Sockets for ICs, Transistors

69-PLS11031-12

Aries Electronics

CONN SOCKET PGA ZIF GOLD

• Type: PGA, ZIF (ZIP)
• Number of Positions or Pins (Grid): -
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Beryllium Copper
• Housing Material: Polyphenylene Sulfide (PPS)
• Operating Temperature: -65°C ~ 125°C

Paquete: -

614-83-281-19-001112

Preci-Dip

CONN SOCKET PGA 281POS GOLD

• Type: PGA
• Number of Positions or Pins (Grid): 281 (19 x 19)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 29.5µin (0.75µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: -
• Contact Material - Post: Brass
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
• Operating Temperature: -55°C ~ 125°C

Paquete: -

546-87-133-14-002135

Preci-Dip

CONN SOCKET PGA 133POS GOLD

• Type: PGA
• Number of Positions or Pins (Grid): 133 (14 x 14)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: Flash
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Press-Fit
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: -
• Contact Material - Post: Bronze
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
• Operating Temperature: -55°C ~ 125°C

Paquete: -

29-71250-10

Aries Electronics

CONN SOCKET SIP 29POS TIN

• Type: SIP
• Number of Positions or Pins (Grid): 29 (1 x 29)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Tin
• Contact Finish Thickness - Mating: 200µin (5.08µm)
• Contact Material - Mating: Phosphor Bronze
• Mounting Type: Through Hole
• Features: Elevated
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Phosphor Bronze
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -55°C ~ 105°C

Paquete: -

32-6508-202

Aries Electronics

CONN IC DIP SOCKET 32POS GOLD

• Type: DIP, 0.6" (15.24mm) Row Spacing
• Number of Positions or Pins (Grid): 32 (2 x 16)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Wire Wrap
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -55°C ~ 105°C

Paquete: -

546-87-121-13-061135

Preci-Dip

CONN SOCKET PGA 121POS GOLD

• Type: PGA
• Number of Positions or Pins (Grid): 121 (13 x 13)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: Flash
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Press-Fit
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: -
• Contact Material - Post: Bronze
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
• Operating Temperature: -55°C ~ 125°C

Paquete: -

110-93-952-41-001000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 52POS GOLD

• Type: DIP, 0.9" (22.86mm) Row Spacing
• Number of Positions or Pins (Grid): 52 (2 x 26)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin-Lead
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass Alloy
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
• Operating Temperature: -55°C ~ 125°C

Paquete: -

146-93-422-41-012000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 22POS GOLD

• Type: DIP, 0.4" (10.16mm) Row Spacing
• Number of Positions or Pins (Grid): 22 (2 x 11)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Press-Fit
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin-Lead
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass Alloy
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
• Operating Temperature: -55°C ~ 125°C

Paquete: -

115-93-306-41-003000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 6POS GOLD

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 6 (2 x 3)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin-Lead
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass Alloy
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
• Operating Temperature: -55°C ~ 125°C

Paquete: -

510-83-133-13-001101

Preci-Dip

CONN SOCKET PGA 133POS GOLD

• Type: PGA
• Number of Positions or Pins (Grid): 133 (13 x 13)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 29.5µin (0.75µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: -
• Contact Material - Post: Brass
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
• Operating Temperature: -55°C ~ 125°C

Paquete: -

APA-640-G-J

Samtec Inc.

ADAPTOR PLUG

• Type: -
• Number of Positions or Pins (Grid): -
• Pitch - Mating: -
• Contact Finish - Mating: -
• Contact Finish Thickness - Mating: -
• Contact Material - Mating: -
• Mounting Type: -
• Features: -
• Termination: -
• Pitch - Post: -
• Contact Finish - Post: -
• Contact Finish Thickness - Post: -
• Contact Material - Post: -
• Housing Material: -
• Operating Temperature: -

Paquete: -

714-43-129-31-018000

Mill-Max Manufacturing Corp.

CONN SOCKET SIP 29POS GOLD

• Type: SIP
• Number of Positions or Pins (Grid): 29 (1 x 29)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: -
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 30µin (0.76µm)
• Contact Material - Post: Brass Alloy
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
• Operating Temperature: -55°C ~ 125°C

Paquete: -

116-83-648-41-001101

Preci-Dip

CONN IC DIP SOCKET 48POS GOLD

• Type: DIP, 0.6" (15.24mm) Row Spacing
• Number of Positions or Pins (Grid): 48 (2 x 24)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 29.5µin (0.75µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Elevated, Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: -
• Contact Material - Post: Brass
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
• Operating Temperature: -55°C ~ 125°C

Paquete: -

08-822-90C

Aries Electronics

CONN IC DIP SOCKET 8POS GOLD

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 8 (2 x 4)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole, Right Angle, Horizontal
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -55°C ~ 105°C

Paquete: -

4593

Keystone Electronics

CONN SOCKET TRANSIST TO-100 8POS

• Type: Transistor, TO-100
• Number of Positions or Pins (Grid): 8 (Round)
• Pitch - Mating: -
• Contact Finish - Mating: Tin
• Contact Finish Thickness - Mating: -
• Contact Material - Mating: Brass
• Mounting Type: Chassis Mount
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: -
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: -
• Contact Material - Post: Brass
• Housing Material: Polyester, Glass Filled
• Operating Temperature: -

Paquete: -

116-83-324-41-002101

Preci-Dip

CONN IC DIP SOCKET 24POS GOLD

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 24 (2 x 12)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 29.5µin (0.75µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Elevated, Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: -
• Contact Material - Post: Brass
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
• Operating Temperature: -55°C ~ 125°C

Paquete: -

2-1571586-4

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 16POS GOLD

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 16 (2 x 8)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 25µin (0.63µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 25µin (0.63µm)
• Contact Material - Post: Copper
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
• Operating Temperature: -55°C ~ 105°C

Paquete: -

17-0518-10T

Aries Electronics

CONN SOCKET SIP 17POS GOLD

• Type: SIP
• Number of Positions or Pins (Grid): 17 (1 x 17)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -

Paquete: -

24-3518-10T

Aries Electronics

CONN IC DIP SOCKET 24POS GOLD

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 24 (2 x 12)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -

Paquete: -

08-0513-10H

Aries Electronics

CONN SOCKET SIP 8POS GOLD

• Type: SIP
• Number of Positions or Pins (Grid): 8 (1 x 8)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: -
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -

Paquete: -

116-87-320-41-007101

Preci-Dip

CONN IC DIP SOCKET 20POS GOLD

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 20 (2 x 10)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: Flash
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Elevated, Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: -
• Contact Material - Post: Brass
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
• Operating Temperature: -55°C ~ 125°C

Paquete: -

116-87-320-41-003101

Preci-Dip

CONN IC DIP SOCKET 20POS GOLD

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 20 (2 x 10)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: Flash
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Elevated, Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: -
• Contact Material - Post: Brass
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
• Operating Temperature: -55°C ~ 125°C

Paquete: -

114-87-324-41-134191

Preci-Dip

CONN IC DIP SOCKET 24POS GOLD

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 24 (2 x 12)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: Flash
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Surface Mount
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: -
• Contact Material - Post: Brass
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
• Operating Temperature: -55°C ~ 125°C

Paquete: -

110-83-308-41-605101

Preci-Dip

CONN IC DIP SOCKET 8POS GOLD

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 8 (2 x 4)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 29.5µin (0.75µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: -
• Contact Material - Post: Brass
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
• Operating Temperature: -55°C ~ 125°C

Paquete: -

2-382718-3

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 28POS TIN

• Type: DIP, 0.6" (15.24mm) Row Spacing
• Number of Positions or Pins (Grid): 28 (2 x 14)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Tin
• Contact Finish Thickness - Mating: -
• Contact Material - Mating: Phosphor Bronze
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: -
• Contact Material - Post: Phosphor Bronze
• Housing Material: Thermoplastic, Glass Filled
• Operating Temperature: -55°C ~ 105°C

Paquete: -

116-87-306-41-007101

Preci-Dip

CONN IC DIP SOCKET 6POS GOLD

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 6 (2 x 3)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: Flash
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Elevated, Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: -
• Contact Material - Post: Brass
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
• Operating Temperature: -55°C ~ 125°C

Paquete: -

D2808-42

Harwin Inc.

CONN IC DIP SOCKET 8POS GOLD

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 8 (2 x 4)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: Flash
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 196.8µin (5.00µm)
• Contact Material - Post: Brass
• Housing Material: Plastic
• Operating Temperature: -55°C ~ 125°C

Paquete: -

224-5248-00-0602J

3M

CONN IC DIP SOCKET ZIF 24POS GLD

• Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 24 (2 x 12)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Connector
• Features: Closed Frame
• Termination: Press-Fit
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 30µin (0.76µm)
• Contact Material - Post: Beryllium Copper
• Housing Material: Polysulfone (PSU), Glass Filled
• Operating Temperature: -55°C ~ 125°C

Paquete: -