Sockets for ICs, Transistors

9-1437504-5

TE Connectivity AMP Connectors

TRANSISTOR SOCKET

• Type: -
• Number of Positions or Pins (Grid): -
• Pitch - Mating: -
• Contact Finish - Mating: -
• Contact Finish Thickness - Mating: -
• Contact Material - Mating: -
• Mounting Type: -
• Features: -
• Termination: -
• Pitch - Post: -
• Contact Finish - Post: -
• Contact Finish Thickness - Post: -
• Contact Material - Post: -
• Housing Material: -
• Operating Temperature: -

Paquete: -

1-390263-2

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 32POS TIN

• Type: DIP, 0.6" (15.24mm) Row Spacing
• Number of Positions or Pins (Grid): 32 (2 x 16)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Tin
• Contact Finish Thickness - Mating: 60µin (1.52µm)
• Contact Material - Mating: Phosphor Bronze
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 60µin (1.52µm)
• Contact Material - Post: Phosphor Bronze
• Housing Material: -
• Operating Temperature: -40°C ~ 105°C

Paquete: -

400-PLS20001-16

Aries Electronics

CONN SOCKET PGA ZIF GOLD

• Type: PGA, ZIF (ZIP)
• Number of Positions or Pins (Grid): -
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Nickel Bronze
• Contact Finish Thickness - Post: 50µin (1.27µm)
• Contact Material - Post: Beryllium Copper
• Housing Material: Polyphenylene Sulfide (PPS)
• Operating Temperature: -65°C ~ 200°C

Paquete: -

518-77-480M29-001106

Preci-Dip

CONN SOCKET PGA 480POS GOLD

• Type: PGA
• Number of Positions or Pins (Grid): 480 (29 x 29)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: Flash
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Surface Mount
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: Flash
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

Paquete: -

76-PRS19033-12

Aries Electronics

CONN SOCKET PGA ZIF GOLD

• Type: PGA, ZIF (ZIP)
• Number of Positions or Pins (Grid): -
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Beryllium Copper
• Housing Material: Polyphenylene Sulfide (PPS)
• Operating Temperature: -65°C ~ 125°C

Paquete: -

1109681-320 100 PCS MINIMUM

Aries Electronics

CONN IC DIP SOCKET 20POS GOLD

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 20 (2 x 10)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Brass
• Mounting Type: Through Hole
• Features: Spacer
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin-Lead
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -

Paquete: -

110-93-952-41-105000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 52POS GOLD

• Type: DIP, 0.9" (22.86mm) Row Spacing
• Number of Positions or Pins (Grid): 52 (2 x 26)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Surface Mount
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin-Lead
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass Alloy
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
• Operating Temperature: -55°C ~ 125°C

Paquete: -

24-81000-310C

Aries Electronics

CONN IC DIP SOCKET 24POS GOLD

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 24 (2 x 12)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Closed Frame, Elevated
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -55°C ~ 105°C

Paquete: -

111-93-422-41-001000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 22POS GOLD

• Type: DIP, 0.4" (10.16mm) Row Spacing
• Number of Positions or Pins (Grid): 22 (2 x 11)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin-Lead
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass Alloy
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
• Operating Temperature: -55°C ~ 125°C

Paquete: -

22-81150-610C

Aries Electronics

CONN IC DIP SOCKET 22POS GOLD

• Type: DIP, 0.6" (15.24mm) Row Spacing
• Number of Positions or Pins (Grid): 22 (2 x 11)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Closed Frame, Elevated
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -55°C ~ 105°C

Paquete: -

116-93-420-41-007000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 20POS GOLD

• Type: DIP, 0.4" (10.16mm) Row Spacing
• Number of Positions or Pins (Grid): 20 (2 x 10)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Elevated, Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin-Lead
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass Alloy
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
• Operating Temperature: -55°C ~ 125°C

Paquete: -

20-7360-10

Aries Electronics

CONN SOCKET SIP 20POS TIN

• Type: SIP
• Number of Positions or Pins (Grid): 20 (1 x 20)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Tin
• Contact Finish Thickness - Mating: 200µin (5.08µm)
• Contact Material - Mating: Phosphor Bronze
• Mounting Type: Through Hole
• Features: Elevated
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Phosphor Bronze
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -55°C ~ 105°C

Paquete: -

14-6820-90C

Aries Electronics

CONN IC DIP SOCKET 14POS GOLD

• Type: DIP, 0.6" (15.24mm) Row Spacing
• Number of Positions or Pins (Grid): 14 (2 x 7)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole, Right Angle, Horizontal
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -55°C ~ 105°C

Paquete: -

821949-4

TE Connectivity AMP Connectors

CONN SOCKET PQFP 100POS TIN-LEAD

• Type: QFP
• Number of Positions or Pins (Grid): 100 (4 x 25)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Tin-Lead
• Contact Finish Thickness - Mating: 200µin (5.08µm)
• Contact Material - Mating: Phosphor Bronze
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Tin-Lead
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Phosphor Bronze
• Housing Material: Liquid Crystal Polymer (LCP)
• Operating Temperature: -

Paquete: -

116-87-650-41-011101

Preci-Dip

CONN IC DIP SOCKET 50POS GOLD

• Type: DIP, 0.6" (15.24mm) Row Spacing
• Number of Positions or Pins (Grid): 50 (2 x 25)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: Flash
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Elevated, Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: -
• Contact Material - Post: Brass
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
• Operating Temperature: -55°C ~ 125°C

Paquete: -

08-6822-90C

Aries Electronics

CONN IC DIP SOCKET 8POS GOLD

• Type: DIP, 0.6" (15.24mm) Row Spacing
• Number of Positions or Pins (Grid): 8 (2 x 4)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole, Right Angle, Horizontal
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -55°C ~ 105°C

Paquete: -

116-83-648-41-012101

Preci-Dip

CONN IC DIP SOCKET 48POS GOLD

• Type: DIP, 0.6" (15.24mm) Row Spacing
• Number of Positions or Pins (Grid): 48 (2 x 24)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 29.5µin (0.75µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Elevated, Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: -
• Contact Material - Post: Brass
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
• Operating Temperature: -55°C ~ 125°C

Paquete: -

346-43-119-41-013000

Mill-Max Manufacturing Corp.

CONN SOCKET SIP 19POS GOLD

• Type: SIP
• Number of Positions or Pins (Grid): 19 (1 x 19)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: -
• Termination: Press-Fit
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass Alloy
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
• Operating Temperature: -55°C ~ 125°C

Paquete: -

346-93-119-41-013000

Mill-Max Manufacturing Corp.

CONN SOCKET SIP 19POS GOLD

• Type: SIP
• Number of Positions or Pins (Grid): 19 (1 x 19)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: -
• Termination: Press-Fit
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin-Lead
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass Alloy
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
• Operating Temperature: -55°C ~ 125°C

Paquete: -

510-87-085-11-001101

Preci-Dip

CONN SOCKET PGA 85POS GOLD

• Type: PGA
• Number of Positions or Pins (Grid): 85 (11 x 11)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: Flash
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: -
• Contact Material - Post: Brass
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
• Operating Temperature: -55°C ~ 125°C

Paquete: -

614-43-628-31-012000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 28POS GOLD

• Type: DIP, 0.6" (15.24mm) Row Spacing
• Number of Positions or Pins (Grid): 28 (2 x 14)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass Alloy
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
• Operating Temperature: -55°C ~ 125°C

Paquete: -

14-8260-10WR

Aries Electronics

CONN IC DIP SOCKET 14POS TIN

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 14 (2 x 7)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Tin
• Contact Finish Thickness - Mating: 200µin (5.08µm)
• Contact Material - Mating: Phosphor Bronze
• Mounting Type: Through Hole
• Features: Closed Frame, Elevated
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Phosphor Bronze
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -55°C ~ 105°C

Paquete: -

12-6513-11

Aries Electronics

CONN IC DIP SOCKET 12POS GOLD

• Type: DIP, 0.6" (15.24mm) Row Spacing
• Number of Positions or Pins (Grid): 12 (2 x 6)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -

Paquete: -

AR10-HZW/T-R

Assmann WSW Components

IC SOCKET 10 PIN MACH CONT

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 4 (2 x 2)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Tin
• Contact Finish Thickness - Mating: -
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Beryllium Copper
• Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
• Operating Temperature: -40°C ~ 105°C

Paquete: -

516-AG11D-ES

TE Connectivity AMP Connectors

DIP SOCKET T/H 16POS

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 16 (2 x 8)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: -
• Contact Material - Mating: Copper Alloy
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin-Lead
• Contact Finish Thickness - Post: -
• Contact Material - Post: Copper Alloy
• Housing Material: Polyester
• Operating Temperature: -55°C ~ 105°C

Paquete: -

614-87-314-31-012101

Preci-Dip

CONN IC DIP SOCKET 14POS GOLD

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 14 (2 x 7)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: Flash
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: -
• Contact Material - Post: Brass
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
• Operating Temperature: -55°C ~ 125°C

Paquete: -

114-83-314-41-117101

Preci-Dip

CONN IC DIP SOCKET 14POS GOLD

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 14 (2 x 7)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 29.5µin (0.75µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Surface Mount
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: -
• Contact Material - Post: Brass
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
• Operating Temperature: -55°C ~ 125°C

Paquete: -

8432-21B1-RK-TR

3M

CONN SOCKET PLCC 32POS TIN

• Type: PLCC
• Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Tin
• Contact Finish Thickness - Mating: 160µin (4.06µm)
• Contact Material - Mating: Copper Alloy
• Mounting Type: Surface Mount
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 160µin (4.06µm)
• Contact Material - Post: Copper Alloy
• Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
• Operating Temperature: -40°C ~ 105°C

Paquete: -