Imagen |
Nº de pieza |
Fabricantes |
Descripción |
Paquete |
En existencias |
Cantidad |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC NETWORK TERMINATOR PDSO-20
|
Paquete: 20-SOIC (0.433", 11.00mm Width) Exposed Pad |
En existencias4.320 |
|
ISDN | 1 | - | 700µA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.433", 11.00mm Width) Exposed Pad | P-DSO-20 |
||
Infineon Technologies |
IC LINE INTERFACE SLIC PLCC-28
|
Paquete: 28-LCC (J-Lead) |
En existencias3.056 |
|
- | 1 | 5V | 2.8mA | 730mW | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | P/PG-LCC-28 |
||
NXP |
IC VOIP PROCESSOR 8CH 672BGA
|
Paquete: 672-BGA |
En existencias3.360 |
|
- | - | - | - | - | - | Surface Mount | 672-BGA | 672-TEPBGA (27x27) |
||
NXP |
IC C1K 450MHZ VOIP 448BGA
|
Paquete: - |
En existencias3.824 |
|
- | - | - | - | - | - | - | - | - |
||
Maxim Integrated |
IC LIU E1/T1/J1 3.3V 256CSBGA
|
Paquete: 256-LBGA, CSBGA |
En existencias5.152 |
|
LIU | 16 | 3.135 V ~ 3.465 V | 500mA | - | 0°C ~ 70°C | Surface Mount | 256-LBGA, CSBGA | 256-CSBGA (17x17) |
||
Silicon Labs |
IC LINE-SIDE DAA 16TSSOP
|
Paquete: 16-TSSOP (0.173", 4.40mm Width) |
En existencias6.384 |
|
GCI, PCM, SPI | 1 | 3 V ~ 3.6 V | 8.5mA | - | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
IXYS Integrated Circuits Division |
IC TONE DETECTOR PREC 20-SOIC
|
Paquete: 20-SOIC (0.295", 7.50mm Width) |
En existencias5.952 |
|
- | 1 | 2.7 V ~ 5.5 V | 15mA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 2CH 100TQFP
|
Paquete: 100-LQFP |
En existencias7.776 |
|
LIU | 1 | 3.135 V ~ 3.465 V | 210mA | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Microsemi Corporation |
IC TDM SWITCH 2K-CH ENH 256LQFP
|
Paquete: 256-LQFP |
En existencias4.240 |
|
- | 1 | 1.71 V ~ 1.89 V | 120mA | - | -40°C ~ 85°C | Surface Mount | 256-LQFP | 256-LQFP (28x28) |
||
Silicon Labs |
IC ENH FCC+ LINE-SIDE 16SOIC
|
Paquete: - |
En existencias7.568 |
|
- | - | - | - | - | - | - | - | - |
||
Silicon Labs |
IC PROSLIC FXS DUAL -140V 50QFN
|
Paquete: - |
En existencias7.488 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | - | Surface Mount | - | 50-QFN (6x8) |
||
Microsemi Corporation |
IC TXRX SGL E1 W/LIU 68PLCC
|
Paquete: 68-LCC (J-Lead) |
En existencias17.940 |
|
- | 1 | 4.75 V ~ 5.25 V | 150mA | - | -40°C ~ 85°C | Surface Mount | 68-LCC (J-Lead) | 68-PLCC (24.23x24.23) |
||
Texas Instruments |
IC VDSL2 LINE DVR AMP
|
Paquete: 24-VFQFN Exposed Pad |
En existencias15.948 |
|
- | 1 | 10 V ~ 28 V | 21mA | - | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-VQFN (5x4) |
||
Maxim Integrated |
IC TXRX T1 1-CHIP 5V 100-LQFP
|
Paquete: 100-LQFP |
En existencias5.296 |
|
E1, HDLC, J1, T1 | 1 | 4.75 V ~ 5.25 V | 75mA | - | 0°C ~ 70°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Maxim Integrated |
IC MUX TEMPE T3/E3 256-BGA
|
Paquete: 256-BGA |
En existencias7.120 |
|
Parallel/Serial | - | 3.135 V ~ 3.465 V | 150mA | - | 0°C ~ 70°C | Surface Mount | 256-BGA | 256-PBGA (27x27) |
||
Microsemi Corporation |
FOUR CHANNEL COMBINED T1/E1/J1 T
|
Paquete: 256-BGA |
En existencias6.336 |
|
E1, J1, SPI, T1 | 4 | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-CABGA (17x17) |
||
Microsemi Corporation |
VS9802:7% OH 100G CI-BCH-3
|
Paquete: - |
En existencias3.936 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
10GBE WAN/LAN/BACKPLANE XAUI TO
|
Paquete: - |
En existencias5.088 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
COMBINED T1/E1 FRAMER/TRANSCEIVE
|
Paquete: 81-LFBGA |
En existencias3.472 |
|
E1, J1, T1 | - | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 81-LFBGA | 81-CABGA (9x9) |
||
Microchip Technology |
IC ETHERNET 1-PORT 135QFN
|
Paquete: - |
En existencias3.440 |
|
Ethernet | 1 | 3.3V | - | - | - | Surface Mount | - | 135-QFN (12x12) |
||
Microchip Technology |
IC TXRX DTMF 3V 24DIP
|
Paquete: 24-DIP (0.300", 7.62mm) |
En existencias4.880 |
|
- | 1 | 2.7V ~ 3.6V | 3.1mA | - | -40°C ~ 85°C | Through Hole | 24-DIP (0.300", 7.62mm) | 24-PDIP |
||
Microchip Technology |
IC SYNCHRONIZER T1/E1 28PLCC
|
Paquete: 28-LCC (J-Lead) |
En existencias4.816 |
|
- | - | 4.5V ~ 5.5V | 60mA | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
||
Microchip Technology |
PB FREE MULTITRUNK SYSTEM SYNCHR
|
Paquete: - |
En existencias20.880 |
|
- | - | - | - | - | - | - | - | - |
||
MaxLinear, Inc. |
DATA COMM PEF41078VV11 VQFN48 SL
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Harris Corporation |
SLIC, 2-4 CONVERSION, BIPOLAR, P
|
Paquete: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | -36V ~ -58V, 4.75V ~ 5.25V, 10.8V ~ 13.2V | - | 550 mW | 0°C ~ 75°C | Through Hole | 24-DIP (0.600", 15.24mm) | 24-PDIP |
||
Infineon Technologies |
TELEPHONY INTERFACE CIRCUIT
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
SPECTRA 4X155 SONET/SDH Payload
|
Paquete: - |
Request a Quote |
|
Bus | 1 | 3.14V ~ 3.47V | 860mA | - | -40°C ~ 85°C | Surface Mount | 520-LBGA Exposed Pad | 520-SBGA (40x40) |
||
Zarlink |
ZARLINK UCC81174D
|
Paquete: - |
Request a Quote |
|
- | - | 3.75V | 0.063mA | - | -30°C ~ 85°C | Surface Mount | - | 28-SOP |