT 32KB FLASH 28QFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 64MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 32KB (16K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 35x10b, D/A 1x5b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-VQFN Exposed Pad
• Supplier Device Package: 28-QFN (6x6)

Paquete: 28-VQFN Exposed Pad

ATSAMA5D27C-CU

Microchip Technology

IC MCU 32BIT EXT MEM 289LFBGA

• Core Processor: ARM? Cortex?-A5
• Core Size: 32-Bit
• Speed: 500MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB
• Peripherals: DMA, I2S, LCD, POR, PWM, WDT
• Number of I/O: 128
• Program Memory Size: -
• Program Memory Type: External Program Memory
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.1 V ~ 3.6 V
• Data Converters: A/D 12x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 289-LFBGA
• Supplier Device Package: 289-LFBGA (14x14)

Paquete: 289-LFBGA

DSPIC33EP128GS706-E/PT

Microchip Technology

IC MCU 16BIT 128KB FLASH 64TQFP

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 60 MIPs
• Connectivity: I2C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, I2S, POR, PWM, WDT
• Number of I/O: 51
• Program Memory Size: 128KB (43K x 24)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 22x12b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 64-TQFP
• Supplier Device Package: 64-TQFP (10x10)

Paquete: 64-TQFP

MCP47FVB12A0T-E/ST

Microchip Technology

IC DAC 10BIT

• Number of Bits: 10
• Number of D/A Converters: 2
• Settling Time: 6µs (Typ)
• Output Type: Voltage - Buffered
• Differential Output: No
• Data Interface: I2C
• Reference Type: External, Internal, Supply
• Voltage - Supply, Analog: 2.7 V ~ 5.5 V
• Voltage - Supply, Digital: 2.7 V ~ 5.5 V
• INL/DNL (LSB): ±0.4, ±0.05
• Architecture: R-2R
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 8-TSSOP
• Mounting Type: -

Paquete: 8-TSSOP (0.173", 4.40mm Width)

MCP6004T-I/SLGVAO

Microchip Technology

IC OPAMP GP RRO 1MHZ 14-SOIC

• Amplifier Type: General Purpose
• Number of Circuits: 4
• Output Type: Rail-to-Rail
• Slew Rate: 0.6 V/µs
• Gain Bandwidth Product: 1MHz
• -3db Bandwidth: -
• Current - Input Bias: 1pA
• Voltage - Input Offset: 4.5mV
• Current - Supply: 100µA
• Current - Output / Channel: 23mA
• Voltage - Supply, Single/Dual (±): 1.8 V ~ 6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SOIC

Paquete: 14-SOIC (0.154", 3.90mm Width)

1N4713

Microchip Technology

DIODE ZENER

• Voltage - Zener (Nom) (Vz): 30 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): -
• Current - Reverse Leakage @ Vr: 10 nA @ 22.8 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

Paquete: -

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JANTX1N5542B-1-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 22 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 100 Ohms
• Current - Reverse Leakage @ Vr: 10 nA @ 19.8 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

Paquete: -

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JANS1N4573A-1

Microchip Technology

ZENER DIODE

• Voltage - Zener (Nom) (Vz): 6.4 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 100 Ohms
• Current - Reverse Leakage @ Vr: 2 µA @ 3 V
• Voltage - Forward (Vf) (Max) @ If: -
• Operating Temperature: -65°C ~ 175°C (TA)
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

Paquete: -

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JANTXV1N4982D

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 100 V
• Tolerance: ±1%
• Power - Max: 5 W
• Impedance (Max) (Zzt): 110 Ohms
• Current - Reverse Leakage @ Vr: 2 µA @ 76 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: E, Axial
• Supplier Device Package: E, Axial

Paquete: -

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JANTXV1N3034B-1-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 39 V
• Tolerance: ±5%
• Power - Max: 1 W
• Impedance (Max) (Zzt): 60 Ohms
• Current - Reverse Leakage @ Vr: 10 µA @ 29.7 V
• Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
• Operating Temperature: -55°C ~ 175°C
• Mounting Type: Through Hole
• Package / Case: DO-204AL, DO041, Axial
• Supplier Device Package: DO-41

Paquete: -

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JAN1N5811US-TR

Microchip Technology

DIODE GEN PURP 150V 6A B SQ-MELF

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 150 V
• Current - Average Rectified (Io): 6A
• Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 30 ns
• Current - Reverse Leakage @ Vr: 5 µA @ 150 V
• Capacitance @ Vr, F: 60pF @ 10V, 1MHz
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, B
• Supplier Device Package: B, SQ-MELF
• Operating Temperature - Junction: -65°C ~ 175°C

Paquete: -

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CDLL5223-TR

Microchip Technology

DIODE ZENER 2.7V DO-213AB

• Voltage - Zener (Nom) (Vz): 2.7 V
• Tolerance: ±20%
• Power - Max: -
• Impedance (Max) (Zzt): 30 Ohms
• Current - Reverse Leakage @ Vr: 75 µA @ 1 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: DO-213AB, MELF
• Supplier Device Package: DO-213AB

Paquete: -

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