Imagen |
Nº de pieza |
Fabricantes |
Descripción |
Paquete |
En existencias |
Cantidad |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC LINE INTERFACE SLIC PDSO-24
|
Paquete: 24-SOIC (0.295", 7.50mm Width) |
En existencias5.232 |
|
- | 1 | 5V | 2.8mA | 290mW | -40°C ~ 85°C | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | PG-DSO-24 |
||
Microsemi Corporation |
IC VOICEPORT 2CH FXS 8KHZ 80LQFP
|
Paquete: 80-LQFP |
En existencias3.136 |
|
PCM | 2 | - | - | - | - | Surface Mount | 80-LQFP | 80-eLQFP |
||
Microsemi Corporation |
IC DGTL SWITCH F8KDX 196BGA
|
Paquete: 196-BGA |
En existencias6.160 |
|
- | 1 | 3 V ~ 3.6 V | 160mA | - | -40°C ~ 85°C | Surface Mount | 196-BGA | 196-PBGA (15x15) |
||
Cypress Semiconductor Corp |
IC TXRX HOTLINK II DUAL 196LBGA
|
Paquete: 196-LBGA |
En existencias3.280 |
|
LVTTL | 2 | 3.135 V ~ 3.465 V | 570mA | - | 0°C ~ 70°C | Surface Mount | 196-LBGA | 196-FBGA (15x15) |
||
Maxim Integrated |
IC CTRLR HDLC 256-CHANNEL 256BGA
|
Paquete: 256-BGA |
En existencias5.360 |
|
Serial | - | 3 V ~ 3.6 V | 500mA | - | 0°C ~ 70°C | Surface Mount | 256-BGA | 256-BGA (27x27) |
||
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 28DFN
|
Paquete: 28-VDFN Exposed Pad |
En existencias3.472 |
|
- | 1 | 4.5 V ~ 5.5 V | 700µA | 10.5W | -40°C ~ 110°C | Surface Mount | 28-VDFN Exposed Pad | 28-DFN |
||
Maxim Integrated |
IC TXRX T1 1-CHIP 3.3V 100-BGA
|
Paquete: 100-LFBGA, CSPBGA |
En existencias5.584 |
|
HDLC, T1 | 1 | 3.14 V ~ 3.47 V | 75mA | - | 0°C ~ 70°C | Surface Mount | 100-LFBGA, CSPBGA | 100-CSBGA (10x10) |
||
Silicon Labs |
IC PROSLIC FXS DUAL -114V 60QFN
|
Paquete: 60-WFQFN Exposed Pad |
En existencias5.520 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 60-WFQFN Exposed Pad | 60-QFN (8x8) |
||
Microsemi Corporation |
IC SLIC 2CH 53DB 44TQFP
|
Paquete: 44-TQFP Exposed Pad |
En existencias501.816 |
|
2-Wire | 2 | 4.75 V ~ 5.25 V | - | - | -40°C ~ 85°C | Surface Mount | 44-TQFP Exposed Pad | 44-TQFP-EP (10x10) |
||
Microsemi Corporation |
IC VOICEPORT 2CH FXS 8KHZ 80LQFP
|
Paquete: 80-LQFP |
En existencias9.060 |
|
PCM | 2 | 4.75 V ~ 35 V | - | - | - | Surface Mount | 80-LQFP | 80-eLQFP |
||
Microsemi Corporation |
TEMAP 84FDL GREEN DUAL PASSIVATI
|
Paquete: - |
En existencias7.360 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
32 CHANNEL T1/E1 FRAMER
|
Paquete: - |
En existencias7.408 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC SWITCH ETHERNET 12-PORT
|
Paquete: 672-BGA |
En existencias7.072 |
|
- | 1 | 1V | - | - | - | Surface Mount | 672-BGA | 672-HSBGA (27x27) |
||
Broadcom Limited |
DUAL CORE
|
Paquete: - |
En existencias7.248 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC DIGITAL SWITCH 32K CH 484BGA
|
Paquete: 484-BGA |
En existencias6.240 |
|
- | 1 | 1.71V ~ 1.89V | 500mA | - | -40°C ~ 85°C | Surface Mount | 484-BGA | 484-PBGA (23x23) |
||
Microchip Technology |
ARROW 2XGE
|
Paquete: 896-BGA |
En existencias2.528 |
|
GMII, SerDes | 2 | 1.8V | - | - | -40°C ~ 85°C | Surface Mount | 896-BGA | 896-FCBGA |
||
Microchip Technology |
IC VOICE LINE VCP 32CH 128TQFP
|
Paquete: - |
En existencias5.456 |
|
2-Wire | 32 | 3.3V | - | - | - | Surface Mount | - | 128-TQFP |
||
Microchip Technology |
IC SLIC 2CH 53DB 44TQFP
|
Paquete: 44-TQFP Exposed Pad |
En existencias3.376 |
|
2-Wire | 2 | 4.75V ~ 5.25V | - | - | -40°C ~ 85°C | Surface Mount | 44-TQFP Exposed Pad | 44-TQFP-EP (10x10) |
||
Microchip Technology |
ARROW 2488, PB FREE
|
Paquete: - |
En existencias6.800 |
|
- | - | - | - | - | - | - | - | - |
||
Analog Devices Inc./Maxim Integrated |
1 LINE INTERFACE UNIT
|
Paquete: - |
Request a Quote |
|
- | 1 | 4.75V ~ 5.25V | 155mA | 930 mW | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
||
Infineon Technologies |
BIPOLAR SLIC, 2-4 CONVERSION
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
NETWORK TERMINATION CONTROLLER
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Zarlink |
ZARLINK PLD
|
Paquete: - |
Request a Quote |
|
- | - | 3.75V | 3.5mA | - | -40°C ~ 85°C | Surface Mount | 100-QFP | 100-QFP |
||
Infineon Technologies |
ISDN D-CHANNEL EXCH. CONTROLLER
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Analog Devices Inc./Maxim Integrated |
DS2153 E1 SINGLE-CHIP TRANSCVR
|
Paquete: - |
Request a Quote |
|
E1 | 1 | 4.75V ~ 5.25V | 65mA | - | 0°C ~ 70°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Infineon Technologies |
PEF3452 - LINE INTERFACE UNIT FO
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
IP PHONE CHIP
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Harris Corporation |
3 REN RINGING SLIC FOR ISDN MODE
|
Paquete: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | 4.75V ~ 5.25V | 6mA | 300 mW | 0°C ~ 70°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |