Imagen |
Nº de pieza |
Fabricantes |
Descripción |
Paquete |
En existencias |
Cantidad |
Input Type | Output Type | Interface | Current - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ams |
IC AFE CAPACTIVE SENSOR 8-SOIC
|
Paquete: 8-SOIC (0.154", 3.90mm Width) |
En existencias7.200 |
|
- | - | - | 4.5mA | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ON Semiconductor |
IC SENSOR VAR RELUCT QUAD 24SOIC
|
Paquete: 24-SOIC (0.295", 7.50mm Width) |
En existencias4.608 |
|
- | - | Differential | 24mA | - | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC |
||
Maxim Integrated |
IC CNTRLR TOUCH RES 16QSOP
|
Paquete: 16-SSOP (0.154", 3.90mm Width) |
En existencias54.756 |
|
Analog | Digital | 4-Wire | 950µA | -40°C ~ 85°C | Surface Mount | 16-SSOP (0.154", 3.90mm Width) | 16-QSOP |
||
Intersil |
IC SENSOR ENGINE KNOCK 20-SOIC
|
Paquete: 20-SOIC (0.295", 7.50mm Width) |
En existencias5.408 |
|
Logic | Logic | SPI | 8mA | -40°C ~ 125°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Exar Corporation |
SENSOR
|
Paquete: 24-WFQFN Exposed Pad |
En existencias2.064 |
|
- | - | I2C | 457µA | -40°C ~ 85°C | Surface Mount | 24-WFQFN Exposed Pad | 24-QFN (3.5x3.5) |
||
Maxim Integrated |
IC CTLR/MON SFP 1-2CH 28TQFN
|
Paquete: 28-WFQFN Exposed Pad |
En existencias6.000 |
|
Logic | Logic | I2C | 2.5mA | -40°C ~ 95°C | Surface Mount | 28-WFQFN Exposed Pad | 28-TQFN (5x5) |
||
ISSI, Integrated Silicon Solution Inc |
IC TOUCH SENSOR CAP 4CH 16SOIC
|
Paquete: 16-SOIC (0.154", 3.90mm Width) |
En existencias4.256 |
|
- | - | I2C | 173µA | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOP |
||
Microchip Technology |
IC SMOKE DETECTOR CMOS 16-SOIC
|
Paquete: 16-SOIC (0.154", 3.90mm Width) |
En existencias6.688 |
|
Photoelectric | Voltage | - | 8µA | -25°C ~ 75°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Analog Devices Inc. |
IC THERMOCOUPLE COMPENSATOR 8DIP
|
Paquete: 8-DIP (0.300", 7.62mm) |
En existencias5.648 |
|
Voltage | Thermocouple | - | 80µA | 0°C ~ 70°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Analog Devices Inc. |
IC TRANSMITTER 4-20MA 20-CDIP
|
Paquete: 20-CDIP (0.300", 7.62mm) |
En existencias42.660 |
|
Voltage | Voltage | 3-Wire | 20mA | -40°C ~ 85°C | Through Hole | 20-CDIP (0.300", 7.62mm) | 20-CDIP |
||
Texas Instruments |
IC PRESSURE SENSOR 5V 36VQFN
|
Paquete: 36-VFQFN Exposed Pad |
En existencias5.296 |
|
- | - | 1-Wire?, SPI | 13.6mA | -40°C ~ 125°C | Surface Mount | 36-VFQFN Exposed Pad | 36-VQFN (6x6) |
||
Diodes Incorporated |
PIR CONTROLLER DIP-16
|
Paquete: 16-DIP (0.300", 7.62mm) |
En existencias2.032 |
|
CMOS | - | - | 100µA | -25°C ~ 70°C (TA) | Through Hole | 16-DIP (0.300", 7.62mm) | 16-DIP |
||
Analog Devices Inc. |
OPTICAL BIOMETRIC TRANS RED & IN
|
Paquete: - |
En existencias4.240 |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
DICE (WAFER SAWN) - WAFFLE PACK
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Analog Devices Inc. |
IC MCU FLASH 96K ANLG I/O 48LFCS
|
Paquete: - |
Request a Quote |
|
Logic | Logic | - | 20 mA | -40°C ~ 115°C | Surface Mount | 48-WFQFN Exposed Pad, CSP | 48-LFCSP (7x7) |
||
Renesas Electronics Corporation |
DICE (WAFER SAWN) - WAFFLE PACK
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
DICE (WAFER SAWN) - FRAME
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Analog Devices Inc. |
IC CCD SIGNAL PROC 10BIT 48-LQFP
|
Paquete: - |
Request a Quote |
|
Logic | Logic | - | - | -20°C ~ 85°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
Renesas Electronics Corporation |
WAFER (UNSAWN) - BOX
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Analog Devices Inc./Maxim Integrated |
DUAL, 2-WIRE HALL-EFFECT SENSOR
|
Paquete: - |
Request a Quote |
|
Logic | 2-Wire | - | 1 mA | -40°C ~ 125°C (TA) | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-uMAX/uSOP |
||
Renesas Electronics Corporation |
TSSOP / 16 / 5X4MM-0
|
Paquete: - |
Request a Quote |
|
Differential | 1-Wire®, I2C | - | - | -40°C ~ 150°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Microchip Technology |
ION COMP, LOW CURRENT
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
WAFER (UNSAWN) - BOX
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Melexis Technologies NV |
SENSOR LIGHT PROXIMITY 24QFN
|
Paquete: - |
En existencias270 |
|
- | SPI | - | 6 mA | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Cirrus Logic Inc. |
IC
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
Renesas Electronics Corporation |
WAFER (UNSAWN) - BOX
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
DICE (WAFER SAWN) - WAFFLE PACK
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
WAFER (UNSAWN) - BOX
|
Paquete: - |
Request a Quote |
|
Capacitive | I2C, SPI | - | 1.1 mA | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |