Imagen |
Nº de pieza |
Fabricantes |
Descripción |
Paquete |
En existencias |
Cantidad |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ON Semiconductor |
IC CLK BUF 140MHZ 3.3V
|
Paquete: 8-SOIC (0.154", 3.90mm Width) |
En existencias6.960 |
|
1 | 1:4 | No/No | Clock | Clock | 140MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 1GHZ 8SOIC
|
Paquete: 8-SOIC (0.154", 3.90mm Width) |
En existencias2.784 |
|
1 | 1:2 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | ECL, LVPECL | 1GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 100MHZ 20QSOP
|
Paquete: 20-SSOP (0.154", 3.90mm Width) |
En existencias5.136 |
|
2 | 1:5 | No/No | LVCMOS | LVCMOS | 100MHz | 3.13 V ~ 3.46 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 266MHZ 20TSSOP
|
Paquete: 20-TSSOP (0.173", 4.40mm Width) |
En existencias15.012 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL | LVPECL | 266MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTPX 4:1 2.8GHZ 16TSSOP
|
Paquete: 16-TSSOP (0.173", 4.40mm Width) |
En existencias7.936 |
|
1 | 4:1 | Yes/Yes | CML, LVDS, LVPECL, SSTL | LVDS | 2.8GHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 2.7GHZ 20TSSOP
|
Paquete: 20-TSSOP (0.173", 4.40mm Width) |
En existencias4.192 |
|
1 | 2:4 | Yes/Yes | ECL, HSTL, LVPECL | ECL, LVPECL | 2.7GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:9 2GHZ 28PLCC
|
Paquete: 28-LCC (J-Lead) |
En existencias5.696 |
|
1 | 1:9 | Yes/Yes | CML, LVDS, LVPECL, SSTL | ECL, LVPECL | 2GHz | 3 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.5x11.5) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:18 200MHZ 32TQFP
|
Paquete: 32-LQFP |
En existencias3.136 |
|
1 | 2:18 | Yes/No | HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, LVTTL, SSTL | LVCMOS, LVTTL | 200MHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 156MHZ 8SOIC
|
Paquete: 8-SOIC (0.154", 3.90mm Width) |
En existencias5.056 |
|
1 | 1:2 | No/No | CMOS | 3-State, CMOS | 156MHz | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
NXP |
IC CLK BUFFER 1:10 400MHZ 20SSOP
|
Paquete: 20-SSOP (0.154", 3.90mm Width) |
En existencias5.312 |
|
1 | 1:10 | No/No | LVCMOS, LVTTL | LVTTL | 400MHz | 2.3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-SSOP |
||
Microchip Technology |
IC CLK BUFFER 2:10 1GHZ 64TQFP
|
Paquete: 64-TQFP Exposed Pad |
En existencias5.184 |
|
2 | 2:10 | Yes/Yes | LVDS, PECL | LVDS | 1GHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUF 4:20/2:10 64TQFP
|
Paquete: 64-TQFP Exposed Pad |
En existencias16.188 |
|
1 or 2 | 4:20, 2:10 | Yes/Yes | HSTL, LVPECL | HSTL | 500MHz | 3.3 V ~ 3.47 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 2:4 16SOIC
|
Paquete: 16-SOIC (0.154", 3.90mm Width) |
En existencias5.984 |
|
1 | 2:4 | Yes/Yes | ECL, PECL | ECL, PECL | - | 3 V ~ 3.8 V | 0°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
Paquete: 28-LCC (J-Lead) |
En existencias4.176 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 4.2 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Diodes Incorporated |
IC CLK BUFFER 1:10 156MHZ 20SOIC
|
Paquete: 20-SOIC (0.295", 7.50mm Width) |
En existencias7.280 |
|
1 | 1:10 | No/No | CMOS, TTL | CMOS, TTL | 156MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:16 500MHZ 48TQFP
|
Paquete: 48-TQFP |
En existencias4.752 |
|
1 | 1:16 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 500MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 48-TQFP | 48-TQFP (7x7) |
||
ON Semiconductor |
IC CLK BUFFER 2:4 1GHZ 20SOIC
|
Paquete: 20-SOIC (0.295", 7.50mm Width) |
En existencias6.480 |
|
1 | 2:4 | Yes/Yes | ECL | ECL | 1GHz | 3 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microsemi Corporation |
IC CLK BUFFER 2:6 750MHZ 32QFN
|
Paquete: 32-VFQFN Exposed Pad |
En existencias4.864 |
|
1 | 2:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Silicon Labs |
IC TRANSLATOR BUFF/LEVEL 44QFN
|
Paquete: 44-VFQFN Exposed Pad |
En existencias2.976 |
|
2 | 1:5 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | CML, HCSL, LVCMOS, LVDS, LVPECL | 725MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 44-VFQFN Exposed Pad | 44-QFN (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 1:10 166MHZ 20TSSOP
|
Paquete: 20-TSSOP (0.173", 4.40mm Width) |
En existencias6.592 |
|
1 | 1:10 | No/No | LVTTL | CMOS, TTL | 166MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER TCXO 6UMLP
|
Paquete: - |
En existencias3.872 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Texas Instruments |
IC CLK BUFFER 2:2 75MHZ 8WSON
|
Paquete: 8-WFDFN Exposed Pad |
En existencias7.488 |
|
1 | 2:2 | No/No | Clock | Clock | 75MHz | 2.4 V ~ 5 V | -40°C ~ 85°C | Surface Mount | 8-WFDFN Exposed Pad | 8-WSON (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:8 5.5GHZ 32MLF
|
Paquete: 32-VFQFN Exposed Pad, 32-MLF? |
En existencias7.044 |
|
1 | 1:8 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 5.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
IDT, Integrated Device Technology Inc |
IC NETWORK TIMING VFQFPN
|
Paquete: 24-VFQFN Exposed Pad |
En existencias4.704 |
|
2 | 2:1, 1:2 | Yes/Yes | LVDS, LVPECL, SSTL | LVDS | 1.75GHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-VFQFPN (4x4) |
||
onsemi |
IC CLK BUFFER 1:2 1.5GHZ 8-TSSOP
|
Paquete: - |
Request a Quote |
|
- | 1:2 | - | - | - | - | - | - | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-TSSOP |
||
Skyworks Solutions Inc. |
IC CLK BUFFER 2:8 100MHZ 40QFN
|
Paquete: - |
Request a Quote |
|
1 | 2:8 | Yes/Yes | HCSL | HCSL | 100 MHz | 1.71V ~ 3.46V | -40°C ~ 105°C (TA) | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (6x6) |
||
Renesas Electronics Corporation |
IC CLK BUFFER 1:3 200MHZ 10DFN
|
Paquete: - |
Request a Quote |
|
1 | 1:3 | No/No | LVCMOS | LVCMOS | 200 MHz | 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 105°C (TA) | Surface Mount | 10-WFDFN Exposed Pad | 10-DFN (2x2) |
||
SiTime |
-40C TO 85C, 8PIN, 2020, 1.8V-3.
|
Paquete: - |
Request a Quote |
|
1 | 1:4 | No/No | Clock | LVCMOS | 200 MHz | 1.8V ~ 3.3V | -40°C ~ 105°C (TA) | Surface Mount | 8-WFDFN | 8-DFN (2x2) |