Imagen |
Nº de pieza |
Fabricantes |
Descripción |
Paquete |
En existencias |
Cantidad |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi Corporation |
IC SLIC 1CH P RV 32PLCC
|
Paquete: 32-LCC (J-Lead) |
En existencias5.216 |
|
2-Wire | 1 | 4.75 V ~ 5.25 V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Microsemi Corporation |
IC LINE DRIVER 2CH ADSL+ 24QFN
|
Paquete: - |
En existencias5.904 |
|
- | 2 | 10 V ~ 24 V, ±5 V ~ 12 V | - | - | - | - | - | 24-QFN |
||
Maxim Integrated |
IC LINE INTERFACE 5V T1/J1 PLCC
|
Paquete: 28-LCC (J-Lead) |
En existencias5.200 |
|
LIU | 1 | 4.75 V ~ 5.25 V | - | - | 0°C ~ 70°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Maxim Integrated |
IC LIU E1/T1/J1 4X 5V LONG144BGA
|
Paquete: 144-BGA, CSPBGA |
En existencias7.184 |
|
LIU | - | 4.75 V ~ 5.25 V | 95mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-CSBGA (17x17) |
||
Microsemi Solutions Sdn Bhd. |
IC ETHERNET RGMII/RMII 68-QFN
|
Paquete: - |
En existencias5.760 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
IC TDM SWITCH 1024X1024 256BGA
|
Paquete: 256-BGA |
En existencias2.864 |
|
- | 1 | 1.71 V ~ 1.89 V | 75mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Microsemi Corporation |
IC SUBSCRIBER NETWRK DSIC 28PLCC
|
Paquete: - |
En existencias5.008 |
|
- | 1 | 4.75 V ~ 5.25 V | 10mA | - | -40°C ~ 85°C | Surface Mount | - | 28-PLCC |
||
Microsemi Corporation |
IC SLIC 1CH 40DB LGBAL 32QFN
|
Paquete: 32-VQFN Exposed Pad |
En existencias18.072 |
|
2-Wire | 1 | 4.75 V ~ 5.25 V | - | - | 0°C ~ 70°C | Surface Mount | 32-VQFN Exposed Pad | 32-QFN (8x8) |
||
NXP |
SI TUNER FOR SINGLE DVB-T STB AP
|
Paquete: - |
En existencias5.856 |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
DATA MODEM
|
Paquete: - |
En existencias5.264 |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
DOCSIS EOC MAC
|
Paquete: - |
En existencias6.944 |
|
SFI | - | - | - | - | 0°C ~ 85°C (TJ) | - | - | - |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
Paquete: 256-BGA |
En existencias5.504 |
|
- | - | - | - | - | - | Surface Mount | 256-BGA | 256-BGA |
||
Microchip Technology |
40G VT/TU SWITCHING ELEMENT
|
Paquete: - |
En existencias6.288 |
|
Serial | - | 1.2V | - | - | - | Surface Mount | - | 672-FCBGA (27x27) |
||
Microchip Technology |
IC ECHO CANCELLER AEC 36SSOP
|
Paquete: 36-BSOP (0.295", 7.50mm Width) |
En existencias2.224 |
|
Serial | 1 | 2.7V ~ 3.6V | 20mA | 90mW | -40°C ~ 85°C | Surface Mount | 36-BSOP (0.295", 7.50mm Width) | 36-QSOP |
||
Microchip Technology |
IC SUBSCRIBER NETWRK DSIC 28PLCC
|
Paquete: - |
En existencias6.880 |
|
- | 1 | 4.75V ~ 5.25V | 10mA | - | -40°C ~ 85°C | Surface Mount | - | 28-PLCC |
||
Microchip Technology |
IC ETHERNET RGMII/RMII 48-QFN
|
Paquete: 48-VFQFN Exposed Pad |
En existencias9.912 |
|
RMII | 1 | - | - | - | - | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (6x6) |
||
Microchip Technology |
IC HDLC PROTOCOL CTLR 28SOIC
|
Paquete: 28-SOIC (0.295", 7.50mm Width) |
En existencias10.512 |
|
- | 1 | 4.75V ~ 5.25V | 1µA | - | -40°C ~ 85°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Broadcom Limited |
TRANSCEIVER
|
Paquete: - |
Request a Quote |
|
Serial | 8 | - | - | - | - | - | - | - |
||
Broadcom Limited |
212, BONDED 106, V/ADSL, 10G GW,
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Harris Corporation |
ITU CO/PABX SLIC
|
Paquete: - |
Request a Quote |
|
- | 1 | 4.75V ~ 5.25V | - | 1.5 W | 0°C ~ 70°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Harris Corporation |
LSSGR/TR57 CO/LOOP CARRIER SLIC
|
Paquete: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | ±4.75V ~ 5.25V | 5.8mA | - | -40°C ~ 85°C | Through Hole | 22-DIP (0.400", 10.16mm) | 22-PDIP |
||
Microchip Technology |
Freedm84A1024L, High Density HDL
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
12X10GE/48GE+8X10GE
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
HIGH PERFORMANCE VDSL GATEWAY/RO
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
MGIG CAPABLE ENTERPRISE SWITCH W
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
INFINEON PMB7860V1.1E TELECOM IC
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Harris Corporation |
EIA/ITU PABX SLIC
|
Paquete: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | -42V ~ -58V, 10.8V ~ 13.2V | - | 580 mW | 0°C ~ 75°C | Through Hole | 24-DIP (0.600", 15.24mm) | 24-PDIP |
||
Broadcom Limited |
INTEGRATED GBE MOBILE MAC/PHY
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |