Imagen |
Nº de pieza |
Fabricantes |
Descripción |
Paquete |
En existencias |
Cantidad |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC CODEC VOIP W/DSP LBGA-176-3
|
Paquete: 176-LBGA |
En existencias3.440 |
|
JTAG, PCM, SCI/SPI | 4 | - | - | - | -40°C ~ 85°C | Surface Mount | 176-LBGA | PG-LBGA-176 |
||
Microsemi Corporation |
IC CESOP PROCESSOR 128CH 324BGA
|
Paquete: 324-BGA |
En existencias3.280 |
|
TDM | 1 | 1.65 V ~ 1.95 V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Microsemi Corporation |
IC VOICE ECHO CANCEL 4CH 208LBGA
|
Paquete: 208-LBGA |
En existencias2.224 |
|
- | 1 | 1.6 V ~ 2 V | 5mA | - | -40°C ~ 85°C | Surface Mount | 208-LBGA | 208-LBGA (17x17) |
||
Microsemi Corporation |
IC SLIC 1CH 52DB LGBAL 32PLCC
|
Paquete: 32-LCC (J-Lead) |
En existencias81.156 |
|
2-Wire | 1 | 4.75 V ~ 5.25 V | - | - | -40°C ~ 85°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CSBGA
|
Paquete: 144-BGA, CSPBGA |
En existencias4.944 |
|
LIU | 4 | 3.135 V ~ 3.465 V | 300mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Exar Corporation |
IC LIU E1 QUAD 64TQFP
|
Paquete: 64-LQFP |
En existencias5.568 |
|
LIU | 4 | 3.14 V ~ 3.47 V, 4.75 V ~ 5.25 V | - | - | -40°C ~ 85°C | Surface Mount | 64-LQFP | 64-TQFP (10x10) |
||
Maxim Integrated |
IC LINE INTERFACE UNIT 100LQFP
|
Paquete: 100-LQFP |
En existencias5.744 |
|
- | 1 | 3.15 V ~ 3.45 V | - | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-LQFP (16x16) |
||
Cypress Semiconductor Corp |
IC SERDES HOTLINK II 256LBGA
|
Paquete: 256-LBGA Exposed Pad |
En existencias5.120 |
|
LVTTL | 4 | 3.135 V ~ 3.465 V | 830mA | - | 0°C ~ 70°C | Surface Mount | 256-LBGA Exposed Pad | 256-BGA |
||
Silicon Labs |
IC SLIC/CODEC DUAL-CH 64TQFP
|
Paquete: 64-TQFP |
En existencias179.460 |
|
GCI, PCM, SPI | 2 | 3.3V, 5V | 65mA | 941mW | -40°C ~ 85°C | Surface Mount | 64-TQFP | 64-TQFP (10x10) |
||
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 16MLP
|
Paquete: 16-VDFN Exposed Pad |
En existencias5.136 |
|
- | 1 | 4.5 V ~ 5.5 V | 1.3mA | 10mW | -40°C ~ 110°C | Surface Mount | 16-VDFN Exposed Pad | 16-MLP (7x6) |
||
Texas Instruments |
IC TXRX INTERFACE DEVICE 20-PLCC
|
Paquete: 20-LCC (J-Lead) |
En existencias7.936 |
|
ISDN | - | 4.75 V ~ 5.25 V | - | - | - | Surface Mount | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Maxim Integrated |
IC TXRX E1 QUAD 256BGA
|
Paquete: 256-BGA |
En existencias4.304 |
|
E1 | 4 | 5V | - | - | - | Surface Mount | 256-BGA | 256-BGA (27x27) |
||
Microsemi Corporation |
IC CESOP PROCESSOR 128CH 324BGA
|
Paquete: 324-BGA |
En existencias5.424 |
|
TDM | 1 | 1.65 V ~ 1.95 V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Silicon Labs |
IC PROSLIC FXS ISI -106V 48QFN
|
Paquete: - |
En existencias3.280 |
|
3-Wire, PCM | 2 | 3.3V | - | - | -40°C ~ 85°C | - | - | - |
||
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SW 28-DFN
|
Paquete: 28-VDFN Exposed Pad |
En existencias3.040 |
|
- | 1 | 4.5 V ~ 5.5 V | 2mA | 10.5mW | -40°C ~ 110°C | Surface Mount | 28-VDFN Exposed Pad | 28-DFN |
||
IXYS Integrated Circuits Division |
IC RELAY OPTO 120MA 8SMD
|
Paquete: 8-SMD, Gull Wing |
En existencias7.488 |
|
- | 2 | - | - | 800mW | -40°C ~ 85°C | Surface Mount | 8-SMD, Gull Wing | 8-SMD |
||
IXYS Integrated Circuits Division |
IC VOICE BAND CODEC 24SSOP
|
Paquete: 24-SSOP (0.154", 3.90mm Width) |
En existencias6.108 |
|
SPI | 1 | 3 V ~ 3.6 V | 7.5mA | - | -40°C ~ 85°C | Surface Mount | 24-SSOP (0.154", 3.90mm Width) | 24-SSOP |
||
Microchip Technology |
24X1G + 4X10G OR 48X1G + 2X10G (
|
Paquete: - |
En existencias7.712 |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
MULTI LAYER SWITCH - 1588 DISA
|
Paquete: - |
En existencias5.616 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
TEMUX-84 WITH E3 MAPPERS, DS3/E3
|
Paquete: 324-FBGA |
En existencias2.576 |
|
E1, J1, T1 | - | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 324-FBGA | 324-PBGA (23x23) |
||
Microchip Technology |
IC TDM SWITCH 1K-CH ENH 256BGA
|
Paquete: 256-BGA |
En existencias3.504 |
|
- | 1 | 1.71V ~ 1.89V | 150mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Microchip Technology |
IC VOICE LINE VCPNG 128CH 128TQF
|
Paquete: 128-TQFP |
En existencias6.112 |
|
2-Wire | - | - | - | - | - | Surface Mount | 128-TQFP | 128-TQFP |
||
Microchip Technology |
IC LINE DRIVER 2CH ADSL2+ 16QFN
|
Paquete: 16-VFQFN Exposed Pad |
En existencias2.032 |
|
- | 2 | 10V ~ 24V, ±5V ~ 12V | 4mA | - | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (4x4) |
||
Broadcom Limited |
KATANA2 40GE
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
GEMINAX D8 MAX IS A 8 CHANNEL AD
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Intersil |
SLIC, 2-4 CONVERSION, BIPOLAR
|
Paquete: - |
Request a Quote |
|
- | 1 | - | - | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
CML Microcircuits |
IC TELECOM INTERFACE 48VQFN
|
Paquete: - |
En existencias6.000 |
|
C-Bus | 1 | 3V ~ 3.6V | 17.5mA | 1.75 W | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-VQFN (7x7) |
||
Broadcom Limited |
XPON HGU COMMERCIAL RANGE
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | 0°C ~ 70°C | - | - | - |