Imagen |
Nº de pieza |
Fabricantes |
Descripción |
Paquete |
En existencias |
Cantidad |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC NETWORK TERMINATOR MQFP-64
|
Paquete: 64-QFP |
En existencias5.664 |
|
ISDN, SCI | 1 | 3.3V | 30mA | - | 0°C ~ 70°C | Surface Mount | 64-QFP | P-64-MQFP |
||
Microsemi Corporation |
IC DIGITAL SWITCH 16K CH 272BGA
|
Paquete: 272-BBGA |
En existencias5.376 |
|
- | 1 | 1.71 V ~ 1.89 V | 240mA | - | -40°C ~ 85°C | Surface Mount | 272-BBGA | 272-PBGA (27x27) |
||
Microsemi Corporation |
IC VOICE LINE VCP 32CH 144LBGA
|
Paquete: - |
En existencias16.764 |
|
2-Wire | 32 | 3.3V | - | - | - | Surface Mount | - | 144-LBGA |
||
Silicon Labs |
IC SLIC PROG 1-CH 38QFN
|
Paquete: 38-VFQFN Exposed Pad |
En existencias178.932 |
|
SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | - | Surface Mount | 38-VFQFN Exposed Pad | 38-QFN (5x7) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 3CH 128LQFP
|
Paquete: 128-LQFP |
En existencias4.944 |
|
LIU | 3 | 3.135 V ~ 3.465 V | 410mA | - | -40°C ~ 85°C | Surface Mount | 128-LQFP | 128-LQFP (14x20) |
||
Cypress Semiconductor Corp |
IC TXRX HOTLINK 196LBGA
|
Paquete: 196-LBGA |
En existencias5.104 |
|
LVTTL | 2 | 3.135 V ~ 3.465 V | 570mA | - | -40°C ~ 85°C | Surface Mount | 196-LBGA | 196-FBGA (15x15) |
||
Silicon Labs |
IC SLIC/CODEC 1CH 38QFN
|
Paquete: 38-VFQFN Exposed Pad |
En existencias2.112 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | 0°C ~ 70°C | Surface Mount | 38-VFQFN Exposed Pad | 38-QFN (5x7) |
||
Silicon Labs |
IC SLIC/CODEC 1CH 38TSSOP
|
Paquete: 38-TFSOP (0.173", 4.40mm Width) |
En existencias6.768 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | -40°C ~ 85°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
Maxim Integrated |
IC LIU T3/E3/STS-1 IND 49-BGA
|
Paquete: 49-LFBGA, CSPBGA |
En existencias6.288 |
|
LIU | 1 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 49-LFBGA, CSPBGA | 49-CSBGA (7x7) |
||
Microsemi Corporation |
IC TXRX SGL E1 W/LIU 100MQFP
|
Paquete: 100-BQFP |
En existencias6.368 |
|
- | 1 | 4.75 V ~ 5.25 V | 150mA | - | -40°C ~ 85°C | Surface Mount | 100-BQFP | 100-MQFP (14x20) |
||
Microsemi Corporation |
IC TRANSCODER ADPCM LP 28SOIC
|
Paquete: 28-SOIC (0.295", 7.50mm Width) |
En existencias7.104 |
|
- | 4 | 3 V ~ 3.6 V | 100µA | - | -40°C ~ 85°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Silicon Labs |
IC PROSLIC FXS DUAL -140V 50QFN
|
Paquete: - |
En existencias4.992 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | - | Surface Mount | - | 50-QFN (6x8) |
||
Silicon Labs |
IC SLIC/CODEC PROG 1CH 38QFN
|
Paquete: 38-VFQFN Exposed Pad |
En existencias2.256 |
|
PCM, SPI | 1 | 3.3V, 5V | 88mA | 700mW | -40°C ~ 85°C | Surface Mount | 38-VFQFN Exposed Pad | 38-QFN (5x7) |
||
Exar Corporation |
IC LIU SH T1/E1/J1 OCTAL 225BGA
|
Paquete: 225-BGA |
En existencias6.576 |
|
- | 8 | 3.14 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 225-BGA | 225-BGA (19x19) |
||
Texas Instruments |
IC SOURCE RINGER CONTR 28-SOIC
|
Paquete: 28-SOIC (0.295", 7.50mm Width) |
En existencias5.392 |
|
- | 1 | 5V | 500µA | - | -40°C ~ 85°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microsemi Solutions Sdn Bhd. |
MULTIRATE 10.3 GBPS QUAD RETIMER
|
Paquete: - |
En existencias6.924 |
|
2-Wire | 1 | 1.2V | - | - | - | Surface Mount | - | 48-QFN (5x9) |
||
NXP |
CABLE PREPROCESSOR LP TUNER
|
Paquete: - |
En existencias4.864 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC ETHERNET 12-PORT 672BGA
|
Paquete: 672-BGA |
En existencias6.560 |
|
- | 1 | 1V | - | - | - | Surface Mount | 672-BGA | 672-HSBGA (27x27) |
||
Microchip Technology |
IC TDM SWITCH 4K-CH ENH 256BGA
|
Paquete: 256-BGA |
En existencias5.440 |
|
- | 1 | 1.71V ~ 1.89V | 1.75mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Microchip Technology |
IC TDM SWITCH 1K-CH ENH 256BGA
|
Paquete: 256-BGA |
En existencias4.800 |
|
- | 1 | 1.71V ~ 1.89V | 115mA | - | -45°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Microchip Technology |
IC CNIC CIDCW CWD CID 20SOIC
|
Paquete: 20-SOIC (0.295", 7.50mm Width) |
En existencias6.400 |
|
3-Wire | 1 | 2.7V ~ 5.5V | 4.3mA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Broadcom Limited |
24XGE + 6X10GE/HG2 L3 SWITCH
|
Paquete: - |
En existencias4.128 |
|
- | - | - | - | - | - | - | - | - |
||
onsemi |
TELECOM CIRCUIT, BIPOLAR, PQCC28
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
BACKHAUL ACCESS SWITCH. BLOWN
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
DIE SALE (PRICE IN GOOD DIE)-WAF
|
Paquete: - |
Request a Quote |
|
- | 2 | - | - | - | -5°C ~ 95°C | Surface Mount | Die | Die |
||
CML Microcircuits |
IC TELECOM INTERFACE 16TSSOP
|
Paquete: - |
En existencias264 |
|
Parallel | 1 | 2.7V ~ 5.5V | 1.5mA | 300 mW | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Broadcom Limited |
IP PHONE CHIP
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
DUSLIC DUAL CHANNEL SUBSCRIBER L
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |