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Intel Productos

Registros 9.824
Página  166/351
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S87C581SF76
Intel

IC MCU 8BIT 32KB OTP 44MQFP

  • Core Processor: MCS 51
  • Core Size: 8-Bit
  • Speed: 16MHz
  • Connectivity: SIO
  • Peripherals: -
  • Number of I/O: 32
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: OTP
  • EEPROM Size: -
  • RAM Size: 256 x 8
  • Voltage - Supply (Vcc/Vdd): 4 V ~ 6 V
  • Data Converters: -
  • Oscillator Type: External
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: -
  • Package / Case: 44-QFP
  • Supplier Device Package: -
Paquete: 44-QFP
En existencias3.680
S87C521SF76
Intel

IC MCU 8BIT 8KB OTP 44MQFP

  • Core Processor: MCS 51
  • Core Size: 8-Bit
  • Speed: 16MHz
  • Connectivity: SIO
  • Peripherals: -
  • Number of I/O: 32
  • Program Memory Size: 8KB (8K x 8)
  • Program Memory Type: OTP
  • EEPROM Size: -
  • RAM Size: 256 x 8
  • Voltage - Supply (Vcc/Vdd): 4 V ~ 6 V
  • Data Converters: -
  • Oscillator Type: External
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: -
  • Package / Case: 44-QFP
  • Supplier Device Package: -
Paquete: 44-QFP
En existencias6.400
10AS027E2F27E1SG
Intel

IC SOC FPGA 240 I/O 672FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 270K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 672-BBGA, FCBGA
  • Supplier Device Package: 672-FBGA (27x27)
Paquete: 672-BBGA, FCBGA
En existencias6.816
1SX250LU3F50I2VG
Intel

2397-PIN FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 2500K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
Paquete: -
En existencias2.960
10AS027H3F34E2SG
Intel

1152-PIN FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 270K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
Paquete: -
En existencias3.392
hot EPC1PI8N
Intel

IC CONFIG DEVICE 1MBIT 8DIP

  • Programmable Type: OTP
  • Memory Size: 1Mb
  • Voltage - Supply: 3 V ~ 3.6 V, 4.5 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 8-DIP (0.300", 7.62mm)
  • Supplier Device Package: 8-PDIP
Paquete: 8-DIP (0.300", 7.62mm)
En existencias10.020
hot EPF10K200EFC672-2
Intel

IC FPGA 470 I/O 672FBGA

  • Number of LABs/CLBs: 1248
  • Number of Logic Elements/Cells: 9984
  • Total RAM Bits: 98304
  • Number of I/O: 470
  • Number of Gates: 513000
  • Voltage - Supply: 2.3 V ~ 2.7 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 672-BBGA
  • Supplier Device Package: 672-FBGA (27x27)
Paquete: 672-BBGA
En existencias5.344
EP1K50FC484-1N
Intel

IC FPGA 249 I/O 484FBGA

  • Number of LABs/CLBs: 360
  • Number of Logic Elements/Cells: 2880
  • Total RAM Bits: 40960
  • Number of I/O: 249
  • Number of Gates: 199000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
Paquete: 484-BBGA
En existencias4.384
10AX090S3F45E2SG
Intel

IC FPGA 624 I/O 1932FCBGA

  • Number of LABs/CLBs: 339620
  • Number of Logic Elements/Cells: 900000
  • Total RAM Bits: 59234304
  • Number of I/O: 624
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
Paquete: 1932-BBGA, FCBGA
En existencias3.680
10AX057K2F35I2LG
Intel

IC FPGA 396 I/O 1152FCBGA

  • Number of LABs/CLBs: 217080
  • Number of Logic Elements/Cells: 570000
  • Total RAM Bits: 42082304
  • Number of I/O: 396
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.98 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
Paquete: 1152-BBGA, FCBGA
En existencias6.640
10AX027H1F34I1HG
Intel

IC FPGA 384 I/O 1152FCBGA

  • Number of LABs/CLBs: 101620
  • Number of Logic Elements/Cells: 270000
  • Total RAM Bits: 17870848
  • Number of I/O: 384
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.98 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
Paquete: 1152-BBGA, FCBGA
En existencias6.976
10AX032E1F27I1HG
Intel

IC FPGA 240 I/O 672FBGA

  • Number of LABs/CLBs: 119900
  • Number of Logic Elements/Cells: 320000
  • Total RAM Bits: 21040128
  • Number of I/O: 240
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.98 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 672-BBGA, FCBGA
  • Supplier Device Package: 672-FBGA (27x27)
Paquete: 672-BBGA, FCBGA
En existencias2.448
10AX022E4F27I3LG
Intel

672-PIN FBGA

  • Number of LABs/CLBs: 80330
  • Number of Logic Elements/Cells: 220000
  • Total RAM Bits: 13752320
  • Number of I/O: 240
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.98 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 672-BBGA, FCBGA
  • Supplier Device Package: 672-FBGA, FC (27x27)
Paquete: 672-BBGA, FCBGA
En existencias7.792
EP2AGX65DF29C5
Intel

IC FPGA 364 I/O 780FBGA

  • Number of LABs/CLBs: 2530
  • Number of Logic Elements/Cells: 60214
  • Total RAM Bits: 5371904
  • Number of I/O: 364
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FBGA (29x29)
Paquete: 780-BBGA, FCBGA
En existencias3.568
5CGXBC3B6F23C7N
Intel

IC FPGA 208 I/O 484FBGA

  • Number of LABs/CLBs: 11900
  • Number of Logic Elements/Cells: 31500
  • Total RAM Bits: 1381376
  • Number of I/O: 208
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FBGA (23x23)
Paquete: 484-BGA
En existencias7.856
hot EP2C35F672C8N
Intel

IC FPGA 475 I/O 672FBGA

  • Number of LABs/CLBs: 2076
  • Number of Logic Elements/Cells: 33216
  • Total RAM Bits: 483840
  • Number of I/O: 475
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 672-BGA
  • Supplier Device Package: 672-FBGA (27x27)
Paquete: 672-BGA
En existencias12.204
5CEFA5M13I7N
Intel

IC FPGA 175 I/O 383MBGA

  • Number of LABs/CLBs: 29080
  • Number of Logic Elements/Cells: 77000
  • Total RAM Bits: 5001216
  • Number of I/O: 175
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 383-TFBGA
  • Supplier Device Package: 383-MBGA (13x13)
Paquete: 383-TFBGA
En existencias4.224
hot EPM7160STC100-7
Intel

IC CPLD 160MC 7.5NS 100TQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 7.5ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 10
  • Number of Macrocells: 160
  • Number of Gates: 3200
  • Number of I/O: 84
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-TQFP (14x14)
Paquete: 100-TQFP
En existencias4.432
EP3SE50F484I4G
Intel

IC FPGA 296 I/O 484FBGA

  • Number of LABs/CLBs: 1900
  • Number of Logic Elements/Cells: 47500
  • Total RAM Bits: 5760000
  • Number of I/O: 296
  • Number of Gates: -
  • Voltage - Supply: 0.86V ~ 1.15V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA, FCBGA
  • Supplier Device Package: 484-FBGA (23x23)
Paquete: 484-BBGA, FCBGA
En existencias3.360
5SGXMBBR3H43I3LG
Intel

IC FPGA 600 I/O 1760HBGA

  • Number of LABs/CLBs: 359200
  • Number of Logic Elements/Cells: 952000
  • Total RAM Bits: 53248000
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-HBGA (45x45)
Paquete: -
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1SG250HN3F43E3VG
Intel

IC FPGA 688 I/O 1760FBGA

  • Number of LABs/CLBs: 312500
  • Number of Logic Elements/Cells: 2500000
  • Total RAM Bits: -
  • Number of I/O: 688
  • Number of Gates: -
  • Voltage - Supply: 0.77V ~ 0.97V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FBGA (42.5x42.5)
Paquete: -
Request a Quote
RH80532GC029512
Intel

IC MPU 2 1.7GHZ 478FCPGA

  • Core Processor: Mobile Intel® Pentium® 4 Processor - M
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.7GHz
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.3V
  • Operating Temperature: 100°C (TJ)
  • Security Features: -
  • Package / Case: 478-BFCPGA
  • Supplier Device Package: 478-FCPGA (35x35)
Paquete: -
Request a Quote
5SGSMD3H1F35C1G
Intel

IC FPGA 432 I/O 1152FBGA

  • Number of LABs/CLBs: 89000
  • Number of Logic Elements/Cells: 236000
  • Total RAM Bits: 13312000
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
Paquete: -
Request a Quote
EP4SGX530KF43C2G
Intel

IC FPGA 880 I/O 1760FBGA

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: -
  • Number of I/O: -
  • Number of Gates: -
  • Voltage - Supply: -
  • Mounting Type: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
Paquete: -
Request a Quote
AGIB027R31B1I2VB
Intel

IC FPGA AGILEX-I 3184BGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.7M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 3184-BFBGA Exposed Pad
  • Supplier Device Package: 3184-BGA (56x45)
Paquete: -
Request a Quote
5SGXMA3H3F35I4G
Intel

IC FPGA 600 I/O 1152FBGA

  • Number of LABs/CLBs: 128300
  • Number of Logic Elements/Cells: 340000
  • Total RAM Bits: 19456000
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
Paquete: -
Request a Quote
5SGXMBBR1H43C2G
Intel

IC FPGA 600 I/O 1760HBGA

  • Number of LABs/CLBs: 359200
  • Number of Logic Elements/Cells: 952000
  • Total RAM Bits: 53248000
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-HBGA (45x45)
Paquete: -
Request a Quote
AGIB027R29B1E1VR3
Intel

IC FPGA AGILEX-I 2957BGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.7M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2957-BFBGA Exposed Pad
  • Supplier Device Package: 2957-BGA (56x45)
Paquete: -
Request a Quote