Imagen |
Nº de pieza |
Fabricantes |
Descripción |
Paquete |
En existencias |
Cantidad |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC SPEECH/VOICE INCA-P MQFP-144
|
Paquete: 144-BQFP |
En existencias6.832 |
|
IOM-2 | 1 | - | - | - | - | Surface Mount | 144-BQFP | PG-MQFP-144 |
||
Microsemi Corporation |
IC TDM SWITCH 4K-CH ENH 256BGA
|
Paquete: 256-BGA |
En existencias5.856 |
|
- | 1 | 1.71 V ~ 1.89 V | 130mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Microsemi Corporation |
IC CESOP PROCESSOR 64CH 324BGA
|
Paquete: 324-BGA |
En existencias4.688 |
|
TDM | 1 | 1.65 V ~ 1.95 V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Microsemi Corporation |
IC DGTL SWITCH RCDX 128MQFP
|
Paquete: 128-BQFP |
En existencias16.800 |
|
- | 1 | 3 V ~ 3.6 V | 52mA | - | -40°C ~ 85°C | Surface Mount | 128-BQFP | 128-PQFP (28x28) |
||
Maxim Integrated |
IC LIU T1/E1/J1 256CSBGA
|
Paquete: 256-LBGA, CSBGA |
En existencias4.032 |
|
LIU | 16 | 3.135 V ~ 3.465 V | 500mA | - | 0°C ~ 70°C | Surface Mount | 256-LBGA, CSBGA | 256-CSBGA (17x17) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 3CH 128LQFP
|
Paquete: 128-LQFP |
En existencias6.704 |
|
LIU | 3 | 3.135 V ~ 3.465 V | 410mA | - | -40°C ~ 85°C | Surface Mount | 128-LQFP | 128-LQFP (14x20) |
||
Maxim Integrated |
IC MICRODAA PCM HWY 42QFN
|
Paquete: 42-VFQFN Exposed Pad |
En existencias4.208 |
|
PCM, Serial, SPI | 1 | 3 V ~ 3.6 V | - | - | -40°C ~ 85°C | Surface Mount | 42-VFQFN Exposed Pad | 42-QFN (8x8) |
||
IDT, Integrated Device Technology Inc |
IC PCM CODEC 4CH MPI 3.3V 64TQFP
|
Paquete: 64-LQFP |
En existencias6.368 |
|
LIU | - | 3.135 V ~ 3.465 V | 50mA | - | -40°C ~ 85°C | Surface Mount | 64-LQFP | 64-TQFP (14x14) |
||
Maxim Integrated |
IC TESTER BIT ERROR RATE 32-TQFP
|
Paquete: 32-TQFP |
En existencias5.088 |
|
T1 | 1 | 4.5 V ~ 5.5 V | 10mA | - | -40°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
NXP |
IC PHONE TONE RINGER 2KHZ 8-DIP
|
Paquete: 8-DIP (0.300", 7.62mm) |
En existencias4.144 |
|
- | 1 | 5V | 20mA | 1W | -20°C ~ 60°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Maxim Integrated |
IC TXRX T1 1-CHIP 5V 100-BGA
|
Paquete: 100-LFBGA, CSPBGA |
En existencias4.656 |
|
E1, HDLC, J1, T1 | 1 | 4.75 V ~ 5.25 V | 75mA | - | 0°C ~ 70°C | Surface Mount | 100-LFBGA, CSPBGA | 100-CSBGA (10x10) |
||
Exar Corporation |
IC LIU SH T1/E1/J1 14CH 304TBGA
|
Paquete: 304-LBGA |
En existencias7.024 |
|
LIU | 14 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 304-LBGA | 304-TBGA (31x31) |
||
IDT, Integrated Device Technology Inc |
IC LINE INTERFACE UNIT 416BGA
|
Paquete: 416-BGA |
En existencias6.336 |
|
Parallel, Serial | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 416-BGA | 416-PBGA (27x27) |
||
Silicon Labs |
IC PROSLIC PCM/SPI -110V 42QFN
|
Paquete: 42-WFQFN Exposed Pad |
En existencias2.496 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Microsemi Corporation |
IC SLIC 2CH UNIV 100V 48QFN
|
Paquete: - |
En existencias6.112 |
|
Parallel | 2 | 3.3V | 40mA | - | - | Surface Mount | - | 48-QFN |
||
Microsemi Corporation |
IC CNIC CIDCW CID 20SOIC
|
Paquete: 20-SOIC (0.295", 7.50mm Width) |
En existencias5.552 |
|
4-Wire | 1 | 2.7 V ~ 5.5 V | 2.8mA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Maxim Integrated |
IC TXRX T1/E1/J1 100CSBGA
|
Paquete: 100-LFBGA, CSPBGA |
En existencias4.432 |
|
E1, HDLC, J1, T1 | 1 | 3.135 V ~ 3.465 V | 75mA | - | -40°C ~ 85°C | Surface Mount | 100-LFBGA, CSPBGA | 100-CSBGA (10x10) |
||
Microchip Technology |
32 LINK, 672 HDLC CHANNEL FRAME
|
Paquete: - |
En existencias5.088 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
20G VT/TU SWITCHING ELEMENT
|
Paquete: - |
En existencias5.184 |
|
Serial | 1 | - | - | - | - | Surface Mount | - | 672-FCBGA (27x27) |
||
Microchip Technology |
IC ECHO CANCELLER AEC 36SSOP
|
Paquete: 36-BSSOP (0.295", 7.50mm Width) |
En existencias4.832 |
|
Serial | 1 | 2.7V ~ 3.6V | 20mA | - | -40°C ~ 85°C | Surface Mount | 36-BSSOP (0.295", 7.50mm Width) | 36-SSOP |
||
Microchip Technology |
IC TXRX DTMF 3V 24SSOP
|
Paquete: 24-SSOP (0.209", 5.30mm Width) |
En existencias3.280 |
|
- | 1 | 2.7V ~ 3.6V | 3.1mA | - | -40°C ~ 85°C | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
Broadcom Limited |
SWITCH FABRIC
|
Paquete: - |
En existencias2.784 |
|
- | - | - | - | - | - | - | - | - |
||
NXP |
INTEGRATED CIRCUIT
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Intel |
ISDN CONTROLLER, 1-FUNC, CMOS, P
|
Paquete: - |
Request a Quote |
|
IOM-2 | 1 | 3.135V ~ 3.465V | 30mA | - | 0°C ~ 70°C | Surface Mount | 64-LQFP | P-TQFP-64-1 |
||
Agere Systems |
DS1/T1/E1/CEPT LINE INTERFACE
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Cirrus Logic Inc. |
OCTAL T1/E1/J1 LINE INTERFACE
|
Paquete: - |
Request a Quote |
|
E1, J1, T1 | 8 | 3.135V ~ 3.465V | - | 1.73 W | -40°C ~ 85°C | Surface Mount | 160-LBGA | 160-LFBGA (15x15) |
||
Broadcom Limited |
PHY 10GBE SFI-XFI EDC/LRM 144BGA
|
Paquete: - |
Request a Quote |
|
PHY, SFI, XFI | - | - | - | - | - | - | - | - |
||
Intel |
TELECOM CIRCUIT, 1-FUNC, CMOS, P
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |