Imagen |
Nº de pieza |
Fabricantes |
Descripción |
Paquete |
En existencias |
Cantidad |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi Corporation |
IC VOICEPORT 2CH FXS 8KHZ 80LQFP
|
Paquete: 80-LQFP |
En existencias6.288 |
|
PCM | 2 | - | - | - | - | Surface Mount | 80-LQFP | 80-eLQFP |
||
Microsemi Corporation |
IC VOICE ECHO CANCEL 8CH 208LBGA
|
Paquete: 208-LBGA |
En existencias6.384 |
|
- | 1 | 1.6 V ~ 2 V | 22mA | - | -40°C ~ 85°C | Surface Mount | 208-LBGA | 208-LBGA (17x17) |
||
Microsemi Corporation |
IC SLIC 2CH MTRG 44TQFP
|
Paquete: - |
En existencias112.572 |
|
2-Wire | - | - | - | - | - | - | - | - |
||
Maxim Integrated |
IC TXRX QUAD T1/E1 BGA
|
Paquete: 256-BGA |
En existencias4.736 |
|
E1 | 4 | 3.3V | - | - | - | Surface Mount | 256-BGA | 256-BGA (27x27) |
||
Cypress Semiconductor Corp |
IC TXRX HOTLINK 100-LBGA
|
Paquete: 100-LBGA |
En existencias4.832 |
|
LVTTL | - | 3.135 V ~ 3.465 V | 390mA | - | 0°C ~ 70°C | Surface Mount | 100-LBGA | 100-TBGA (11x11) |
||
Maxim Integrated |
IC RECEIVE BUFFER T1 28-PLCC
|
Paquete: 28-LCC (J-Lead) |
En existencias5.360 |
|
TDM | 1 | - | 5mA | - | 0°C ~ 70°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
STMicroelectronics |
IC RINGER ELECTRONIC 2TONE 8-SO
|
Paquete: 8-SOIC (0.154", 3.90mm Width) |
En existencias267.492 |
|
- | 1 | 26V | 30mA | - | -40°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
||
IXYS Integrated Circuits Division |
IC RELAY OPTO 120MA 8SOIC
|
Paquete: 8-SOIC (0.154", 3.90mm Width) |
En existencias4.832 |
|
- | 2 | - | - | 800mW | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Maxim Integrated |
IC TESTER BIT ERROR RATE 32-TQFP
|
Paquete: 32-TQFP |
En existencias14.496 |
|
T1 | 1 | 4.5 V ~ 5.5 V | 10mA | - | -40°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Texas Instruments |
IC ADAPTER DIG QDASL QUAD 28PLCC
|
Paquete: 28-LCC (J-Lead) |
En existencias6.640 |
|
ISDN | 1 | - | 20mA | - | - | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microsemi Corporation |
IC CODEC U-LAW CCITT PCM 18DIP
|
Paquete: 18-DIP (0.300", 7.62mm) |
En existencias7.584 |
|
PCM | 1 | 4.75 V ~ 5.25 V | 3mA | - | 0°C ~ 70°C | Through Hole | 18-DIP (0.300", 7.62mm) | 18-PDIP |
||
Microsemi Corporation |
IC SLIC 2CH 63DB 44TQFP
|
Paquete: 44-TQFP Exposed Pad |
En existencias5.072 |
|
2-Wire | 2 | 4.75 V ~ 5.25 V | - | - | -40°C ~ 85°C | Surface Mount | 44-TQFP Exposed Pad | 44-TQFP-EP (10x10) |
||
Silicon Labs |
IC SLIC/CODEC PROG 38TSSOP
|
Paquete: 38-TFSOP (0.173", 4.40mm Width) |
En existencias363.708 |
|
PCM, SPI | 1 | 3.3V, 5V | 88mA | 700mW | -40°C ~ 85°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
Microsemi Corporation |
IC CNIC CIDCW CWD CID 20SOIC
|
Paquete: 20-SOIC (0.295", 7.50mm Width) |
En existencias3.712 |
|
3-Wire | 1 | 2.7 V ~ 5.5 V | 4.3mA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microsemi Corporation |
IC CNIC2 CLIP CID CIDCW 24SOIC
|
Paquete: 24-SOIC (0.295", 7.50mm Width) |
En existencias32.808 |
|
3-Wire | 1 | 2.7 V ~ 5.5 V | 4.7mA | - | -40°C ~ 85°C | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC |
||
Silicon Labs |
IC VOICE DAA SYSTEM SIDE 24QFN
|
Paquete: 24-WFQFN Exposed Pad |
En existencias11.448 |
|
GCI, PCM, SPI | 1 | 3 V ~ 3.6 V | 8.5mA | - | 0°C ~ 70°C | Surface Mount | 24-WFQFN Exposed Pad | 24-QFN (4x4) |
||
Exar Corporation |
IC LIU E1 SGL 28SOJ
|
Paquete: 28-BSOJ (0.300", 7.62mm Width) |
En existencias17.868 |
|
LIU | 1 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 28-BSOJ (0.300", 7.62mm Width) | 28-SOJ |
||
Microsemi Corporation |
SONET/SDH INTERFACE FOR 622 & 15
|
Paquete: 196-BGA |
En existencias3.600 |
|
Serial | - | - | - | - | - | Surface Mount | 196-BGA | 196-CABGA (15x15) |
||
Microchip Technology |
IC DAA CHIPSET 1CHAN 10MSOP
|
Paquete: - |
En existencias3.360 |
|
- | 1 | - | - | - | - | Surface Mount | - | 10-MSOP |
||
Microchip Technology |
IC SOLAC FXS+FXO 1CH HV 48LQFP
|
Paquete: - |
En existencias6.176 |
|
PCM | 1 | - | - | - | - | Surface Mount | - | 48-LQFP |
||
Intersil |
SLIC, 2-4 CONVERSION, BIPOLAR
|
Paquete: - |
Request a Quote |
|
- | 1 | - | - | - | 0°C ~ 85°C | Surface Mount | 32-VQFN Exposed Pad | 32-QFN (7x7) |
||
Harris Corporation |
RINGING SLIC FAMILY
|
Paquete: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | -16V ~ -100V, 4.75V ~ 5.25V | 5mA | 310 mW | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Broadcom Limited |
VDSL 24-LINE 17A DSP W/DLV VECTO
|
Paquete: - |
Request a Quote |
|
DSP | 24 | - | - | - | - | - | - | - |
||
Intersil |
SLIC, 2-4 CONVERSION, BIPOLAR
|
Paquete: - |
Request a Quote |
|
- | 1 | - | - | - | 0°C ~ 75°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Broadcom Limited |
24P/35B DSL DSP
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Harris Corporation |
RINGING SLIC FOR ISDN MODEM
|
Paquete: - |
Request a Quote |
|
2-Wire, 4-Wire, ISDN | 1 | 4.75V ~ 5.25V | 6mA | 300 mW | 0°C ~ 75°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Broadcom Limited |
BACKHAUL ACCESS SWITCH. BLOWN
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
EPON/GPON GE PROCESSOR
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |