Imagen |
Nº de pieza |
Fabricantes |
Descripción |
Paquete |
En existencias |
Cantidad |
Current - Supply | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC LDO VREG/LIN TXRX DSO-28
|
Paquete: 28-SOIC (0.295", 7.50mm Width) |
En existencias3.024 |
|
- | 3.9 V ~ 27 V | -40°C ~ 150°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | PG-DSO-28 |
||
Active-Semi International Inc. |
IC PMU MULTIFUNCTION
|
Paquete: - |
En existencias3.712 |
|
- | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC WIRELESS PWR RECEIVER
|
Paquete: - |
En existencias4.640 |
|
- | - | - | - | - | - |
||
Maxim Integrated |
IC SMART CARD LEVEL SHIFT 28SOIC
|
Paquete: 28-SOIC (0.295", 7.50mm Width) |
En existencias3.888 |
|
- | 2.7 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SO |
||
Maxim Integrated |
IC DVR MEMS ACT/SHUTTER WLP
|
Paquete: - |
En existencias6.624 |
|
- | - | - | - | - | - |
||
Texas Instruments |
IC BOOST CONV DUAL-OUT 16-TSSOP
|
Paquete: 16-TSSOP (0.173", 4.40mm Width) |
En existencias18.432 |
|
10µA | 1.8 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
NXP |
IC IGNITION HI ENERGY 8-SOIC
|
Paquete: 8-SOIC (0.154", 3.90mm Width) |
En existencias5.136 |
|
- | 4 V ~ 24 V | - | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Infineon Technologies |
ENGINECONTR
|
Paquete: 24-LSSOP (0.154", 3.90mm Width) Exposed Pad |
En existencias6.480 |
|
- | 6 V ~ 18 V | -40°C ~ 150°C | Surface Mount | 24-LSSOP (0.154", 3.90mm Width) Exposed Pad | PG-SSOP-24 |
||
IDT, Integrated Device Technology Inc |
IC PMIC PWR MGMT MULTI-CH 100QFN
|
Paquete: 100-WQFN Dual Rows, Exposed Pad |
En existencias7.888 |
|
- | 4.5 V ~ 5.5 V | - | Surface Mount | 100-WQFN Dual Rows, Exposed Pad | 100-VFQFPN (8x8) |
||
Linear Technology |
IC PWR MANAGEMENT HANDHELD 44QFN
|
Paquete: 44-PowerWFQFN |
En existencias3.584 |
|
- | 4.35 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 44-PowerWFQFN | 44-QFN (4x7) |
||
Linear Technology |
IC ENERGY HARVESTING PSU 10MSOP
|
Paquete: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad |
En existencias5.440 |
|
950nA | 2.7 V ~ 20 V | -40°C ~ 125°C | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad | 10-MSOP-EP |
||
NXP |
IC SBC HIGH SPEED CAN 5V 32SOIC
|
Paquete: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad |
En existencias4.528 |
|
2mA | 5.5 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 32-BSSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC |
||
Diodes Incorporated |
HEATER CONTROLLER PDIP-8
|
Paquete: - |
En existencias2.976 |
|
- | - | - | - | - | - |
||
Texas Instruments |
IC DDR TERMINATION REG 8SOPWRPAD
|
Paquete: 8-PowerSOIC (0.154", 3.90mm Width) |
En existencias276.924 |
|
320µA | 2.2 V ~ 5.5 V | 0°C ~ 125°C | Surface Mount | 8-PowerSOIC (0.154", 3.90mm Width) | 8-SO PowerPad |
||
Infineon Technologies |
IC ACTIVE BIAS CONTROLLER SOT343
|
Paquete: SC-82A, SOT-343 |
En existencias130.446 |
|
- | 1.6 V ~ 18 V | - | Surface Mount | SC-82A, SOT-343 | PG-SOT343-4 |
||
NXP |
SYSTEM BASIS CHIP DCDC 2.2A VCO
|
Paquete: 48-LQFP Exposed Pad |
En existencias7.596 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
Diodes Incorporated |
HEATER CONTROLLER DIP-8
|
Paquete: - |
En existencias2.832 |
|
- | 4 V ~ 5.5 V | -20°C ~ 85°C (TA) | - | - | - |
||
NXP |
IC WIRELESS PWR TX 96KB LQFP48
|
Paquete: 48-LQFP |
En existencias12.612 |
|
1.7mA | 3V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
Analog Devices Inc./Maxim Integrated |
3A AUTOMOTIVE HI-SPEED USB PROTE
|
Paquete: - |
Request a Quote |
|
572µA | 3V ~ 5.5V, 4.75V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 16-WQFN Exposed Pad | 16-TQFN (4x4) |
||
Skyworks Solutions Inc. |
POWER ISOLATION
|
Paquete: - |
En existencias288 |
|
6.9mA | 3V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
NXP |
SAFETY SBC FOR S32S2 MCU
|
Paquete: - |
Request a Quote |
|
- | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
Texas Instruments |
PROTOTYPE
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - |
||
Diodes Incorporated |
IC
|
Paquete: - |
Request a Quote |
|
600µA | 2.5V ~ 18V | -40°C ~ 105°C (TA) | Surface Mount | SOT-23-6 | SOT-26 |
||
Analog Devices Inc. |
IC COMPACT PMU 64WLCSP
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - |
||
Renesas Electronics Corporation |
P9242-GNDGI8
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - |
||
NXP |
POWER MANAGEMENT IC, I.MX 8, I.M
|
Paquete: - |
Request a Quote |
|
10µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 48-VFQFN Exposed Pad | 48-HVQFN (7x7) |
||
NXP |
FS8510
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - |
||
Skyworks Solutions Inc. |
POWER ISOLATION
|
Paquete: - |
En existencias252 |
|
6.9mA | 3V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.295", 7.50mm Width) | 8-SOIC |