Integrado - microcontrolador, microprocesador, módulos FPGA

TE0600-02IVF

Trenz Electronic GmbH

SOM GIGABEE XC6SLX150 2X128MB 3I

• Module/Board Type: FPGA
• Core Processor: Spartan-6 LX-150
• Co-Processor: -
• Speed: 125MHz
• Flash Size: 16MB
• RAM Size: 256MB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
• Operating Temperature: -40°C ~ 85°C

Paquete: -

CC-MX-LD79-QTC-1

Digi International

CONNECTCORE

• Module/Board Type: -
• Core Processor: -
• Co-Processor: -
• Speed: -
• Flash Size: -
• RAM Size: -
• Connector Type: -
• Size / Dimension: -
• Operating Temperature: -

Paquete: -

SOMDM3730-31-1780AKIR

Logic

SYSTEM ON MODULE WIRELESS TORP

• Module/Board Type: MPU, DSP Core
• Core Processor: ARM? Cortex?-A8, DM3730
• Co-Processor: TMS320C64x (DSP)
• Speed: 800MHz
• Flash Size: 512MB
• RAM Size: 256MB
• Connector Type: Board-to-Board (BTB) Socket - 200
• Size / Dimension: 0.59" x 1.3" (15mm x 33mm)
• Operating Temperature: -40°C ~ 85°C

Paquete: -

FS-3026

Digi International

MODULE 9P 64MB SDRAM 64MB FLASH

• Module/Board Type: -
• Core Processor: -
• Co-Processor: -
• Speed: -
• Flash Size: -
• RAM Size: -
• Connector Type: -
• Size / Dimension: -
• Operating Temperature: -

Paquete: -

CC-9C-V226-ZA-B

Digi International

MODULE 9C 32MB SDRAM 64MB FLASH

• Module/Board Type: MPU Core
• Core Processor: ARM926EJ-S, NS9360
• Co-Processor: -
• Speed: 155MHz
• Flash Size: 64MB
• RAM Size: 32MB
• Connector Type: SO-DIMM-144
• Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm)
• Operating Temperature: -40°C ~ 85°C

Paquete: -

CENGLH79524-10-403HCR

Logic

CARD ENGINE 16MB FLASH 32MB RAM

• Module/Board Type: MPU Core
• Core Processor: ARM720T, LH79524
• Co-Processor: -
• Speed: 77.4MHz
• Flash Size: 16MB
• RAM Size: 32MB
• Connector Type: SO-DIMM-144
• Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
• Operating Temperature: 0°C ~ 70°C

Paquete: -

FS-365

Digi International

MODULE A9M2410 32MB SDRAM FLASH

• Module/Board Type: -
• Core Processor: -
• Co-Processor: -
• Speed: -
• Flash Size: -
• RAM Size: -
• Connector Type: -
• Size / Dimension: -
• Operating Temperature: -

Paquete: -

101-0675

Digi International

MODULE RABBITCORE RCM3710

• Module/Board Type: MPU Core
• Core Processor: Rabbit 3000
• Co-Processor: -
• Speed: 22.1MHz
• Flash Size: 256KB
• RAM Size: 128KB
• Connector Type: IDC Header 2x20
• Size / Dimension: 1.2" x 2.95" (30mm x 75mm)
• Operating Temperature: 0°C ~ 70°C

Paquete: -

CC-MX-L86C-Z1

Digi International

MOD WI-I.MX6 50 PCS PACK

• Module/Board Type: MPU Core
• Core Processor: ARM? Cortex?-A9, i.MX6Dual
• Co-Processor: -
• Speed: 800MHz
• Flash Size: 4GB
• RAM Size: 512MB
• Connector Type: -
• Size / Dimension: 1.97" x 1.97" (50mm x 50mm)
• Operating Temperature: -40°C ~ 85°C

Paquete: -

DC-ME-01T-NS-50

Digi International

MODULE

• Module/Board Type: -
• Core Processor: -
• Co-Processor: -
• Speed: -
• Flash Size: -
• RAM Size: -
• Connector Type: -
• Size / Dimension: -
• Operating Temperature: -

Paquete: -

L138-FG-226-RC

Critical Link LLC

MITYDSP-L138F W/ OMAP-L138

• Module/Board Type: MPU, DSP, FPGA Core
• Core Processor: ARM926EJ-S, OMAP-L138
• Co-Processor: TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA)
• Speed: 456MHz
• Flash Size: 512MB (NAND), 8MB (NOR)
• RAM Size: 8KB (Internal MPU), 256KB (Internal DSP), 256MB (External)
• Connector Type: SO-DIMM-200
• Size / Dimension: 2.66" x 2" (67.6mm x 50.8mm)
• Operating Temperature: 0°C ~ 70°C

Paquete: -

CC-MX-LC47-Z1

Digi International

MODULE I.MX51 I.MX512 800MHZ

• Module/Board Type: -
• Core Processor: -
• Co-Processor: -
• Speed: -
• Flash Size: -
• RAM Size: -
• Connector Type: -
• Size / Dimension: -
• Operating Temperature: -

Paquete: -

DC-ME-01T-JT

Digi International

MODULE ME CUSTOMIZABLE JTAG

• Module/Board Type: MPU Core
• Core Processor: ARM7TDMI, NS7520
• Co-Processor: -
• Speed: 55MHz
• Flash Size: 2MB
• RAM Size: 8MB
• Connector Type: RJ45
• Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
• Operating Temperature: -40°C ~ 85°C

Paquete: -

100-1254-2

Bluetechnix GmbH

MODULE BF527-C-C-Q50S64F8

• Module/Board Type: MPU Core
• Core Processor: CM-BF527
• Co-Processor: -
• Speed: 600MHz
• Flash Size: 8MB
• RAM Size: 64MB
• Connector Type: Expansion 2 x 60
• Size / Dimension: 1.22" x 1.42" (31mm x 36mm)
• Operating Temperature: 0°C ~ 70°C

Paquete: -

CC-MX-K650-Z1-1

Digi International

RF MODULE CONNECTCORE

• Module/Board Type: -
• Core Processor: -
• Co-Processor: -
• Speed: -
• Flash Size: -
• RAM Size: -
• Connector Type: -
• Size / Dimension: -
• Operating Temperature: -

Paquete: -

TE0713-01-200-2C

Trenz Electronic GmbH

SOM ARTIX-7 XC7A200T-2C 1GB DDR3

• Module/Board Type: FPGA Core
• Core Processor: Artix-7 A200T
• Co-Processor: -
• Speed: 200MHz
• Flash Size: 32MB
• RAM Size: 1GB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
• Operating Temperature: 0°C ~ 70°C

Paquete: -

ATSAMA5D27-SOM1

Microchip Technology

SAMA5D2 SYST.ON MODULE 1

• Module/Board Type: MPU Core
• Core Processor: ARM® Cortex®-A5
• Co-Processor: -
• Speed: 500MHz
• Flash Size: 64Mb Flash, 1Kb EEPROM
• RAM Size: 1Gb (128K x 8)
• Connector Type: Edge Connector
• Size / Dimension: 1.18" x 1.57" (30mm x 40mm)
• Operating Temperature: -40°C ~ 85°C (TA)

Paquete: -

TE0803-02-04EG-1E3

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

• Module/Board Type: MPU Core
• Core Processor: Zynq UltraScale+ XCZU4EG-1SFVC784E
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 2GB
• Connector Type: B2B
• Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
• Operating Temperature: 0°C ~ 85°C

Paquete: -

A10S-P9-X5E-RC-SA

Critical Link LLC

IC MODULE CORTEX-A9 1.2GHZ 6GB

• Module/Board Type: MPU, FPGA Core
• Core Processor: ARM® Cortex®-A9, Arria 10 SX
• Co-Processor: NEON™ SIMD
• Speed: 1.2GHz
• Flash Size: -
• RAM Size: 6GB
• Connector Type: Board-to-Board (BTB)
• Size / Dimension: 4" x 4" (101.5mm x 101.5mm)
• Operating Temperature: 0°C ~ 70°C

Paquete: -

TE0725LP-01-72C-1T

Trenz Electronic GmbH

IC MOD ARTIX-7 A100T 25MHZ 64MB

• Module/Board Type: FPGA Core
• Core Processor: Artix-7 A100T
• Co-Processor: -
• Speed: 25MHz
• Flash Size: 64MB
• RAM Size: -
• Connector Type: 50 Pin
• Size / Dimension: 2.87" x 1.38" (73mm x 35mm)
• Operating Temperature: 0°C ~ 70°C

Paquete: -

L138-FG-325-RC

Critical Link LLC

MITYDSP-L138F SOM W/ OMAP-L138

• Module/Board Type: MPU, DSP, FPGA Core
• Core Processor: ARM926EJ-S, OMAP-L138
• Co-Processor: TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA)
• Speed: 456MHz
• Flash Size: 256MB (NAND), 16MB (NOR)
• RAM Size: 128MB
• Connector Type: SO-DIMM-200
• Size / Dimension: 2.660" L x 2.000" W (67.60mm x 50.80mm)
• Operating Temperature: 0°C ~ 70°C

Paquete: -

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MYC-C7Z020-V2-4E1D-766-I

MYIR Tech Limited

System-On-Module, Zynq-7020

• Module/Board Type: MPU, FPGA
• Core Processor: ARM® Cortex®-A9
• Co-Processor: Zynq-7000 (Z-7020)
• Speed: 866MHz
• Flash Size: 4GB eMMC, 32MB QSPI
• RAM Size: 1GB
• Connector Type: Pin(s)
• Size / Dimension: 2.953" L x 2.165" W (75.00mm x 55.00mm)
• Operating Temperature: -40°C ~ 85°C

Paquete: -

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CR00107-01

Trenz Electronic GmbH

CRUVI CARRIER BOARD WITH AMD SPA

• Module/Board Type: FPGA
• Core Processor: Spartan-7
• Co-Processor: -
• Speed: 100MHz
• Flash Size: 32MB QSPI
• RAM Size: 8MB
• Connector Type: USB
• Size / Dimension: 2.264" L x 1.766" W (57.50mm x 44.85mm)
• Operating Temperature: -

Paquete: -

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TE0724-04-61I32-A

Trenz Electronic GmbH

SOC MODULE WITH XILINX ZYNQ XC7Z

• Module/Board Type: MPU Core
• Core Processor: Zynq™ XC7Z020-1CLG400I
• Co-Processor: ARM Cortex-A9
• Speed: 667MHz
• Flash Size: 32MB
• RAM Size: 1GB
• Connector Type: 1 x 160 Pin
• Size / Dimension: 2.362" L x 1.575" W (60.00mm x 40.00mm)
• Operating Temperature: -40°C ~ 85°C

Paquete: -

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TE0820-05-2BI81ML

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

• Module/Board Type: -
• Core Processor: -
• Co-Processor: -
• Speed: -
• Flash Size: -
• RAM Size: -
• Connector Type: -
• Size / Dimension: -
• Operating Temperature: -

Paquete: -

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TE0813-02-4AE81-A

Trenz Electronic GmbH

MPSOC MODULE WITH AMD ZYNQ ULTRA

• Module/Board Type: MPU Core
• Core Processor: Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 4GB
• Connector Type: Board-to-Board (BTB) Socket - 4 x 240
• Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
• Operating Temperature: 0°C ~ 85°C

Paquete: -

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TE0821-01-3BE21ML

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

• Module/Board Type: MPU Core
• Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
• Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
• Speed: -
• Flash Size: 128MB
• RAM Size: 2GB
• Connector Type: 2 x 100 Pin
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: 0°C ~ 85°C

Paquete: -

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TEM0007-01-CAA11-A

Trenz Electronic GmbH

MICROCHIP POLARFIRE SOC FPGA 25T

• Module/Board Type: FPGA
• Core Processor: -
• Co-Processor: -
• Speed: -
• Flash Size: 64MB
• RAM Size: 1GB
• Connector Type: B2B
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: -

Paquete: -

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