Microchip Technology Productos

DSC2311KM1-R0036T

Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

• Type: MEMS (Silicon)
• Frequency - Output 1: 25MHz
• Frequency - Output 2: 20MHz
• Function: Enable/Disable
• Output: LVCMOS
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±50ppm
• Operating Temperature: -55°C ~ 125°C
• Current - Supply (Max): -
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height: 0.035" (0.90mm)
• Package / Case: 6-SMD, No Lead

Paquete: 6-SMD, No Lead

DSC1121CM2-022.5972

Microchip Technology

OSC MEMS 22.5972MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 22.5972MHz
• Function: Enable/Disable
• Output: CMOS
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±25ppm
• Operating Temperature: -55°C ~ 125°C
• Current - Supply (Max): 35mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (Max): 0.035" (0.90mm)

Paquete: 6-SMD, No Lead

DSC1101CE5-025.0000

Microchip Technology

OSC MEMS 25.0000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 25MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±10ppm
• Operating Temperature: -20°C ~ 70°C
• Current - Supply (Max): 35mA
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (Max): 0.035" (0.90mm)

Paquete: 6-SMD, No Lead

DSC1001BI2-006.0000

Microchip Technology

OSC MEMS 6.0000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 6MHz
• Function: Enable/Disable
• Output: CMOS
• Voltage - Supply: 1.7 V ~ 3.6 V
• Frequency Stability: ±25ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 6.3mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
• Height - Seated (Max): 0.035" (0.90mm)

Paquete: 4-SMD, No Lead

TC4427EMF

Microchip Technology

IC MOSFET DVR 1.5A DUAL HS 8DFN

• Driven Configuration: Low-Side
• Channel Type: Independent
• Number of Drivers: 2
• Gate Type: N-Channel, P-Channel MOSFET
• Voltage - Supply: 4.5 V ~ 18 V
• Logic Voltage - VIL, VIH: 0.8V, 2.4V
• Current - Peak Output (Source, Sink): 1.5A, 1.5A
• Input Type: Non-Inverting
• High Side Voltage - Max (Bootstrap): -
• Rise / Fall Time (Typ): 19ns, 19ns
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 8-VDFN Exposed Pad
• Supplier Device Package: 8-DFN-S (6x5)

Paquete: 8-VDFN Exposed Pad

AT49F001N-70VC

Microchip Technology

IC FLASH 1MBIT 70NS 32VSOP

• Memory Type: Non-Volatile
• Memory Format: FLASH
• Technology: FLASH
• Memory Size: 1Mb (128K x 8)
• Memory Interface: Parallel
• Clock Frequency: -
• Write Cycle Time - Word, Page: 50µs
• Access Time: 70ns
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C (TC)
• Mounting Type: Surface Mount
• Package / Case: 32-TFSOP (0.488", 12.40mm Width)
• Supplier Device Package: 32-VSOP

Paquete: 32-TFSOP (0.488", 12.40mm Width)

AT28HC64B-90TI

Microchip Technology

IC EEPROM 64KBIT 90NS 28TSOP

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 64Kb (8K x 8)
• Memory Interface: Parallel
• Clock Frequency: -
• Write Cycle Time - Word, Page: 10ms
• Access Time: 90ns
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TC)
• Mounting Type: Surface Mount
• Package / Case: 28-TSSOP (0.465", 11.80mm Width)
• Supplier Device Package: 28-TSOP

Paquete: 28-TSSOP (0.465", 11.80mm Width)

MCP23S08T-E/SO

Microchip Technology

IC I/O EXPANDER SPI 8B 18SOIC

• Number of I/O: 8
• Interface: SPI
• Interrupt Output: Yes
• Features: POR
• Output Type: Push-Pull
• Current - Output Source/Sink: 25mA
• Clock Frequency: 10MHz
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 18-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 18-SOIC

Paquete: 18-SOIC (0.295", 7.50mm Width)

TS87C54X2-MCA

Microchip Technology

IC MCU 8BIT 16KB OTP 40PDIL

• Core Processor: 80C51
• Core Size: 8-Bit
• Speed: 40/20MHz
• Connectivity: UART/USART
• Peripherals: POR, WDT
• Number of I/O: 32
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 40-DIP (0.600", 15.24mm)
• Supplier Device Package: 40-PDIL

Paquete: 40-DIP (0.600", 15.24mm)

PIC16C54T-10E/SO

Microchip Technology

IC MCU 8BIT 768B OTP 18SOIC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 10MHz
• Connectivity: -
• Peripherals: POR, WDT
• Number of I/O: 12
• Program Memory Size: 768B (512 x 12)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 25 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 18-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 18-SOIC

Paquete: 18-SOIC (0.295", 7.50mm Width)

PIC16LF83-04/SO

Microchip Technology

IC MCU 8BIT 896B FLASH 18SOIC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: -
• Peripherals: POR, WDT
• Number of I/O: 13
• Program Memory Size: 896B (512 x 14)
• Program Memory Type: FLASH
• EEPROM Size: 64 x 8
• RAM Size: 36 x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 18-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 18-SOIC

Paquete: 18-SOIC (0.295", 7.50mm Width)

PIC18F4420-E/PT

Microchip Technology

IC MCU 8BIT 16KB FLASH 44TQFP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number of I/O: 36
• Program Memory Size: 16KB (8K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 768 x 8
• Voltage - Supply (Vcc/Vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 13x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 44-TQFP
• Supplier Device Package: 44-TQFP (10x10)

Paquete: 44-TQFP

PIC16F627-04I/SS

Microchip Technology

IC MCU 8BIT 1.75KB FLASH 20SSOP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 16
• Program Memory Size: 1.75KB (1K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 128 x 8
• RAM Size: 224 x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 20-SSOP

Paquete: 20-SSOP (0.209", 5.30mm Width)

PIC16LF627AT-I/ML

Microchip Technology

IC MCU 8BIT 1.75KB FLASH 28QFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 16
• Program Memory Size: 1.75KB (1K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 128 x 8
• RAM Size: 224 x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-VQFN Exposed Pad
• Supplier Device Package: 28-QFN (6x6)

Paquete: 28-VQFN Exposed Pad

PIC16C54CT-04I/SO

Microchip Technology

IC MCU 8BIT 768B OTP 18SOIC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: -
• Peripherals: POR, WDT
• Number of I/O: 12
• Program Memory Size: 768B (512 x 12)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 25 x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 18-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 18-SOIC

Paquete: 18-SOIC (0.295", 7.50mm Width)

PIC16LF1508T-I/ML

Microchip Technology

IC MCU 8BIT 7KB FLASH 20QFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 17
• Program Memory Size: 7KB (4K x 14)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 12x10b, D/A 1x5b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-VFQFN Exposed Pad
• Supplier Device Package: 20-QFN (4x4)

Paquete: 20-VFQFN Exposed Pad

PIC18LF25K40-I/SO

Microchip Technology

IC MCU 8BIT 32KB FLASH 28SOIC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 64MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 32KB (16K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 35x10b, D/A 1x5b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

Paquete: 28-SOIC (0.295", 7.50mm Width)

ATMEGA256RZBV-8CU

Microchip Technology

IC RF TXRX+MCU 802.15.4 100TFBGA

• Type: TxRx + MCU
• RF Family/Standard: 802.15.4
• Protocol: 6LoWPAN, Zigbee?
• Modulation: O-QPSK
• Frequency: 2.4GHz
• Data Rate (Max): 250kbps
• Power - Output: 3dBm
• Sensitivity: -101dBm
• Memory Size: 256kB Flash, 4kB EEPROM, 8kB RAM
• Serial Interfaces: I2C, JTAG, SPI, USART
• GPIO: 86
• Voltage - Supply: 1.8 V ~ 3.6 V
• Current - Receiving: 15.5mA
• Current - Transmitting: 9.5mA ~ 16.5mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TFBGA

Paquete: 100-TFBGA

PM5377-FGI

Microchip Technology

96-PORT (240G) STS-1 CROSS-CONNE

• Function: -
• Interface: -
• Number of Circuits: -
• Voltage - Supply: -
• Current - Supply: -
• Power (Watts): -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paquete: -

LE89316QVC

Microchip Technology

IC SOLAC FXS+FXO 1CH 48LQFP

• Function: -
• Interface: 4-Wire Serial
• Number of Circuits: 2
• Voltage - Supply: -
• Current - Supply: -
• Power (Watts): -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: -
• Supplier Device Package: 48-LQFP

Paquete: -

1N6320

Microchip Technology

DIODE ZENER

• Voltage - Zener (Nom) (Vz): 6.8 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 3 Ohms
• Current - Reverse Leakage @ Vr: 2 µA @ 4 V
• Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

Paquete: -

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R4330IL

Microchip Technology

DIODE GEN PURP 300V 150A DO205AA

• Diode Type: Standard, Reverse Polarity
• Voltage - DC Reverse (Vr) (Max): 300 V
• Current - Average Rectified (Io): 150A
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 A
• Speed: Standard Recovery >500ns, > 200mA (Io)
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: 50 µA @ 300 V
• Capacitance @ Vr, F: -
• Mounting Type: Stud Mount
• Package / Case: DO-205AA, DO-8, Stud
• Supplier Device Package: DO-205AA (DO-8)
• Operating Temperature - Junction: -65°C ~ 200°C

Paquete: -

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2N2608UB

Microchip Technology

JFET P-CH 30V UB

• FET Type: P-Channel
• Voltage - Breakdown (V(BR)GSS): 30 V
• Drain to Source Voltage (Vdss): -
• Current - Drain (Idss) @ Vds (Vgs=0): 1 mA @ 5 V
• Current Drain (Id) - Max: -
• Voltage - Cutoff (VGS off) @ Id: 750 mV @ 1 µA
• Input Capacitance (Ciss) (Max) @ Vds: 10pF @ 5V
• Resistance - RDS(On): -
• Power - Max: 300 mW
• Operating Temperature: -65°C ~ 200°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 3-SMD, No Lead
• Supplier Device Package: UB

Paquete: -

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GC2521-79

Microchip Technology

SI SRD HERMETIC PILL

• Capacitance @ Vr, F: 0.6pF @ 6V, 1MHz
• Capacitance Ratio: -
• Capacitance Ratio Condition: -
• Voltage - Peak Reverse (Max): 20 V
• Diode Type: Single
• Q @ Vr, F: -
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 2-SMD, No Lead
• Supplier Device Package: -

Paquete: -

Request a Quote

PIC32CX2051MTC128-I-X9B

Microchip Technology

IC MCU 32BIT 2MB FLASH 128TQFP

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paquete: -

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MX1N3332D

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 51 V
• Tolerance: ±20%
• Power - Max: 50 W
• Impedance (Max) (Zzt): 5.2 Ohms
• Current - Reverse Leakage @ Vr: 10 µA @ 38.8 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 10 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Stud Mount
• Package / Case: DO-203AB, DO-5, Stud
• Supplier Device Package: DO-5 (DO-203AB)

Paquete: -

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JANTX1N4981DUS-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 91 V
• Tolerance: ±1%
• Power - Max: 5 W
• Impedance (Max) (Zzt): 90 Ohms
• Current - Reverse Leakage @ Vr: 2 µA @ 69.2 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, E
• Supplier Device Package: E-MELF

Paquete: -

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JAN1N6348US-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 100 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 340 Ohms
• Current - Reverse Leakage @ Vr: 50 nA @ 76 V
• Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, B
• Supplier Device Package: B, SQ-MELF

Paquete: -

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