Microchip Technology Productos

DSC1001BI2-037.1250

Microchip Technology

OSC MEMS 37.125MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 37.125MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±25ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 7.2mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
• Height - Seated (Max): 0.035" (0.90mm)

Paquete: 4-SMD, No Lead

DSC1123AI2-250.0000T

Microchip Technology

OSC MEMS 250.000MHZ LVDS SMD

• Type: MEMS (Silicon)
• Frequency: 250MHz
• Function: Enable/Disable
• Output: LVDS
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±25ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 32mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead, Exposed Pad
• Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

Paquete: 6-SMD, No Lead, Exposed Pad

DSC1001CC2-033.0000T

Microchip Technology

OSC MEMS 33.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 33MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±25ppm
• Operating Temperature: 0°C ~ 70°C
• Current - Supply (Max): 7.2mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (Max): 0.035" (0.90mm)

Paquete: 4-SMD, No Lead

DSC1033CE2-022.5792

Microchip Technology

OSC MEMS 22.5792MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 22.5792MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 3.3V
• Frequency Stability: ±25ppm
• Operating Temperature: -20°C ~ 70°C
• Current - Supply (Max): 3mA (Typ)
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (Max): 0.035" (0.90mm)

Paquete: 4-SMD, No Lead

DSC6003JI2A-048.0000

Microchip Technology

OSC MEMS 48.0000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 48MHz
• Function: Enable/Disable
• Output: CMOS
• Voltage - Supply: 1.71 V ~ 3.63 V
• Frequency Stability: ±25ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 1.3mA (Typ)
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

Paquete: 4-SMD, No Lead

ATMEGA64L-8MC

Microchip Technology

IC MCU 8BIT 64KB FLASH 64QFN

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 53
• Program Memory Size: 64KB (32K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 64-VFQFN Exposed Pad
• Supplier Device Package: 64-QFN (9x9)

Paquete: 64-VFQFN Exposed Pad

PIC32MX775F512HT-80V/MR

Microchip Technology

IC MCU 32BIT 512KB FLASH 64QFN

• Core Processor: MIPS32? M4K?
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 53
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 3.6 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-VFQFN Exposed Pad
• Supplier Device Package: 64-QFN (9x9)

Paquete: 64-VFQFN Exposed Pad

PIC16LC712-04/SO

Microchip Technology

IC MCU 8BIT 1.75KB OTP 18SOIC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: -
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 13
• Program Memory Size: 1.75KB (1K x 14)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 4x8b
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 18-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 18-SOIC

Paquete: 18-SOIC (0.295", 7.50mm Width)

ATSAM3S1AB-MU

Microchip Technology

IC MCU 32BIT 64KB FLASH 48QFN

• Core Processor: ARM? Cortex?-M3
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: I2C, MMC, SPI, SSC, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 34
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.62 V ~ 3.6 V
• Data Converters: A/D 8x10/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN (7x7)

Paquete: 48-VFQFN Exposed Pad

PIC18LF4523-I/ML

Microchip Technology

IC MCU 8BIT 32KB FLASH 44QFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number of I/O: 36
• Program Memory Size: 32KB (16K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 1.5K x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 5.5 V
• Data Converters: A/D 13x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-VQFN Exposed Pad
• Supplier Device Package: 44-QFN (8x8)

Paquete: 44-VQFN Exposed Pad

PIC24FJ64GA104-I/ML

Microchip Technology

IC MCU 16BIT 64KB FLASH 44QFN

• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number of I/O: 35
• Program Memory Size: 64KB (22K x 24)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V
• Data Converters: A/D 13x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-VQFN Exposed Pad
• Supplier Device Package: 44-QFN (8x8)

Paquete: 44-VQFN Exposed Pad

PIC18F6310-I/PT

Microchip Technology

IC MCU 8BIT 8KB FLASH 64TQFP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 8KB (4K x 16)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 768 x 8
• Voltage - Supply (Vcc/Vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-TQFP
• Supplier Device Package: 64-TQFP (10x10)

Paquete: 64-TQFP

AT42QT1245-AU

Microchip Technology

IC TOUCH SENSOR 24KEY 32TQFP

• Type: Buttons
• Proximity Detection: No
• Number of Inputs: Up to 24
• LED Driver Channels: -
• Interface: SPI
• Resolution: 10 b
• Voltage - Supply: 3 V ~ 5 V
• Current - Supply: 6.6mA
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 32-TQFP
• Supplier Device Package: 32-TQFP (7x7)

Paquete: 32-TQFP

24LC024H-E/SN16KVAO

Microchip Technology

2K SEEPROM ADDRESSABLE MEMORY DE

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 2Kb (256 x 8)
• Memory Interface: I²C
• Clock Frequency: 1MHz
• Write Cycle Time - Word, Page: 5ms
• Access Time: 400ns
• Voltage - Supply: 2.5V ~ 5.5V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

Paquete: 8-SOIC (0.154", 3.90mm Width)

JANS1N4114-1

Microchip Technology

ZENER DIODE

• Voltage - Zener (Nom) (Vz): 20 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 150 Ohms
• Current - Reverse Leakage @ Vr: 10 nA @ 15.2 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

Paquete: -

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1N458-TR

Microchip Technology

DIODE GP REV 150V 150MA DO35

• Diode Type: Standard, Reverse Polarity
• Voltage - DC Reverse (Vr) (Max): 150 V
• Current - Average Rectified (Io): 150mA
• Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
• Speed: Small Signal =< 200mA (Io), Any Speed
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: 1 µA @ 150 V
• Capacitance @ Vr, F: -
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)
• Operating Temperature - Junction: -65°C ~ 150°C

Paquete: -

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1N5251

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 22 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 29 Ohms
• Current - Reverse Leakage @ Vr: 100 nA @ 16.2 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

Paquete: -

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CD4696D

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 9.1 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): -
• Current - Reverse Leakage @ Vr: 1 µA @ 6.9 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die

Paquete: -

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JAN1N6315US

Microchip Technology

DIODE ZENER 4.3V 500MW MELF

• Voltage - Zener (Nom) (Vz): 4.3 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 20 Ohms
• Current - Reverse Leakage @ Vr: 2 µA @ 1 V
• Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, B
• Supplier Device Package: B, SQ-MELF

Paquete: -

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ATECC608B-TNGLORAS-C

Microchip Technology

IC AUTHENTICATION CHIP 8SOIC

• Type: Authentication Chip
• Applications: -
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

Paquete: -

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1N4620UR-1-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 3.3 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 1.65 Ohms
• Current - Reverse Leakage @ Vr: 7.5 µA @ 1.5 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TA)
• Mounting Type: Surface Mount
• Package / Case: DO-213AA (Glass)
• Supplier Device Package: DO-213AA

Paquete: -

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CD823A

Microchip Technology

DIODE ZENER TEMP COMPENSATED

• Voltage - Zener (Nom) (Vz): 6.2 V
• Tolerance: ±4.83%
• Power - Max: -
• Impedance (Max) (Zzt): 13 Ohms
• Current - Reverse Leakage @ Vr: 2 µA @ 3 V
• Voltage - Forward (Vf) (Max) @ If: -
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die

Paquete: -

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JANTX1N4121-1-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 33 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 200 Ohms
• Current - Reverse Leakage @ Vr: 10 nA @ 25.1 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-35

Paquete: -

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PIC18F45Q24-I-PT

Microchip Technology

32KB FLASH, 2KB RAM, 512BYTES EE

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 64MHz
• Connectivity: DALI, FIFO, I2C, LINbus, SMBus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
• Number of I/O: 35
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 22x10b SAR; D/A 1x8b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-TQFP
• Supplier Device Package: 44-TQFP (10x10)

Paquete: -

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DSC612NI2A-01K7

Microchip Technology

IC CLOCK GENERATOR 6VFLGA

• Type: Clock Generator
• PLL: Yes
• Input: -
• Output: LVCMOS
• Number of Circuits: 1
• Ratio - Input:Output: 2:2
• Differential - Input:Output: No/No
• Frequency - Max: 100MHz
• Divider/Multiplier: Yes/No
• Voltage - Supply: 1.71V ~ 3.63V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 6-VFLGA
• Supplier Device Package: 6-VFLGA (2x1.6)

Paquete: -

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CDLL4574A-TR

Microchip Technology

DIODE ZENER TEMP COMPENSATED

• Voltage - Zener (Nom) (Vz): -
• Tolerance: -
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 100 Ohms
• Current - Reverse Leakage @ Vr: 2 µA @ 3 V
• Voltage - Forward (Vf) (Max) @ If: -
• Operating Temperature: -55°C ~ 100°C
• Mounting Type: Surface Mount
• Package / Case: DO-213AA
• Supplier Device Package: DO-213AA

Paquete: -

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MCP47CVD22T-E-UN

Microchip Technology

IC DAC 12BIT V-OUT 10MSOP

• Number of Bits: 12
• Number of D/A Converters: 2
• Settling Time: 4µs
• Output Type: Voltage - Buffered
• Differential Output: No
• Data Interface: I2C
• Reference Type: External, Internal, Supply
• Voltage - Supply, Analog: 1.8V ~ 5.5V
• Voltage - Supply, Digital: 1.8V ~ 5.5V
• INL/DNL (LSB): ±1 (Max), ±1 (Max)
• Architecture: String DAC
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 10-MSOP
• Mounting Type: Surface Mount

Paquete: -

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JANTX1N4105D-1-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 11 V
• Tolerance: ±1%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 200 Ohms
• Current - Reverse Leakage @ Vr: 50 nA @ 8.5 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

Paquete: -

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