Página 7 - Sockets for ICs, Transistors | Conectores, interconectores | Heisener Electronics
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Sockets for ICs, Transistors

Registros 11.083
Página  7/396
Imagen
Nº de pieza
Fabricantes
Descripción
Paquete
En existencias
Cantidad
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
540-99-032-17-400000
Mill-Max Manufacturing Corp.

CONN SOCKET PLCC 32POS TIN-LEAD

  • Type: PLCC
  • Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9)
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: Tin-Lead
  • Contact Finish Thickness - Mating: 200µin (5.08µm)
  • Contact Material - Mating: -
  • Mounting Type: Surface Mount
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin-Lead
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: -
  • Housing Material: Polyphenylene Sulfide (PPS)
  • Operating Temperature: -
Paquete: -
En existencias8.154
32 (2 x 7, 2 x 9)
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
-
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
-
Polyphenylene Sulfide (PPS)
-
441-PGG21001-40
Aries Electronics

CONN SOCKET PGA GOLD

  • Type: PGA
  • Number of Positions or Pins (Grid): -
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: -
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
Paquete: -
En existencias3.024
-
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
233-PGM18039-51
Aries Electronics

CONN SOCKET PGA GOLD

  • Type: PGA
  • Number of Positions or Pins (Grid): -
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: -
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
Paquete: -
En existencias7.362
-
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
33-0511-11
Aries Electronics

CONN SOCKET SIP 33POS GOLD

  • Type: SIP
  • Number of Positions or Pins (Grid): 33 (1 x 33)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: -
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
Paquete: -
En existencias5.040
33 (1 x 33)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Through Hole
-
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
32-7553-10
Aries Electronics

CONN SOCKET SIP 32POS TIN

  • Type: SIP
  • Number of Positions or Pins (Grid): 32 (1 x 32)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 200µin (5.08µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Elevated
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
Paquete: -
En existencias6.894
32 (1 x 32)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Phosphor Bronze
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
13-0511-11
Aries Electronics

CONN SOCKET SIP 13POS GOLD

  • Type: SIP
  • Number of Positions or Pins (Grid): 13 (1 x 13)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: -
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
Paquete: -
En existencias4.068
13 (1 x 13)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Through Hole
-
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
36-3552-10
Aries Electronics

CONN IC DIP SOCKET ZIF 36POS TIN

  • Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 36 (2 x 18)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 200µin (5.08µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
  • Operating Temperature: -
Paquete: -
En existencias2.934
36 (2 x 18)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
14-7470-10
Aries Electronics

CONN SOCKET SIP 14POS TIN

  • Type: SIP
  • Number of Positions or Pins (Grid): 14 (1 x 14)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 200µin (5.08µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Elevated
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
Paquete: -
En existencias5.940
14 (1 x 14)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Phosphor Bronze
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
18-8375-310C
Aries Electronics

CONN IC DIP SOCKET 18POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 18 (2 x 9)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame, Elevated
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
Paquete: -
En existencias2.934
18 (2 x 9)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame, Elevated
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
14-8620-310C
Aries Electronics

CONN IC DIP SOCKET 14POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 14 (2 x 7)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame, Elevated
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
Paquete: -
En existencias7.164
14 (2 x 7)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame, Elevated
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
16-822-90
Aries Electronics

CONN IC DIP SOCKET 16POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 16 (2 x 8)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole, Right Angle, Horizontal
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Polyamide (PA46), Nylon 4/6
  • Operating Temperature: -
Paquete: -
En existencias3.960
16 (2 x 8)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6
-
10-8563-610C
Aries Electronics

CONN IC DIP SOCKET 10POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 10 (2 x 5)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame, Elevated
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
Paquete: -
En existencias3.636
10 (2 x 5)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame, Elevated
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
510-87-181-14-031101
Preci-Dip

CONN SOCKET PGA 181POS GOLD

  • Type: PGA
  • Number of Positions or Pins (Grid): 181 (14 x 14)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: Flash
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
Paquete: -
En existencias3.798
181 (14 x 14)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
510-83-101-11-001101
Preci-Dip

CONN SOCKET PGA 101POS GOLD

  • Type: PGA
  • Number of Positions or Pins (Grid): 101 (11 x 11)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
Paquete: -
En existencias7.524
101 (11 x 11)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
15-0511-10
Aries Electronics

CONN SOCKET SIP 15POS TIN

  • Type: SIP
  • Number of Positions or Pins (Grid): 15 (1 x 15)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 50µin (1.27µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: -
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 50µin (1.27µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
Paquete: -
En existencias4.302
15 (1 x 15)
0.100" (2.54mm)
Tin
50µin (1.27µm)
Phosphor Bronze
Through Hole
-
Solder
0.100" (2.54mm)
Tin
50µin (1.27µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
XR2A3221N
Omron Electronics Inc-EMC Div

CONN IC DIP SOCKET 32POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 32 (2 x 16)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Threaded
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Brass
  • Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
  • Operating Temperature: -55°C ~ 125°C
Paquete: -
En existencias5.346
32 (2 x 16)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Threaded
Open Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Brass
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
23-0513-11
Aries Electronics

CONN SOCKET SIP 23POS GOLD

  • Type: SIP
  • Number of Positions or Pins (Grid): 23 (1 x 23)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: -
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -
Paquete: -
En existencias8.766
23 (1 x 23)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
4-1571551-9
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 28POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 28 (2 x 14)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 25µin (0.63µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 25µin (0.63µm)
  • Contact Material - Post: Nickel
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
  • Operating Temperature: -55°C ~ 125°C
Paquete: -
En existencias4.932
28 (2 x 14)
0.100" (2.54mm)
Gold
25µin (0.63µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
25µin (0.63µm)
Nickel
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
110-87-642-41-105101
Preci-Dip

CONN IC DIP SOCKET 42POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 42 (2 x 21)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: Flash
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Surface Mount
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
Paquete: -
En existencias2.772
42 (2 x 21)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
116-83-632-41-018101
Preci-Dip

CONN IC DIP SOCKET 32POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 32 (2 x 16)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Elevated, Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
Paquete: -
En existencias5.598
32 (2 x 16)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
ICO-314-M-TT
Samtec Inc.

CONN IC DIP SOCKET 14POS TIN

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 14 (2 x 7)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
Paquete: -
En existencias7.452
14 (2 x 7)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polyester, Glass Filled
-55°C ~ 105°C
211-1-32-006
CNC Tech

CONN IC DIP SOCKET 32POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 32 (2 x 16)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass
  • Housing Material: Polybutylene Terephthalate (PBT)
  • Operating Temperature: -55°C ~ 105°C
Paquete: -
En existencias3.582
32 (2 x 16)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polybutylene Terephthalate (PBT)
-55°C ~ 105°C
116-83-310-41-003101
Preci-Dip

CONN IC DIP SOCKET 10POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 10 (2 x 5)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Elevated, Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
Paquete: -
En existencias5.076
10 (2 x 5)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
614-83-610-41-001101
Preci-Dip

CONN IC DIP SOCKET 10POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 10 (2 x 5)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
Paquete: -
En existencias3.654
10 (2 x 5)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
110-43-316-41-801000
Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 16POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 16 (2 x 8)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame, Decoupling Capacitor
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass Alloy
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
  • Operating Temperature: -55°C ~ 125°C
Paquete: -
En existencias7.836
16 (2 x 8)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame, Decoupling Capacitor
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
210-1-20-003
CNC Tech

CONN IC DIP SOCKET 20POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 20 (2 x 10)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass
  • Housing Material: Polybutylene Terephthalate (PBT)
  • Operating Temperature: -40°C ~ 105°C
Paquete: -
En existencias14.742
20 (2 x 10)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polybutylene Terephthalate (PBT)
-40°C ~ 105°C
4840-6000-CP
3M

CONN IC DIP SOCKET 40POS TIN

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 40 (2 x 20)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 35µin (0.90µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 35µin (0.90µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Polyester, Glass Filled
  • Operating Temperature: -25°C ~ 85°C
Paquete: -
En existencias22.626
40 (2 x 20)
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Polyester, Glass Filled
-25°C ~ 85°C
243-16-1-03
CNC Tech

CONN IC DIP SOCKET 16POS TIN

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 16 (2 x 8)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 60µin (1.52µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 60µin (1.52µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
  • Operating Temperature: -40°C ~ 105°C
Paquete: -
En existencias59.196
16 (2 x 8)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C