Página 179 - Integrados - Microprocesadores | Circuitos integrados | Heisener Electronics
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Integrados - Microprocesadores

Registros 8.238
Página  179/295
Imagen
Nº de pieza
Fabricantes
Descripción
Paquete
En existencias
Cantidad
Number of Cores/Bus Width
Speed
Co-Processors/DSP
RAM Controllers
Graphics Acceleration
Display & Interface Controllers
Ethernet
SATA
USB
Voltage - I/O
Operating Temperature
Security Features
Package / Case
Supplier Device Package
LS101MAXE7DFA
NXP

IC PROCESSOR DUAL CORE

  • Core Processor: ARM1136JF-S
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 650MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: GbE (2)
  • SATA: -
  • USB: USB 2.0 + PHY (1)
  • Voltage - I/O: -
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Security Features: -
  • Package / Case: 448-FBGA Exposed Pad
  • Supplier Device Package: 448-PBGA w/Heat Spreader (23x23)
Paquete: 448-FBGA Exposed Pad
En existencias4.384
1 Core, 32-Bit
650MHz
-
DDR2
No
-
GbE (2)
-
USB 2.0 + PHY (1)
-
-40°C ~ 85°C (TA)
-
448-FBGA Exposed Pad
448-PBGA w/Heat Spreader (23x23)
PPC8309VMADDCA
NXP

IC MPU MPC83XX 266MHZ 369BGA

  • Core Processor: PowerPC e300c3
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 266MHz
  • Co-Processors/DSP: Communications; QUICC Engine
  • RAM Controllers: DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (3)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 1.8V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 369-LFBGA
  • Supplier Device Package: 369-PBGA (19x19)
Paquete: 369-LFBGA
En existencias7.184
1 Core, 32-Bit
266MHz
Communications; QUICC Engine
DDR2
No
-
10/100 Mbps (3)
-
USB 2.0 (1)
1.8V, 3.3V
0°C ~ 105°C (TA)
-
369-LFBGA
369-PBGA (19x19)
MC8641DVU1000NE
NXP

IC MPU MPC86XX 1.0GHZ 1023FCCBGA

  • Core Processor: PowerPC e600
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 1.0GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (4)
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 1023-BCBGA, FCCBGA
  • Supplier Device Package: 1023-FCCBGA (33x33)
Paquete: 1023-BCBGA, FCCBGA
En existencias5.648
2 Core, 32-Bit
1.0GHz
-
DDR, DDR2
No
-
10/100/1000 Mbps (4)
-
-
1.8V, 2.5V, 3.3V
0°C ~ 105°C (TA)
-
1023-BCBGA, FCCBGA
1023-FCCBGA (33x33)
MC8641DTVU1000GE
NXP

IC MPU MPC86XX 1.0GHZ 1023FCCBGA

  • Core Processor: PowerPC e600
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 1.0GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (4)
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 1023-BCBGA, FCCBGA
  • Supplier Device Package: 1023-FCCBGA (33x33)
Paquete: 1023-BCBGA, FCCBGA
En existencias3.808
2 Core, 32-Bit
1.0GHz
-
DDR, DDR2
No
-
10/100/1000 Mbps (4)
-
-
1.8V, 2.5V, 3.3V
-40°C ~ 105°C (TA)
-
1023-BCBGA, FCCBGA
1023-FCCBGA (33x33)
hot MPC8379VRALG
NXP

IC MPU MPC83XX 667MHZ 689TEBGA

  • Core Processor: PowerPC e300c4s
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 667MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: SATA 3Gbps (4)
  • USB: USB 2.0 + PHY (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 125°C (TA)
  • Security Features: -
  • Package / Case: 689-BBGA Exposed Pad
  • Supplier Device Package: 689-TEPBGA II (31x31)
Paquete: 689-BBGA Exposed Pad
En existencias3.936
1 Core, 32-Bit
667MHz
-
DDR, DDR2
No
-
10/100/1000 Mbps (2)
SATA 3Gbps (4)
USB 2.0 + PHY (1)
1.8V, 2.5V, 3.3V
0°C ~ 125°C (TA)
-
689-BBGA Exposed Pad
689-TEPBGA II (31x31)
79RC32H434-350BC
IDT, Integrated Device Technology Inc

IC MPU INTERPRISE 350MHZ 256BGA

  • Core Processor: MIPS32
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 350MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (1)
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Security Features: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-CABGA (17x17)
Paquete: 256-LBGA
En existencias7.920
1 Core, 32-Bit
350MHz
-
DDR
No
-
10/100 Mbps (1)
-
-
3.3V
0°C ~ 70°C (TA)
-
256-LBGA
256-CABGA (17x17)
IDT79R3041-33PF8
IDT, Integrated Device Technology Inc

IC MPU MIPS-I 33MHZ 100TQFP

  • Core Processor: MIPS-I
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 33MHz
  • Co-Processors/DSP: System Control; CP0
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 5.0V
  • Operating Temperature: 0°C ~ 85°C (TC)
  • Security Features: -
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-TQFP (14x14)
Paquete: 100-LQFP
En existencias4.160
1 Core, 32-Bit
33MHz
System Control; CP0
DRAM
No
-
-
-
-
5.0V
0°C ~ 85°C (TC)
-
100-LQFP
100-TQFP (14x14)
KMC8358CVVAGDGA
NXP

IC MPU MPC83XX 400MHZ 740TBGA

  • Core Processor: PowerPC e300
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 400MHz
  • Co-Processors/DSP: Communications; QUICC Engine
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (1)
  • SATA: -
  • USB: USB 1.x (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 740-LBGA
  • Supplier Device Package: 740-TBGA (37.5x37.5)
Paquete: 740-LBGA
En existencias5.392
1 Core, 32-Bit
400MHz
Communications; QUICC Engine
DDR, DDR2
No
-
10/100/1000 Mbps (1)
-
USB 1.x (1)
1.8V, 2.5V, 3.3V
-40°C ~ 105°C (TA)
-
740-LBGA
740-TBGA (37.5x37.5)
hot XPC850DEZT50BU
NXP

IC MPU MPC8XX 50MHZ 256BGA

  • Core Processor: MPC8xx
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 50MHz
  • Co-Processors/DSP: Communications; CPM
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10 Mbps (1)
  • SATA: -
  • USB: USB 1.x (1)
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 95°C (TA)
  • Security Features: -
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-PBGA (23x23)
Paquete: 256-BGA
En existencias43.344
1 Core, 32-Bit
50MHz
Communications; CPM
DRAM
No
-
10 Mbps (1)
-
USB 1.x (1)
3.3V
0°C ~ 95°C (TA)
-
256-BGA
256-PBGA (23x23)
KMPC8275ZQMIBA
NXP

IC MPU MPC82XX 266MHZ 516BGA

  • Core Processor: PowerPC G2_LE
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 266MHz
  • Co-Processors/DSP: Communications; RISC CPM
  • RAM Controllers: DRAM, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (3)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 516-BBGA
  • Supplier Device Package: 516-FPBGA (27x27)
Paquete: 516-BBGA
En existencias3.232
1 Core, 32-Bit
266MHz
Communications; RISC CPM
DRAM, SDRAM
No
-
10/100 Mbps (3)
-
USB 2.0 (1)
3.3V
0°C ~ 105°C (TA)
-
516-BBGA
516-FPBGA (27x27)
KM68LC302AF20VCT
NXP

IC MPU M683XX 20MHZ 100LQFP

  • Core Processor: M68000
  • Number of Cores/Bus Width: 1 Core, 8/16-Bit
  • Speed: 20MHz
  • Co-Processors/DSP: Communications; RISC CPM
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Security Features: -
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
Paquete: 100-LQFP
En existencias7.168
1 Core, 8/16-Bit
20MHz
Communications; RISC CPM
DRAM
No
-
-
-
-
3.3V
0°C ~ 70°C (TA)
-
100-LQFP
100-LQFP (14x14)
hot MC68MH360AI33L
NXP

IC MPU M683XX 33MHZ 240FQFP

  • Core Processor: CPU32+
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 33MHz
  • Co-Processors/DSP: Communications; CPM
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10 Mbps (1)
  • SATA: -
  • USB: -
  • Voltage - I/O: 5.0V
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Security Features: -
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-FQFP (32x32)
Paquete: 240-BFQFP
En existencias4.528
1 Core, 32-Bit
33MHz
Communications; CPM
DRAM
No
-
10 Mbps (1)
-
-
5.0V
0°C ~ 70°C (TA)
-
240-BFQFP
240-FQFP (32x32)
MPC8540VTAQFC
NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.0GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (1), 10/100/1000 Mbps (2)
  • SATA: -
  • USB: -
  • Voltage - I/O: 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
Paquete: 784-BBGA, FCBGA
En existencias5.936
1 Core, 32-Bit
1.0GHz
-
DDR, SDRAM
No
-
10/100 Mbps (1), 10/100/1000 Mbps (2)
-
-
2.5V, 3.3V
0°C ~ 105°C (TA)
-
784-BBGA, FCBGA
783-FCPBGA (29x29)
P2041NSN7MMC
NXP

IC MPU Q OR IQ 1.2GHZ 780FCBGA

  • Core Processor: PowerPC e500mc
  • Number of Cores/Bus Width: 4 Core, 32-Bit
  • Speed: 1.2GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR3, DDR3L
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (5), 10 Gbps (1)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FCPBGA (23x23)
Paquete: 780-BBGA, FCBGA
En existencias6.480
4 Core, 32-Bit
1.2GHz
-
DDR3, DDR3L
No
-
10/100/1000 Mbps (5), 10 Gbps (1)
SATA 3Gbps (2)
USB 2.0 + PHY (2)
1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
0°C ~ 105°C (TA)
-
780-BBGA, FCBGA
780-FCPBGA (23x23)
MPC860DPVR66D4
NXP

IC MPU MPC8XX 66MHZ 357BGA

  • Core Processor: MPC8xx
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 66MHz
  • Co-Processors/DSP: Communications; CPM
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10 Mbps (2), 10/100 Mbps (1)
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 95°C (TA)
  • Security Features: -
  • Package / Case: 357-BBGA
  • Supplier Device Package: 357-PBGA (25x25)
Paquete: 357-BBGA
En existencias5.136
1 Core, 32-Bit
66MHz
Communications; CPM
DRAM
No
-
10 Mbps (2), 10/100 Mbps (1)
-
-
3.3V
0°C ~ 95°C (TA)
-
357-BBGA
357-PBGA (25x25)
MPC8313ZQAGDC
NXP

IC MPU MPC83XX 400MHZ 516BGA

  • Core Processor: PowerPC e300c3
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 400MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: USB 2.0 + PHY (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 516-BBGA Exposed Pad
  • Supplier Device Package: 516-TEPBGA (27x27)
Paquete: 516-BBGA Exposed Pad
En existencias3.840
1 Core, 32-Bit
400MHz
-
DDR, DDR2
No
-
10/100/1000 Mbps (2)
-
USB 2.0 + PHY (1)
1.8V, 2.5V, 3.3V
0°C ~ 105°C (TA)
-
516-BBGA Exposed Pad
516-TEPBGA (27x27)
GCIXP1250BC
Intel

IC MPU STRONGARM 232MHZ 520BGA

  • Core Processor: StrongARM
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 232MHz
  • Co-Processors/DSP: Data; Microengine
  • RAM Controllers: SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Security Features: -
  • Package / Case: 520-LFBGA
  • Supplier Device Package: 520-HL-PBGA (40x40)
Paquete: 520-LFBGA
En existencias7.680
1 Core, 32-Bit
232MHz
Data; Microengine
SDRAM
No
-
-
-
-
3.3V
0°C ~ 70°C (TA)
-
520-LFBGA
520-HL-PBGA (40x40)
hot MPC8280VVUPEA
NXP

IC MPU MPC82XX 450MHZ 408TBGA

  • Core Processor: PowerPC G2_LE
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 450MHz
  • Co-Processors/DSP: Communications; RISC CPM
  • RAM Controllers: DRAM, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (3)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 480-LBGA
  • Supplier Device Package: 408-TBGA (37.5x37.5)
Paquete: 480-LBGA
En existencias6.304
1 Core, 32-Bit
450MHz
Communications; RISC CPM
DRAM, SDRAM
No
-
10/100 Mbps (3)
-
USB 2.0 (1)
3.3V
0°C ~ 105°C (TA)
-
480-LBGA
408-TBGA (37.5x37.5)
hot Z8018006FSG
Zilog

IC MPU Z180 6MHZ 80QFP

  • Core Processor: Z80180
  • Number of Cores/Bus Width: 1 Core, 8-Bit
  • Speed: 6MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 5.0V
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Security Features: -
  • Package / Case: 80-BQFP
  • Supplier Device Package: 80-QFP
Paquete: 80-BQFP
En existencias6.160
1 Core, 8-Bit
6MHz
-
DRAM
No
-
-
-
-
5.0V
0°C ~ 70°C (TA)
-
80-BQFP
80-QFP
96MPXE-2.1-16M36
Advantech Corp

XEON 2.1G 16.5M 3647P 12C 4116 7

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
Paquete: -
En existencias4.976
-
-
-
-
-
-
-
-
-
-
-
-
-
-
MIMXRT1051CVL5B
NXP

I.MXRT1050 A1

  • Core Processor: ARM® Cortex®-M7
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 528MHz
  • Co-Processors/DSP: -
  • RAM Controllers: SDRAM
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: LCD
  • Ethernet: 10/100 Mbps (1)
  • SATA: -
  • USB: USB 2.0 OTG + PHY (2)
  • Voltage - I/O: 1.8V, 2.8V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TJ)
  • Security Features: BEE, DCP, HAB, SJC, SNVS, TRNG
  • Package / Case: 196-LFBGA
  • Supplier Device Package: 196-MAPBGA (10x10)
Paquete: 196-LFBGA
En existencias15.264
1 Core, 32-Bit
528MHz
-
SDRAM
Yes
LCD
10/100 Mbps (1)
-
USB 2.0 OTG + PHY (2)
1.8V, 2.8V, 3.3V
-40°C ~ 105°C (TJ)
BEE, DCP, HAB, SJC, SNVS, TRNG
196-LFBGA
196-MAPBGA (10x10)
STM32MP157CAB3
STMicroelectronics

MPU WITH ARM DUAL CORTEX-A7 650

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
Paquete: -
En existencias6.192
-
-
-
-
-
-
-
-
-
-
-
-
-
-
STM32MP151CAB3
STMicroelectronics

MPU WITH ARM CORTEX-A7 650 MHZ,

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
Paquete: -
En existencias7.680
-
-
-
-
-
-
-
-
-
-
-
-
-
-
S32G399ASCK1VUCR
NXP

8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2

  • Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
  • Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit
  • Speed: 400MHz, 1.3GHz
  • Co-Processors/DSP: Multimedia; NEON
  • RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 2.5Gbps (3)
  • SATA: -
  • USB: USB 2.0 OTG (1)
  • Voltage - I/O: 1.8V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
  • Package / Case: 525-FBGA, FCBGA
  • Supplier Device Package: 525-FCPBGA (19x19)
Paquete: -
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4 Core, 64-Bit/8 Core, 32-Bit
400MHz, 1.3GHz
Multimedia; NEON
DDR3L SDRAM, LPDDR4 DRAM
No
-
2.5Gbps (3)
-
USB 2.0 OTG (1)
1.8V, 3.3V
-40°C ~ 105°C (TA)
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
525-FBGA, FCBGA
525-FCPBGA (19x19)
HD64413ASFV
Renesas Electronics Corporation

GRAPHICS PROCESSOR

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
Paquete: -
Request a Quote
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R9A07G075M22GBA-AC0
Renesas Electronics Corporation

IC MPU RZ/T2M 600/800MHZ 225FBGA

  • Core Processor: ARM® Cortex®-R52
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 600MHz, 800MHz
  • Co-Processors/DSP: Multimedia; NEON™ SIMD
  • RAM Controllers: -
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000Mbps (2)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 1.8V, 3.3V
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Security Features: -
  • Package / Case: 225-LFBGA
  • Supplier Device Package: 225-FBGA (13x13)
Paquete: -
En existencias324
2 Core, 32-Bit
600MHz, 800MHz
Multimedia; NEON™ SIMD
-
No
-
10/100/1000Mbps (2)
-
USB 2.0 (1)
1.8V, 3.3V
-40°C ~ 125°C (TJ)
-
225-LFBGA
225-FBGA (13x13)
R9A07G044C26GBG-AC0
Renesas Electronics Corporation

IC MPU RZ 200MHZ/1.2GHZ 361BGA

  • Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
  • Number of Cores/Bus Width: 3 Core, 64-Bit
  • Speed: 200MHz, 1.2GHz
  • Co-Processors/DSP: ARM® Mali-G31
  • RAM Controllers: DDR3L, DDR4
  • Graphics Acceleration: No
  • Display & Interface Controllers: MIPI/CSI, MIPI/DSI
  • Ethernet: 10/100/1000Mbps (2)
  • SATA: -
  • USB: USB 2.0 (2)
  • Voltage - I/O: 1.8V, 3.3V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Security Features: AES, RSA, SHA-1, SHA-224, SHA-256, TRNG
  • Package / Case: 361-LFBGA
  • Supplier Device Package: 361-BGA (13x13)
Paquete: -
En existencias288
3 Core, 64-Bit
200MHz, 1.2GHz
ARM® Mali-G31
DDR3L, DDR4
No
MIPI/CSI, MIPI/DSI
10/100/1000Mbps (2)
-
USB 2.0 (2)
1.8V, 3.3V
-40°C ~ 85°C (TA)
AES, RSA, SHA-1, SHA-224, SHA-256, TRNG
361-LFBGA
361-BGA (13x13)
LX2120SE71826B
NXP

IC MPU QORLQ 1.8GHZ 1517FCPBGA

  • Core Processor: ARM® Cortex®-A72
  • Number of Cores/Bus Width: 12 Core, 64-Bit
  • Speed: 1.8GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR4
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: -
  • Ethernet: 100Gbps (2)
  • SATA: SATA 3.0 (4)
  • USB: USB 3.0 (2) + PHY (2)
  • Voltage - I/O: 1.2V, 1.8V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TJ)
  • Security Features: Secure Boot, TrustZone®
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCPBGA (40x40)
Paquete: -
Request a Quote
12 Core, 64-Bit
1.8GHz
-
DDR4
Yes
-
100Gbps (2)
SATA 3.0 (4)
USB 3.0 (2) + PHY (2)
1.2V, 1.8V, 3.3V
0°C ~ 105°C (TJ)
Secure Boot, TrustZone®
1517-BBGA, FCBGA
1517-FCPBGA (40x40)