Imagen |
Nº de pieza |
Fabricantes |
Descripción |
Paquete |
En existencias |
Cantidad |
Current - Supply | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
IC WIRELESS PWR RECEIVER
|
Paquete: 79-UFBGA, DSBGA |
En existencias3.760 |
|
- | - | - | Surface Mount | 79-UFBGA, DSBGA | 79-DSBGA (4.06x3.90) |
||
Texas Instruments |
IC PWR/BATT MGMT 155DSBGA
|
Paquete: 155-UFBGA, DSBGA |
En existencias3.488 |
|
20µA | 2.5 V ~ 4.8 V | -40°C ~ 85°C | Surface Mount | 155-UFBGA, DSBGA | 155-DSBGA (5.21x5.36) |
||
Maxim Integrated |
IC CTLR AUTO BOOST MULTI TSSOP
|
Paquete: - |
En existencias5.584 |
|
- | - | - | - | - | - |
||
Maxim Integrated |
IC SCAN DVR DUAL HV 32-TQFN
|
Paquete: 32-WFQFN Exposed Pad |
En existencias7.056 |
|
- | - | -40°C ~ 85°C | Surface Mount | 32-WFQFN Exposed Pad | 32-TQFN-EP (5x5) |
||
ON Semiconductor |
IC DRVR DARL ALT REG VOLT 14SOIC
|
Paquete: 14-SOIC (0.154", 3.90mm Width) |
En existencias2.544 |
|
12mA | 9 V ~ 17 V | -40°C ~ 125°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
Texas Instruments |
IC LI-ION PATT/PWR MGMT 169BGA
|
Paquete: 169-LFBGA |
En existencias238.656 |
|
- | - | - | Surface Mount | 169-LFBGA | 169-BGA MicroStar (12x12) |
||
Maxim Integrated |
IC DCDC CONV STPDN DL LDO 20TQFN
|
Paquete: 20-WQFN Exposed Pad |
En existencias5.968 |
|
- | 3.7 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 20-WQFN Exposed Pad | 20-TQFN-EP (5x5) |
||
Diodes Incorporated |
IRON CONTROLLER SO-8
|
Paquete: - |
En existencias6.736 |
|
- | - | - | - | - | - |
||
Maxim Integrated |
IC PWR SUPPLY W/VCOM AMP 48TQFN
|
Paquete: 48-WFQFN Exposed Pad |
En existencias35.064 |
|
8.5mA | 8 V ~ 16.5 V | -40°C ~ 85°C | Surface Mount | 48-WFQFN Exposed Pad | 48-TQFN (7x7) |
||
Infineon Technologies |
IC XPHASE3 CONTROL HYBRD 40-MLPQ
|
Paquete: 40-VFQFN Exposed Pad |
En existencias2.288 |
|
- | - | - | Surface Mount | 40-VFQFN Exposed Pad | 40-MLPQ (6x6) |
||
NXP |
SYSTEM BASIS CHIP LINEAR 0.5A V
|
Paquete: 48-LQFP Exposed Pad |
En existencias4.960 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
Linear Technology |
10A LOW VLTG SYNCH STEP-DWN SILN
|
Paquete: - |
En existencias5.712 |
|
- | - | - | - | - | - |
||
Maxim Integrated |
PMIC BUCK BOOST LDO SWITCH 30WLP
|
Paquete: 30-WFBGA, WLBGA |
En existencias5.184 |
|
40µA | 2.7 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 30-WFBGA, WLBGA | 30-WLP (2.75x2.15) |
||
Active-Semi International Inc. |
POWER LOSS PROTECTION WITH 6A EF
|
Paquete: 28-PowerVFQFN |
En existencias25.938 |
|
5.5mA | 2.7 V ~ 8 V | -40°C ~ 105°C | Surface Mount | 28-PowerVFQFN | 28-FCQFN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC WIRELESS RECEIVER 36WLCSP
|
Paquete: - |
En existencias5.696 |
|
- | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC WIRELESS PWR RECEIVER 36-WLCS
|
Paquete: - |
En existencias3.664 |
|
- | - | 0°C ~ 85°C | - | - | - |
||
NXP |
IC SBCS CAN HIGH SPEED 48HTQFP
|
Paquete: - |
En existencias4.784 |
|
- | - | - | - | - | - |
||
NXP |
POWER MANAGEMENT IC, PRE-PROG, 3
|
Paquete: - |
Request a Quote |
|
40µA | 2.7V ~ 5.5V | -40°C ~ 150°C (TJ) | Surface Mount, Wettable Flank | 40-VFQFN Exposed Pad | 40-HVQFN (6x6) |
||
Analog Devices Inc./Maxim Integrated |
PMIC FOR 2-CELL PORTABLE APPLICA
|
Paquete: - |
Request a Quote |
|
100µA | 3.6V ~ 14V | -40°C ~ 85°C (TA) | Surface Mount | 56-WFQFN Exposed Pad | 56-TQFN (8x8) |
||
Intersil |
POWER MANAGEMENT CIRCUIT, PQCC36
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - |
||
NXP |
SYSTEM BASIS CHIP, DCDC 2.2A VCO
|
Paquete: - |
Request a Quote |
|
- | 1V ~ 5V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-HLQFP (7x7) |
||
Analog Devices Inc./Maxim Integrated |
QUAD TFT/LCD DC-DC CONVERTER
|
Paquete: - |
Request a Quote |
|
600µA | 2.7V ~ 5.5V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
Analog Devices Inc./Maxim Integrated |
TWO-OUTPUT BUCK CONTROLLER FOR A
|
Paquete: - |
Request a Quote |
|
1.1mA | 3V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 32-WFQFN Exposed Pad | 32-TQFN (5x5) |
||
NXP |
SYSTEM BASIS CHIP, LINEAR 0.5A V
|
Paquete: - |
Request a Quote |
|
- | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-HLQFP (7x7) |
||
Renesas Electronics Corporation |
P9242-G3NDGI8
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - |
||
Texas Instruments |
IC POWER
|
Paquete: - |
Request a Quote |
|
200µA (Max) | 5.5V ~ 26V | -40°C ~ 125°C (TA) | Surface Mount | 24-VFQFN Exposed Pad | 25-VQFN-HR (3.5x4.5) |
||
NXP |
SYSTEM BASIS CHIP, DCDC 1.5A VCO
|
Paquete: - |
Request a Quote |
|
- | 1V ~ 5V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-HLQFP (7x7) |
||
Texas Instruments |
PMU FOR PROCESSOR
|
Paquete: - |
En existencias750 |
|
1.5mA | 3.135V ~ 5.25V | -40°C ~ 105°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | 48-VQFN (7x7) |