Imagen |
Nº de pieza |
Fabricantes |
Descripción |
Paquete |
En existencias |
Cantidad |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC NETWORK TERMINATOR PDSO-20
|
Paquete: 20-SOIC (0.433", 11.00mm Width) Exposed Pad |
En existencias4.896 |
|
ISDN | 1 | - | 700µA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.433", 11.00mm Width) Exposed Pad | P-DSO-20 |
||
Exar Corporation |
IC JITTER ATTENUATOR 4CH 80TQFP
|
Paquete: 80-LQFP |
En existencias2.384 |
|
Serial | 1 | 3.135 V ~ 5.25 V | 140mA | - | -40°C ~ 85°C | Surface Mount | 80-LQFP | 80-TQFP (14x14) |
||
Microsemi Corporation |
IC DIGITAL SWITCH 32K CH 484BGA
|
Paquete: 484-BGA |
En existencias2.960 |
|
- | 1 | 1.71 V ~ 1.89 V | 500mA | - | -40°C ~ 85°C | Surface Mount | 484-BGA | 484-PBGA (23x23) |
||
Silicon Labs |
IC PROSLIC FXS DUAL -110V 50QFN
|
Paquete: - |
En existencias4.944 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | - | Surface Mount | - | 50-QFN (6x8) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CBSGA
|
Paquete: 144-BGA, CSPBGA |
En existencias2.512 |
|
LIU | 3 | 3.135 V ~ 3.465 V | 220mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Maxim Integrated |
IC LIU NRZ-CMI CONV 155M 56-QFN
|
Paquete: 56-VFQFN Exposed Pad |
En existencias6.272 |
|
- | 1 | 3.15 V ~ 3.45 V | - | - | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (7x7) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 484-BGA
|
Paquete: 484-BGA |
En existencias7.104 |
|
LIU | 1 | 3.135 V ~ 3.465 V | 150mA | - | 0°C ~ 70°C | Surface Mount | 484-BGA | 484-BGA (23x23) |
||
Silicon Labs |
IC SLIC/CODEC DUAL-CH 64TQFP
|
Paquete: 64-TQFP |
En existencias281.400 |
|
GCI, PCM, SPI | 2 | 3.3V, 5V | 65mA | 941mW | 0°C ~ 70°C | Surface Mount | 64-TQFP | 64-TQFP (10x10) |
||
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 16MLP
|
Paquete: 16-VDFN Exposed Pad |
En existencias3.552 |
|
- | 1 | 4.5 V ~ 5.5 V | 1.3mA | 10mW | -40°C ~ 110°C | Surface Mount | 16-VDFN Exposed Pad | 16-MLP (7x6) |
||
IXYS Integrated Circuits Division |
IC TONE DETECTOR PREC 20-SOIC
|
Paquete: 20-SOIC (0.295", 7.50mm Width) |
En existencias5.552 |
|
- | 1 | 2.7 V ~ 5.5 V | 15mA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Silicon Labs |
IC PROSLIC FXS 1CH -136V 42QFN
|
Paquete: 42-WFQFN Exposed Pad |
En existencias2.592 |
|
- | - | - | - | - | - | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
IXYS Integrated Circuits Division |
IC DC TERMINATION 16-SOIC
|
Paquete: 16-SOIC (0.295", 7.50mm Width) |
En existencias51.012 |
|
ISDN, SHDSL | 1 | - | - | 1W | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Infineon Technologies |
IC CONTROLLER INTERFACE 388-BGA
|
Paquete: 388-BBGA |
En existencias7.136 |
|
HDLC, PPP, Serial, TMA | - | 3 V ~ 3.6 V | 200mA | 3W | 0°C ~ 70°C | Surface Mount | 388-BBGA | 388-BGA (35x35) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 SGL 44TQFP
|
Paquete: 44-LQFP |
En existencias16.884 |
|
LIU | 1 | 4.75 V ~ 5.25 V | 180mA | - | -40°C ~ 85°C | Surface Mount | 44-LQFP | 44-TQFP (10x10) |
||
Microsemi Corporation |
MODULE SONET/SDH
|
Paquete: - |
En existencias3.584 |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
INTEGRATED GBE CONTROLLER
|
Paquete: - |
En existencias2.752 |
|
- | - | - | - | - | - | - | - | - |
||
Renesas Electronics America |
IC LINE DRIVER VDSL2 DIFF 16QFN
|
Paquete: 16-TQFN Exposed Pad |
En existencias7.344 |
|
- | 1 | ±4 V ~ 6.6 V, 8 V ~ 13.2 V | - | - | -40°C ~ 85°C | Surface Mount | 16-TQFN Exposed Pad | 16-QFN (4x4) |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
Paquete: - |
En existencias5.136 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC SLIC 1CH P RV 32PLCC
|
Paquete: 32-LCC (J-Lead) |
En existencias3.680 |
|
2-Wire | 1 | 4.75V ~ 5.25V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Microchip Technology |
IC DGTL SWITCH 2048X2048 100MQFP
|
Paquete: 100-BQFP |
En existencias4.848 |
|
- | 1 | 3V ~ 3.6V | 45mA | - | -40°C ~ 85°C | Surface Mount | 100-BQFP | 100-MQFP (14x20) |
||
Microchip Technology |
IC SUBSCRIBER NETWRK DNIC 28PLCC
|
Paquete: 28-LCC (J-Lead) |
En existencias7.504 |
|
- | 1 | 4.75V ~ 5.25V | 10mA | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC TXRX DTMF 28PLCC
|
Paquete: 28-LCC (J-Lead) |
En existencias4.240 |
|
- | 1 | 4.75V ~ 5.25V | 7mA | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
||
Microchip Technology |
IC SLIC 2CH UNIV 150V 48QFN
|
Paquete: 48-VFQFN Exposed Pad |
En existencias2.448 |
|
4-Wire | 2 | 3.135V ~ 3.465V | 25mA | - | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Microchip Technology |
IC SLIC 1CH UNIV 100V 48QFN
|
Paquete: 48-VFQFN Exposed Pad |
En existencias4.944 |
|
PCM, SPI | 1 | 3.135V ~ 3.465V | 25mA | - | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Infineon Technologies |
TELECOM IC
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
N225P WH 2 X 25G OCP 3.0 GENERIC
|
Paquete: - |
Request a Quote |
|
PCI | 2 | 3.3V, 12V | - | - | - | - | - | - |
||
Harris Corporation |
ITU CO/PABX SLIC
|
Paquete: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | 4.75V ~ 5.25V | 5.5mA | 1.5 W | 0°C ~ 70°C | Through Hole | 22-DIP (0.400", 10.16mm) | 22-PDIP |
||
Broadcom Limited |
MAP/AP-ONLY
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |