Imagen |
Nº de pieza |
Fabricantes |
Descripción |
Paquete |
En existencias |
Cantidad |
Number of Cores/Bus Width | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Operating Temperature | Security Features | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC MPU MPC85XX 1.067GHZ 783BGA
|
Paquete: 783-BBGA, FCBGA |
En existencias7.936 |
|
1 Core, 32-Bit | 1.067GHz | Communications; QUICC Engine | DDR2, DDR3, SDRAM | No | - | 10/100 Mbps (8), 1 Gbps (4) | - | USB 2.0 (1) | 1.0V, 1.5V, 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU Q OR IQ 1.0GHZ 425TEBGA
|
Paquete: 425-FBGA |
En existencias5.344 |
|
1 Core, 32-Bit | 1.0GHz | Security; SEC 4.4 | DDR3, DDR3L | No | - | 10/100/1000 Mbps (3) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | - | 0°C ~ 105°C (TA) | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | 425-FBGA | 425-TEPBGA I (19x19) |
||
Texas Instruments |
IC MPU OMAP-35XX 600MHZ 423FCBGA
|
Paquete: 423-LFBGA, FCBGA |
En existencias25.944 |
|
1 Core, 32-Bit | 600MHz | Multimedia; NEON? SIMD | LPDDR | Yes | LCD | - | - | USB 1.x (3), USB 2.0 (1) | 1.8V, 3.0V | 0°C ~ 90°C (TJ) | - | 423-LFBGA, FCBGA | 423-FCBGA (16x16) |
||
NXP |
IC MPU MPC74XX 1.6GHZ 360FCCBGA
|
Paquete: 360-BCBGA, FCCBGA |
En existencias2.720 |
|
1 Core, 32-Bit | 1.6GHz | Multimedia; SIMD | - | No | - | - | - | - | 1.5V, 1.8V, 2.5V | 0°C ~ 105°C (TA) | - | 360-BCBGA, FCCBGA | 360-FCCBGA (25x25) |
||
NXP |
IC MPU MPC82XX 200MHZ 408TBGA
|
Paquete: 480-LBGA |
En existencias5.552 |
|
1 Core, 32-Bit | 200MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100 Mbps (3) | - | - | 3.3V | -40°C ~ 105°C (TA) | - | 480-LBGA | 408-TBGA (37.5x37.5) |
||
Zilog |
IC MPU Z80 20MHZ 44PLCC
|
Paquete: 44-LCC (J-Lead) |
En existencias3.008 |
|
1 Core, 8-Bit | 20MHz | - | - | No | - | - | - | - | 5.0V | -40°C ~ 100°C (TA) | - | 44-LCC (J-Lead) | 44-PLCC |
||
NXP |
IC SOC 64BIT 2X2.2GHZ 1295FCBGA
|
Paquete: 1295-BBGA, FCBGA |
En existencias8.532 |
|
2 Core, 64-Bit | 2.2GHz | - | DDR3, DDR3L | No | - | 1 Gbps (10), 10 Gbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | 1.0V, 1.2V | 0°C ~ 105°C (TA) | - | 1295-BBGA, FCBGA | 1295-FCPBGA (37.5x37.5) |
||
Advantech Corp |
CORE 2.6G 4M 1150P 2CORE I3-4340
|
Paquete: - |
En existencias3.392 |
|
2 Core, 64-Bit | 2.6GHz | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
IC MPU Q OR IQ 667MHZ 780FCBGA
|
Paquete: - |
En existencias3.152 |
|
4 Core, 32-Bit | 667MHz | - | DDR3, DDR3L | No | - | 10/100/1000 Mbps (5) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | - | 780-FCPBGA (23x23) |
||
NXP |
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Paquete: 689-BBGA Exposed Pad |
En existencias4.672 |
|
1 Core, 32-Bit | 800MHz | Communications; QUICC Engine | DDR2, DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | -40°C ~ 105°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
QORIQ 64-BIT ARM MPU 800MHZ STD
|
Paquete: 211-VFLGA |
En existencias3.360 |
|
1 Core, 64-Bit | 800MHz | - | DDR3L | - | - | - | SATA 6Gbps (1) | USB 2.0 (1), USB 3.0 + PHY | - | 0°C ~ 105°C (TA) | ARM TZ | 211-VFLGA | 211-FCLGA (9.6x9.6) |
||
Intel |
IC MPU I186 13MHZ 100QFP
|
Paquete: 100-QFP |
En existencias4.112 |
|
1 Core, 16-Bit | 13MHz | - | DRAM | No | - | - | - | - | 3.0V | 0°C ~ 70°C (TA) | - | 100-QFP | 100-PQFP (19x19) |
||
NXP |
IC MPU MPC8XX 100MHZ 357BGA
|
Paquete: 357-BBGA |
En existencias3.984 |
|
1 Core, 32-Bit | 100MHz | Communications; CPM | DRAM | No | - | 10 Mbps (4), 10/100 Mbps (1) | - | - | 3.3V | -40°C ~ 100°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
QORIQ64B POWER ARCH8X 1.2GHZ T
|
Paquete: - |
En existencias4.976 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
I.MX 6 SERIES 32-BIT MPU DUAL A
|
Paquete: 624-FBGA, FCBGA |
En existencias2.976 |
|
2 Core, 32-Bit | 1.0GHz | Multimedia; NEON™ SIMD | LPDDR2, DDR3L, DDR3 | Yes | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | 624-FBGA, FCBGA | 624-FCBGA (21x21) |
||
Broadcom Limited |
DUAL CORE
|
Paquete: - |
En existencias4.848 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
STMicroelectronics |
MPU ARM DUAL CORTEX-A7 650 MHZ A
|
Paquete: 448-LFBGA |
En existencias7.920 |
|
2 Core, 32-Bit | 209MHz, 650MHz | ARM® Cortex®-M4 | LPDDR2, LPDDR3, DDR3, DDR3L | Yes | HDMI, LCD | 10/100Mbps, GbE | - | USB 2.0 (2), USB 2.0 OTG+ PHY (3) | 2.5V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ | 448-LFBGA | 448-LFBGA (18x18) |
||
IBM |
IBM25PPC750 - POWERPC 750GX RISC
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
LAYERSCAPE 64-BIT ARM CORTEX-A72
|
Paquete: - |
Request a Quote |
|
1 Core, 64-Bit | 1.5GHz | - | DDR3L, DDR4 | Yes | - | 1Gbps (1), 2.5Gbps (5) | SATA 6Gbps (1) | USB 3.0 (2) | - | -40°C ~ 105°C (TA) | Secure Boot, TrustZone® | 448-BFBGA | 448-FBGA (17x17) |
||
NXP |
I.MX8ULP, SOLO 800MHZ
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
IC MPU RZ 125/500MHZ 400LFBGA
|
Paquete: - |
En existencias270 |
|
3 Core, 32-Bit | 125MHz, 500MHz | - | DDR2, DDR3 | No | LCD | 10/100/1000Mbps | - | USB 2.0 (2) | 1.5V, 1.8V, 2.5V, 3.3V | -40°C ~ 85°C (TA) | AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256 | 400-LFBGA | 400-LFBGA (17x17) |
||
Freescale Semiconductor |
IC MPU I.MXL 150MHZ 256BGA
|
Paquete: - |
Request a Quote |
|
1 Core, 32-Bit | 150MHz | - | SDRAM | No | LCD | - | - | USB (1) | 1.8V, 3V | -30°C ~ 70°C (TA) | - | 256-LFBGA | 256-PBGA (14x14) |
||
Renesas Electronics Corporation |
8-BIT MICROPROCESSOR
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Intersil |
ENGINE KNOCK SIGNAL PROCESSOR
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
I.MX8DUALXLITE 15SQ
|
Paquete: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC MPU SAM9X 600MHZ
|
Paquete: - |
En existencias1.131 |
|
1 Core, 32-Bit | 600MHz | - | DDR2, LPDDR, LPSDR, SRAM | Yes | Keyboard, LCD, Touchscreen | 10/100Mbps (2) | - | USB 2.0 (5) | 1.8V, 3.3V | -40°C ~ 85°C (TA) | Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA | - | - |
||
Microchip Technology |
CORTEX-A7 MPU, BGA, EXT. TEMP (T
|
Paquete: - |
Request a Quote |
|
1 Core, 32-Bit | 1GHz | Multimedia; NEON™ MPE | DDR2, DDR3, DDR3L, LPDDR2, LPDDR3 | No | - | 10/100Mbps (1), 10/100/1000Mbps (1) | - | USB (3) | 1.35V | -40°C ~ 125°C (TJ) | ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512 | 343-TFBGA | 343-TFBGA (14x14) |
||
NXP |
IC MPU I.MX8MN 1.4GHZ 306TFBGA
|
Paquete: - |
En existencias288 |
|
4 Core, 64-Bit | 1.4GHz | Multimedia; NEON™ MPE | DDR3L, DDR4, LPDDR4 | Yes | LCD, MIPI-CSI, MIPI-DSI | GbE | - | USB 2.0 OTG + PHY (1) | - | 0°C ~ 95°C (TJ) | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | 306-TFBGA | 306-TFBGA (11x11) |