Página 11 - Integrado - microcontrolador, microprocesador, módulos FPGA | Circuitos integrados | Heisener Electronics
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Integrado - microcontrolador, microprocesador, módulos FPGA

Registros 1.650
Página  11/59
Imagen
Nº de pieza
Fabricantes
Descripción
Paquete
En existencias
Cantidad
Core Processor
Co-Processor
Speed
Flash Size
RAM Size
Connector Type
Size / Dimension
Operating Temperature
CC-9C-V226-Z1-B
Digi International

MODULE 9C 32MB SDRAM 64MB FLASH

  • Module/Board Type: MPU Core
  • Core Processor: ARM926EJ-S, NS9360
  • Co-Processor: -
  • Speed: 155MHz
  • Flash Size: 64MB
  • RAM Size: 32MB
  • Connector Type: SO-DIMM-144
  • Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm)
  • Operating Temperature: -40°C ~ 85°C
Paquete: -
En existencias5.488
ARM926EJ-S, NS9360
-
155MHz
64MB
32MB
SO-DIMM-144
3.59" x 2.06" (91.2mm x 52.2mm)
-40°C ~ 85°C
CENGPXA270-416-10-550HIR
Logic

CARD ENGING 64MB SDRAM

  • Module/Board Type: MCU Core
  • Core Processor: PXA270
  • Co-Processor: -
  • Speed: 416MHz
  • Flash Size: 64MB
  • RAM Size: 64MB
  • Connector Type: SO-DIMM-144
  • Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
  • Operating Temperature: -40°C ~ 85°C
Paquete: -
En existencias6.912
PXA270
-
416MHz
64MB
64MB
SO-DIMM-144
2.37" x 2.67" (60.2mm x 67.8mm)
-40°C ~ 85°C
FS-3001
Digi International

MODULE 32MB SDRAM 32MB FLASH

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
Paquete: -
En existencias6.672
-
-
-
-
-
-
-
-
SOMLX800-11-000GC
Logic

MODULE SOM LX800 GEODE WO/SODIMM

  • Module/Board Type: MPU Core
  • Core Processor: Geode, LX 800
  • Co-Processor: -
  • Speed: 500MHz
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: 3.78" x 4.53" (96mm x 115mm)
  • Operating Temperature: 0°C ~ 70°C
Paquete: -
En existencias5.808
Geode, LX 800
-
500MHz
-
-
-
3.78" x 4.53" (96mm x 115mm)
0°C ~ 70°C
CENGLH7A404-11-402EC
Logic

CARD ENGINE 32MB SDRAM

  • Module/Board Type: MPU Core
  • Core Processor: ARM922T, LH7A404
  • Co-Processor: -
  • Speed: 200MHz
  • Flash Size: 16MB
  • RAM Size: 64MB
  • Connector Type: SO-DIMM-144
  • Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
  • Operating Temperature: 0°C ~ 70°C
Paquete: -
En existencias4.768
ARM922T, LH7A404
-
200MHz
16MB
64MB
SO-DIMM-144
2.37" x 2.67" (60.2mm x 67.8mm)
0°C ~ 70°C
TE0630-01IBF
Trenz Electronic GmbH

SOM SPARTAN-6 1GB DDR3

  • Module/Board Type: FPGA, USB Core
  • Core Processor: Spartan-6 LX-75
  • Co-Processor: Cypress EZ-USB FX2LP
  • Speed: 100MHz
  • Flash Size: 8MB
  • RAM Size: 128MB
  • Connector Type: B2B
  • Size / Dimension: 1.6" x 1.9" (40.5mm x 47.5mm)
  • Operating Temperature: -40°C ~ 85°C
Paquete: -
En existencias4.784
Spartan-6 LX-75
Cypress EZ-USB FX2LP
100MHz
8MB
128MB
B2B
1.6" x 1.9" (40.5mm x 47.5mm)
-40°C ~ 85°C
1808-FG-225-RC
Critical Link LLC

MITYSOM-1808F SOM AM1808

  • Module/Board Type: MPU, FPGA Core
  • Core Processor: ARM926EJ-S, AM1808
  • Co-Processor: Spartan-6, XC6SLX16
  • Speed: 456MHz
  • Flash Size: 256MB (NAND), 8MB (NOR)
  • RAM Size: 8KB (Internal), 128MB (External)
  • Connector Type: SO-DIMM-200
  • Size / Dimension: 2.66" x 2" (67.6mm x 50.8mm)
  • Operating Temperature: 0°C ~ 70°C
Paquete: -
En existencias6.752
ARM926EJ-S, AM1808
Spartan-6, XC6SLX16
456MHz
256MB (NAND), 8MB (NOR)
8KB (Internal), 128MB (External)
SO-DIMM-200
2.66" x 2" (67.6mm x 50.8mm)
0°C ~ 70°C
L138-FX-225-RC
Critical Link LLC

MITYDSP-L138 SOM OMAP-L138

  • Module/Board Type: MPU, DSP Core
  • Core Processor: ARM926EJ-S, OMAP-L138
  • Co-Processor: TMS320C674x (DSP)
  • Speed: 456MHz
  • Flash Size: 256MB (NAND), 8MB (NOR)
  • RAM Size: 8KB (Internal MPU), 256KB (Internal DSP), 128MB (External)
  • Connector Type: SO-DIMM-200
  • Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm)
  • Operating Temperature: 0°C ~ 70°C
Paquete: -
En existencias7.792
ARM926EJ-S, OMAP-L138
TMS320C674x (DSP)
456MHz
256MB (NAND), 8MB (NOR)
8KB (Internal MPU), 256KB (Internal DSP), 128MB (External)
SO-DIMM-200
2.66" x 1.5" (67.6mm x 38.1mm)
0°C ~ 70°C
TE0720-03-1CR
Trenz Electronic GmbH

SOM SOC 7Z020-1CLG484C 256MB DDR

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7020)
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: 0°C ~ 70°C
Paquete: -
En existencias7.072
ARM Cortex-A9
Zynq-7000 (Z-7020)
-
32MB
1GB
Samtec LSHM
1.97" x 1.57" (50mm x 40mm)
0°C ~ 70°C
CC-MX-L86C-Z1-1
Digi International

MOD WI-I.MX6

  • Module/Board Type: MPU Core
  • Core Processor: ARM? Cortex?-A9, i.MX6Dual
  • Co-Processor: -
  • Speed: 800MHz
  • Flash Size: 4GB
  • RAM Size: 512MB
  • Connector Type: -
  • Size / Dimension: 1.97" x 1.97" (50mm x 50mm)
  • Operating Temperature: -40°C ~ 85°C
Paquete: -
En existencias5.056
ARM? Cortex?-A9, i.MX6Dual
-
800MHz
4GB
512MB
-
1.97" x 1.97" (50mm x 50mm)
-40°C ~ 85°C
CC-9C-V212-Z6
Digi International

MODULE 9C 16MB SDRAM 4MB FLASH

  • Module/Board Type: MPU Core
  • Core Processor: ARM926EJ-S, NS9360
  • Co-Processor: -
  • Speed: 155MHz
  • Flash Size: 4MB
  • RAM Size: 16MB
  • Connector Type: SO-DIMM-144
  • Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm)
  • Operating Temperature: -40°C ~ 85°C
Paquete: -
En existencias3.872
ARM926EJ-S, NS9360
-
155MHz
4MB
16MB
SO-DIMM-144
3.59" x 2.06" (91.2mm x 52.2mm)
-40°C ~ 85°C
20-101-1132
Digi International

MODULE RCM4210 RABBITCORE

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 4000
  • Co-Processor: -
  • Speed: 29.49MHz
  • Flash Size: 512KB (Internal), 4MB (External)
  • RAM Size: 512KB
  • Connector Type: IDC Header 2x25, 2x5
  • Size / Dimension: 1.84" x 2.42" (47mm x 61mm)
  • Operating Temperature: -40°C ~ 85°C
Paquete: -
En existencias7.744
Rabbit 4000
-
29.49MHz
512KB (Internal), 4MB (External)
512KB
IDC Header 2x25, 2x5
1.84" x 2.42" (47mm x 61mm)
-40°C ~ 85°C
TE0820-02-03EG-1EA
Trenz Electronic GmbH

SOM USCALE+ XCZU3EG-1S 1GB DDR4

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
Paquete: -
En existencias5.360
-
-
-
-
-
-
-
-
SOMAM1808-10-1503QHCR
Logic

AM1808 SOM-M1

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
Paquete: -
En existencias6.120
-
-
-
-
-
-
-
-
AM0010-02-5DE21MA
Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

  • Module/Board Type: MPU Core
  • Core Processor: Zynq™ UltraScale+™ ZU5EV-1E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 4GB
  • Connector Type: Board-to-Board (BTB) Socket
  • Size / Dimension: 2.220" L x 1.575" W (56.40mm x 40.00mm)
  • Operating Temperature: 0°C ~ 85°C
Paquete: -
Request a Quote
Zynq™ UltraScale+™ ZU5EV-1E
-
-
128MB
4GB
Board-to-Board (BTB) Socket
2.220" L x 1.575" W (56.40mm x 40.00mm)
0°C ~ 85°C
TE0600-03-52I11-C
Trenz Electronic GmbH

IC MODULE GIGABEE

  • Module/Board Type: FPGA Core
  • Core Processor: Spartan-6 LX-45
  • Co-Processor: -
  • Speed: 125MHz
  • Flash Size: 16MB
  • RAM Size: 256MB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
Paquete: -
Request a Quote
Spartan-6 LX-45
-
125MHz
16MB
256MB
Samtec LSHM
1.970" L x 1.570" W (50.00mm x 40.00mm)
-40°C ~ 85°C
TE0714-04-42I-7-C
Trenz Electronic GmbH

IC MODULE ARTIX-7

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
Paquete: -
Request a Quote
-
-
-
-
-
-
-
-
CC-WMX-ET7D-NN
Digi

CONNECTCORE 8 MINI SOM WIRELESS

  • Module/Board Type: MPU Core
  • Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4, i.MX8
  • Co-Processor: -
  • Speed: 1.6GHz
  • Flash Size: -
  • RAM Size: 1GB
  • Connector Type: USB
  • Size / Dimension: 1.770" L x 1.570" W (45.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
Paquete: -
Request a Quote
ARM® Cortex®-A53, ARM® Cortex®-M4, i.MX8
-
1.6GHz
-
1GB
USB
1.770" L x 1.570" W (45.00mm x 40.00mm)
-40°C ~ 85°C
TE0808-04-6BE21-L
Trenz Electronic GmbH

IC MOD SOM MPSOC 4GB XCZU6EG

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 4GB
  • Connector Type: B2B
  • Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature: 0°C ~ 85°C
Paquete: -
Request a Quote
Zynq UltraScale+ XCZU6EG-1FFVC900E
-
-
128MB
4GB
B2B
2.050" L x 2.990" W (52.00mm x 76.00mm)
0°C ~ 85°C
A20-SOM204-1G-M
Olimex LTD

IC

  • Module/Board Type: MPU Core
  • Core Processor: ARM® Cortex®-A7
  • Co-Processor: -
  • Speed: 1GHz
  • Flash Size: 16MB
  • RAM Size: 1GB
  • Connector Type: 204 Pin
  • Size / Dimension: 3.307" L x 2.638" W (84.00mm x 67.00mm)
  • Operating Temperature: 0°C ~ 70°C
Paquete: -
Request a Quote
ARM® Cortex®-A7
-
1GHz
16MB
1GB
204 Pin
3.307" L x 2.638" W (84.00mm x 67.00mm)
0°C ~ 70°C
TE0720-03-31C33MA
Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7014S)
  • Speed: 766MHz
  • Flash Size: 8GB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: 0°C ~ 70°C
Paquete: -
Request a Quote
ARM Cortex-A9
Zynq-7000 (Z-7014S)
766MHz
8GB
1GB
Samtec LSHM
1.970" L x 1.570" W (50.00mm x 40.00mm)
0°C ~ 70°C
TE0745-03-82I31-A
Trenz Electronic GmbH

SOM WITH AMD ZYNQ 7035-2I, 1 GBY

  • Module/Board Type: MPU Core
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Xilinx Zynq 7035 SoC XC7Z035-2FBG676I
  • Speed: -
  • Flash Size: 64MB
  • RAM Size: 1GB
  • Connector Type: Board-to-Board (BTB) Socket - 250
  • Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature: -40°C ~ 85°C
Paquete: -
Request a Quote
ARM Cortex-A9
Xilinx Zynq 7035 SoC XC7Z035-2FBG676I
-
64MB
1GB
Board-to-Board (BTB) Socket - 250
2.990" L x 2.050" W (76.00mm x 52.00mm)
-40°C ~ 85°C
L138-DG-325-RI
Critical Link LLC

MITYDSP-L138F SOM W/ OMAP-L138

  • Module/Board Type: MPU, DSP, FPGA Core
  • Core Processor: ARM926EJ-S, OMAP-L138
  • Co-Processor: TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA)
  • Speed: 375MHz
  • Flash Size: 256MB (NAND), 16MB (NOR)
  • RAM Size: 128MB
  • Connector Type: SO-DIMM-200
  • Size / Dimension: 2.660" L x 2.000" W (67.60mm x 50.80mm)
  • Operating Temperature: -40°C ~ 85°C
Paquete: -
Request a Quote
ARM926EJ-S, OMAP-L138
TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA)
375MHz
256MB (NAND), 16MB (NOR)
128MB
SO-DIMM-200
2.660" L x 2.000" W (67.60mm x 50.80mm)
-40°C ~ 85°C
TE0712-02-71I36-A
Trenz Electronic GmbH

FPGA MODULE ARTIX7

  • Module/Board Type: FPGA Core
  • Core Processor: Artix-7 A100T
  • Co-Processor: -
  • Speed: 200MHz
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
Paquete: -
Request a Quote
Artix-7 A100T
-
200MHz
32MB
1GB
Samtec LSHM
1.970" L x 1.570" W (50.00mm x 40.00mm)
-40°C ~ 85°C
TE0630-03-82I12-A
Trenz Electronic GmbH

FPGA MODULE WITH AMD SPARTAN 6 L

  • Module/Board Type: FPGA
  • Core Processor: Xilinx Spartan™ 6 XC6SLX150-2CSG484I
  • Co-Processor: -
  • Speed: -
  • Flash Size: 8MB
  • RAM Size: 128MB
  • Connector Type: Board-to-Board (BTB) Socket - 80
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
Paquete: -
Request a Quote
Xilinx Spartan™ 6 XC6SLX150-2CSG484I
-
-
8MB
128MB
Board-to-Board (BTB) Socket - 80
1.970" L x 1.570" W (50.00mm x 40.00mm)
-40°C ~ 85°C
TE0600-04-72C11-A
Trenz Electronic GmbH

IC MODULE GIGABEE

  • Module/Board Type: FPGA
  • Core Processor: Xilinx Spartan™ 6 XC6SLX100-2FGG484C
  • Co-Processor: -
  • Speed: 125MHz
  • Flash Size: 16MB
  • RAM Size: 128MB
  • Connector Type: B2B
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: 0°C ~ 70°C
Paquete: -
Request a Quote
Xilinx Spartan™ 6 XC6SLX100-2FGG484C
-
125MHz
16MB
128MB
B2B
1.970" L x 1.570" W (50.00mm x 40.00mm)
0°C ~ 70°C
MCV-X2DB
ARIES Embedded

SoM CycloneV SoC-FPGA

  • Module/Board Type: FPGA
  • Core Processor: ARM Cortex-A9 (Dual Core)
  • Co-Processor: -
  • Speed: 800MHz
  • Flash Size: 4GB
  • RAM Size: 1GB
  • Connector Type: 360 Pin
  • Size / Dimension: 2.910" L x 1.650" W (74.00mm x 42.00mm)
  • Operating Temperature: 0°C ~ 70°C
Paquete: -
Request a Quote
ARM Cortex-A9 (Dual Core)
-
800MHz
4GB
1GB
360 Pin
2.910" L x 1.650" W (74.00mm x 42.00mm)
0°C ~ 70°C
IW-G30M-C7CG-4E004G-E008G-BIA
iWave Systems

ZU7CG (-1 Speed) MPSoC SOM

  • Module/Board Type: MPU, FPGA
  • Core Processor: ARM® Cortex®-A53(x40, ARM® Cortex®-R5(x2)
  • Co-Processor: ARM® Mali 400 MP2
  • Speed: 1.5GHz, 600MHz
  • Flash Size: 8GB eMMC
  • RAM Size: 4GB, 1GB
  • Connector Type: 2 x 240 Pin
  • Size / Dimension: 4.330" L x 2.950" W (110.00mm x 75.00mm)
  • Operating Temperature: -40°C ~ 85°C
Paquete: -
Request a Quote
ARM® Cortex®-A53(x40, ARM® Cortex®-R5(x2)
ARM® Mali 400 MP2
1.5GHz, 600MHz
8GB eMMC
4GB, 1GB
2 x 240 Pin
4.330" L x 2.950" W (110.00mm x 75.00mm)
-40°C ~ 85°C