Sockets for ICs, Transistors

AR14-HZL/07-TT

Assmann WSW Components

CONN IC DIP SOCKET 14POS GOLD

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 14 (2 x 7)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Beryllium Copper
• Housing Material: Thermoplastic, Polyester
• Operating Temperature: -40°C ~ 105°C

Paquete: -

64-PRS16016-12

Aries Electronics

CONN SOCKET PGA ZIF GOLD

• Type: PGA, ZIF (ZIP)
• Number of Positions or Pins (Grid): -
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Beryllium Copper
• Housing Material: Polyphenylene Sulfide (PPS)
• Operating Temperature: -65°C ~ 125°C

Paquete: -

40-3573-16

Aries Electronics

CONN IC DIP SOCKET ZIF 40POS

• Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 40 (2 x 20)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Nickel Boron
• Contact Finish Thickness - Mating: 50µin (1.27µm)
• Contact Material - Mating: Beryllium Nickel
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Nickel Boron
• Contact Finish Thickness - Post: 50µin (1.27µm)
• Contact Material - Post: Beryllium Nickel
• Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
• Operating Temperature: -

Paquete: -

48-6508-21

Aries Electronics

CONN IC DIP SOCKET 48POS GOLD

• Type: DIP, 0.6" (15.24mm) Row Spacing
• Number of Positions or Pins (Grid): 48 (2 x 24)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Wire Wrap
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -55°C ~ 125°C

Paquete: -

APA-648-G-B

Samtec Inc.

ADAPTOR PLUG

• Type: -
• Number of Positions or Pins (Grid): -
• Pitch - Mating: -
• Contact Finish - Mating: -
• Contact Finish Thickness - Mating: -
• Contact Material - Mating: -
• Mounting Type: -
• Features: -
• Termination: -
• Pitch - Post: -
• Contact Finish - Post: -
• Contact Finish Thickness - Post: -
• Contact Material - Post: -
• Housing Material: -
• Operating Temperature: -

Paquete: -

1109681-316 100 PCS MINIMUM

Aries Electronics

CONN IC DIP SOCKET 16POS GOLD

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 16 (2 x 8)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Brass
• Mounting Type: Through Hole
• Features: Spacer
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin-Lead
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -

Paquete: -

1109800-26

Aries Electronics

CONN IC DIP SOCKET 26POS GOLD

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 26 (2 x 13)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Programmable
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin-Lead
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -

Paquete: -

36-6556-30

Aries Electronics

CONN IC DIP SOCKET 36POS GOLD

• Type: DIP, 0.6" (15.24mm) Row Spacing
• Number of Positions or Pins (Grid): 36 (2 x 18)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Wire Wrap
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass
• Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
• Operating Temperature: -

Paquete: -

31-0501-20

Aries Electronics

CONN SOCKET SIP 31POS TIN

• Type: SIP
• Number of Positions or Pins (Grid): 31 (1 x 31)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Tin
• Contact Finish Thickness - Mating: 200µin (5.08µm)
• Contact Material - Mating: Phosphor Bronze
• Mounting Type: Through Hole
• Features: -
• Termination: Wire Wrap
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Phosphor Bronze
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -55°C ~ 105°C

Paquete: -

24-8312-310C

Aries Electronics

CONN IC DIP SOCKET 24POS GOLD

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 24 (2 x 12)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Closed Frame, Elevated
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -55°C ~ 105°C

Paquete: -

126-93-422-41-001000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 22POS GOLD

• Type: DIP, 0.4" (10.16mm) Row Spacing
• Number of Positions or Pins (Grid): 22 (2 x 11)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Wire Wrap
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin-Lead
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass Alloy
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
• Operating Temperature: -55°C ~ 125°C

Paquete: -

104-13-314-41-770000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 14POS GOLD

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 14 (2 x 7)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Press-Fit
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass Alloy
• Housing Material: Thermoplastic
• Operating Temperature: -

Paquete: -

20-8730-310C

Aries Electronics

CONN IC DIP SOCKET 20POS GOLD

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 20 (2 x 10)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Closed Frame, Elevated
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -55°C ~ 105°C

Paquete: -

18-81250-610C

Aries Electronics

CONN IC DIP SOCKET 18POS GOLD

• Type: DIP, 0.6" (15.24mm) Row Spacing
• Number of Positions or Pins (Grid): 18 (2 x 9)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Closed Frame, Elevated
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -55°C ~ 105°C

Paquete: -

30-9513-11

Aries Electronics

CONN IC DIP SOCKET 30POS GOLD

• Type: DIP, 0.9" (22.86mm) Row Spacing
• Number of Positions or Pins (Grid): 30 (2 x 15)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -

Paquete: -

11-7587-10

Aries Electronics

CONN SOCKET SIP 11POS TIN

• Type: SIP
• Number of Positions or Pins (Grid): 11 (1 x 11)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Tin
• Contact Finish Thickness - Mating: 200µin (5.08µm)
• Contact Material - Mating: Phosphor Bronze
• Mounting Type: Through Hole
• Features: Elevated
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Phosphor Bronze
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -55°C ~ 105°C

Paquete: -

299-83-632-10-002101

Preci-Dip

CONN IC DIP SOCKET 32POS GOLD

• Type: DIP, 0.6" (15.24mm) Row Spacing
• Number of Positions or Pins (Grid): 32 (2 x 16)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 29.5µin (0.75µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole, Right Angle, Horizontal
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: -
• Contact Material - Post: Brass
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
• Operating Temperature: -55°C ~ 125°C

Paquete: -

08-820-90

Aries Electronics

CONN IC DIP SOCKET 8POS GOLD

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 8 (2 x 4)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Phosphor Bronze
• Mounting Type: Through Hole, Right Angle, Horizontal
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Phosphor Bronze
• Housing Material: Polyamide (PA46), Nylon 4/6
• Operating Temperature: -

Paquete: -

07-0503-31

Aries Electronics

CONN SOCKET SIP 7POS GOLD

• Type: SIP
• Number of Positions or Pins (Grid): 7 (1 x 7)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: -
• Termination: Wire Wrap
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA), Nylon, Glass Filled
• Operating Temperature: -

Paquete: -

24-3518-101

Aries Electronics

CONN IC DIP SOCKET 24POS GOLD

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 24 (2 x 12)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -

Paquete: -

510-83-069-11-001101

Preci-Dip

CONN SOCKET PGA 69POS GOLD

• Type: PGA
• Number of Positions or Pins (Grid): 69 (11 x 11)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 29.5µin (0.75µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: -
• Contact Material - Post: Brass
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
• Operating Temperature: -55°C ~ 125°C

Paquete: -

122-87-428-41-001101

Preci-Dip

CONN IC DIP SOCKET 28POS GOLD

• Type: DIP, 0.4" (10.16mm) Row Spacing
• Number of Positions or Pins (Grid): 28 (2 x 14)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: Flash
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Wire Wrap
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: -
• Contact Material - Post: Brass
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
• Operating Temperature: -55°C ~ 125°C

Paquete: -

ICF-318-T-O

Samtec Inc.

SURFACE MOUNT DIP SOCKETS

• Type: -
• Number of Positions or Pins (Grid): -
• Pitch - Mating: -
• Contact Finish - Mating: -
• Contact Finish Thickness - Mating: -
• Contact Material - Mating: -
• Mounting Type: -
• Features: -
• Termination: -
• Pitch - Post: -
• Contact Finish - Post: -
• Contact Finish Thickness - Post: -
• Contact Material - Post: -
• Housing Material: -
• Operating Temperature: -

Paquete: -

346-93-101-41-013000

Mill-Max Manufacturing Corp.

CONN SOCKET SIP 1POS GOLD

• Type: SIP
• Number of Positions or Pins (Grid): 1 (1 x 1)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: -
• Termination: Press-Fit
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin-Lead
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass Alloy
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
• Operating Temperature: -55°C ~ 125°C

Paquete: -

APA-316-T-J

Samtec Inc.

ADAPTOR PLUG

• Type: -
• Number of Positions or Pins (Grid): -
• Pitch - Mating: -
• Contact Finish - Mating: -
• Contact Finish Thickness - Mating: -
• Contact Material - Mating: -
• Mounting Type: -
• Features: -
• Termination: -
• Pitch - Post: -
• Contact Finish - Post: -
• Contact Finish Thickness - Post: -
• Contact Material - Post: -
• Housing Material: -
• Operating Temperature: -

Paquete: -

114-87-310-41-117101

Preci-Dip

CONN IC DIP SOCKET 10POS GOLD

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 10 (2 x 5)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: Flash
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Surface Mount
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: -
• Contact Material - Post: Brass
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
• Operating Temperature: -55°C ~ 125°C

Paquete: -

146-43-308-41-013000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 8POS GOLD

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 8 (2 x 4)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Press-Fit
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass Alloy
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
• Operating Temperature: -55°C ~ 125°C

Paquete: -

111-43-324-41-001000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 24POS GOLD

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 24 (2 x 12)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass Alloy
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
• Operating Temperature: -55°C ~ 125°C

Paquete: -