Imagen |
Nº de pieza |
Fabricantes |
Descripción |
Paquete |
En existencias |
Cantidad |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi Solutions Sdn Bhd. |
IC SIGNAL COND 4X4 69-BGA
|
Paquete: 69-FBGA |
En existencias7.888 |
|
TTL/CMOS | 4 | 2.5V, 3.3V | - | 1.5W | 0°C ~ 110°C | Surface Mount | 69-FBGA | 69-BGA |
||
Infineon Technologies |
IC CTRLR 2CH SERIAL TQFP-100
|
Paquete: 100-LQFP |
En existencias4.016 |
|
HDLC, PPP | 2 | 3 V ~ 3.6 V | 50mA | 150mW | 0°C ~ 70°C | Surface Mount | 100-LQFP | P-TQFP-100 |
||
Intersil |
IC LINE DVR DIFF 300MHZ 16QFN
|
Paquete: - |
En existencias4.848 |
|
- | 1 | 4.5 V ~ 13.2 V | 6mA | - | -40°C ~ 85°C | - | - | - |
||
Maxim Integrated |
IC FRAMER DUAL DS3/E3 144TCBGA
|
Paquete: 144-BGA, CSPBGA |
En existencias6.384 |
|
LIU | 2 | 3.135 V ~ 3.465 V | 155mA | - | 0°C ~ 70°C | Surface Mount | 144-BGA, CSPBGA | 144-CSPBGA (13x13) |
||
Inphi Corporation |
IC ETH AGGREGATOR 4P 1024-BGA
|
Paquete: 1024-BGA |
En existencias5.600 |
|
Interlaken, XAUI | - | - | - | - | - | Surface Mount | 1024-BGA | 1024-BGA (33x33) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 4CH 144LQFP
|
Paquete: 144-LQFP |
En existencias7.552 |
|
LIU | 4 | 3.135 V ~ 3.465 V | 500mA | - | -40°C ~ 85°C | Surface Mount | 144-LQFP | 144-LQFP (20x20) |
||
Exar Corporation |
IC LIU T1/E1/J1 14CH 304TBGA
|
Paquete: 304-BBGA |
En existencias13.044 |
|
LIU | 14 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 304-BBGA | 304-PBGA (31x31) |
||
Texas Instruments |
IC SOURCE RINGER CNTRLR 28-DIP
|
Paquete: 28-DIP (0.600", 15.24mm) |
En existencias3.856 |
|
- | 1 | 5V | 500µA | - | 0°C ~ 70°C | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Infineon Technologies |
IC COMMUNICATION CTRLR TQFP-144
|
Paquete: 144-LQFP |
En existencias7.424 |
|
HDLC, IOM-2, ISDN, JTAG, PCM, USART | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 144-LQFP | P-TQFP-144 |
||
Exar Corporation |
IC LIU STS1/DS3/E3 SGL 44TQFP
|
Paquete: 44-LQFP |
En existencias16.656 |
|
LIU | 1 | 3.135 V ~ 3.465 V | 125mA | - | -40°C ~ 85°C | Surface Mount | 44-LQFP | 44-TQFP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC LIU T1/J1/E1 2CH 80-TQFP
|
Paquete: 80-LQFP |
En existencias4.944 |
|
LIU | - | 3.13 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 80-LQFP | 80-TQFP (14x14) |
||
Microsemi Corporation |
IC SLAC NGCC 8CH 176LQFP
|
Paquete: - |
En existencias7.904 |
|
2-Wire | 1 | - | - | - | - | Surface Mount | - | 176-LQFP |
||
Microsemi Corporation |
IC TDM/TSI ST-BUS 32CH 28SOIC
|
Paquete: 28-SOIC (0.295", 7.50mm Width) |
En existencias2.880 |
|
Parallel | 1 | 4.75 V ~ 5.25 V | 10µA | - | -40°C ~ 85°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
IXYS Integrated Circuits Division |
IC OPT-ISOLATED MULTIFUNC 16SOIC
|
Paquete: 16-SOIC (0.295", 7.50mm Width) |
En existencias2.720 |
|
- | 1 | - | - | 1W | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Inphi Corporation |
IC TRANSPORT PROCESSOR 1517-BGA
|
Paquete: 1517-BBGA |
En existencias5.104 |
|
SFI-4.1, SFI-4.2, SFI-5.1, XAUI, XFI | - | 1V, 1.8V, 2.5V | - | - | - | Surface Mount | 1517-BBGA | 1517-BGA (40x40) |
||
Microchip Technology |
QUAD GIGABIT IEEE 1588 10NS Q/SG
|
Paquete: - |
En existencias6.032 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
QUAD GIGABIT IEEE 1588 10NS Q/SG
|
Paquete: 256-BGA |
En existencias2.416 |
|
GMII, SerDes, TBI | 4 | 1V, 2.5V | - | - | - | Surface Mount | 256-BGA | 256-PBGA (17x17) |
||
Microchip Technology |
11-PORT CE SWITCH ENGINE WITH CU
|
Paquete: - |
En existencias4.080 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC HDLC PROTOCOL CTLR 28PLCC
|
Paquete: 28-LCC (J-Lead) |
En existencias6.192 |
|
- | 1 | 4.75V ~ 5.25V | 1µA | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
||
Microchip Technology |
IC CODEC/FILTER 4CH 28I/O 64LQFP
|
Paquete: 64-LQFP |
En existencias5.184 |
|
PCM | 4 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 64-LQFP | 64-LQFP (14x14) |
||
Microchip Technology |
IC CNIC2 CLIP CID CIDCW 24SOIC
|
Paquete: 24-SOIC (0.295", 7.50mm Width) |
En existencias3.360 |
|
3-Wire | 1 | 2.7V ~ 5.5V | 4.7mA | - | -40°C ~ 85°C | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC |
||
Microchip Technology |
IC LINE DRIVER CLASS AB 28QFN
|
Paquete: - |
En existencias6.160 |
|
- | 2 | - | - | - | - | Surface Mount | - | 28-QFN |
||
Microchip Technology |
IC SLIC 1CH 8KHZ 100V 16SOIC
|
Paquete: - |
En existencias4.928 |
|
PCM | 1 | - | - | - | - | Surface Mount | - | 16-SOIC |
||
Renesas Electronics Corporation |
CABGA 17.00X17.00X1.40 MM, 1.00M
|
Paquete: - |
Request a Quote |
|
E1, J1, SPI, T1 | 8 | 1.68V ~ 1.98V, 3V ~ 3.6V | - | 800 mW | -40°C ~ 85°C | Surface Mount | 256-LBGA | 256-CABGA (17x17) |
||
Harris Corporation |
EIA/ITU PABX SLIC
|
Paquete: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | -42V ~ -58V, 4.75V ~ 5.25V, 10.8V ~ 13.2V | - | 690 mW | -40°C ~ 85°C | Through Hole | 24-CDIP (0.600", 15.24mm) | 24-CERDIP |
||
Harris Corporation |
5 REN RINGING SLIC FOR ISDN
|
Paquete: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | -16V ~ -80V, 4.75V ~ 5.25V | 6mA | 300 mW | -40°C ~ 85°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Infineon Technologies |
IC MEMORY DIP-40
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | Through Hole | 40-DIP (0.600", 15.24mm) | P-DIP-40 |
||
Broadcom Limited |
MULTI LAYER SWITCH
|
Paquete: - |
Request a Quote |
|
PCI Express | - | - | - | - | - | - | - | - |