Aries Electronics Productos

48-6570-16

Aries Electronics

CONN IC DIP SOCKET ZIF 48POS

• Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
• Number of Positions or Pins (Grid): 48 (2 x 24)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Nickel Boron
• Contact Finish Thickness - Mating: 50µin (1.27µm)
• Contact Material - Mating: Beryllium Nickel
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Nickel Boron
• Contact Finish Thickness - Post: 50µin (1.27µm)
• Contact Material - Post: Beryllium Nickel
• Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
• Operating Temperature: -

Paquete: -

232-PGM17037-11

Aries Electronics

CONN SOCKET PGA GOLD

• Type: PGA
• Number of Positions or Pins (Grid): -
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: -
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -55°C ~ 125°C

Paquete: -

133-PGM13052-10H

Aries Electronics

CONN SOCKET PGA GOLD

• Type: PGA
• Number of Positions or Pins (Grid): -
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: -
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -55°C ~ 105°C

Paquete: -

48-3552-11

Aries Electronics

CONN IC DIP SOCKET ZIF 48POS GLD

• Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 48 (2 x 24)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: -
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: -
• Contact Material - Post: Beryllium Copper
• Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
• Operating Temperature: -

Paquete: -

32-1508-31

Aries Electronics

CONN IC DIP SOCKET 32POS GOLD

• Type: DIP, 0.2" (5.08mm) Row Spacing
• Number of Positions or Pins (Grid): 32 (2 x 16)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Wire Wrap
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6
• Operating Temperature: -55°C ~ 125°C

Paquete: -

32-6508-301

Aries Electronics

CONN IC DIP SOCKET 32POS GOLD

• Type: DIP, 0.6" (15.24mm) Row Spacing
• Number of Positions or Pins (Grid): 32 (2 x 16)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Wire Wrap
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -55°C ~ 105°C

Paquete: -

25-71220-10

Aries Electronics

CONN SOCKET SIP 25POS TIN

• Type: SIP
• Number of Positions or Pins (Grid): 25 (1 x 25)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Tin
• Contact Finish Thickness - Mating: 200µin (5.08µm)
• Contact Material - Mating: Phosphor Bronze
• Mounting Type: Through Hole
• Features: Elevated
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Phosphor Bronze
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -55°C ~ 105°C

Paquete: -

17-0501-30

Aries Electronics

CONN SOCKET SIP 17POS TIN

• Type: SIP
• Number of Positions or Pins (Grid): 17 (1 x 17)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Tin
• Contact Finish Thickness - Mating: 200µin (5.08µm)
• Contact Material - Mating: Phosphor Bronze
• Mounting Type: Through Hole
• Features: -
• Termination: Wire Wrap
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Phosphor Bronze
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -55°C ~ 105°C

Paquete: -

16-3508-20

Aries Electronics

CONN IC DIP SOCKET 16POS GOLD

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 16 (2 x 8)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Wire Wrap
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -55°C ~ 105°C

Paquete: -

12-6822-90C

Aries Electronics

CONN IC DIP SOCKET 12POS GOLD

• Type: DIP, 0.6" (15.24mm) Row Spacing
• Number of Positions or Pins (Grid): 12 (2 x 6)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole, Right Angle, Horizontal
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -55°C ~ 105°C

Paquete: -

10-81070-310C

Aries Electronics

CONN IC DIP SOCKET 10POS GOLD

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 10 (2 x 5)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Closed Frame, Elevated
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -55°C ~ 105°C

Paquete: -

18-0508-30

Aries Electronics

CONN SOCKET SIP 18POS GOLD

• Type: SIP
• Number of Positions or Pins (Grid): 18 (1 x 18)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: -
• Termination: Wire Wrap
• Pitch - Post: -
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6
• Operating Temperature: -55°C ~ 105°C

Paquete: -

16-3503-20

Aries Electronics

CONN IC DIP SOCKET 16POS GOLD

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 16 (2 x 8)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Wire Wrap
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Phosphor Bronze
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -55°C ~ 105°C

Paquete: -

14-0517-90C

Aries Electronics

CONN SOCKET SIP 14POS GOLD

• Type: SIP
• Number of Positions or Pins (Grid): 14 (1 x 14)
• Pitch - Mating: -
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole, Right Angle
• Features: -
• Termination: Solder
• Pitch - Post: -
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -

Paquete: -

20-0513-10H

Aries Electronics

CONN SOCKET SIP 20POS GOLD

• Type: SIP
• Number of Positions or Pins (Grid): 20 (1 x 20)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: -
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -

Paquete: -

26-3513-10T

Aries Electronics

CONN IC DIP SOCKET 26POS GOLD

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 26 (2 x 13)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -

Paquete: -

07-0508-30

Aries Electronics

CONN SOCKET SIP 7POS GOLD

• Type: SIP
• Number of Positions or Pins (Grid): 7 (1 x 7)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: -
• Termination: Wire Wrap
• Pitch - Post: -
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6
• Operating Temperature: -55°C ~ 105°C

Paquete: -

26-0518-10T

Aries Electronics

CONN SOCKET SIP 26POS GOLD

• Type: SIP
• Number of Positions or Pins (Grid): 26 (1 x 26)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -

Paquete: -

10-3513-11

Aries Electronics

CONN IC DIP SOCKET 10POS GOLD

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 10 (2 x 5)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -

Paquete: -

18-1518-10H

Aries Electronics

CONN IC DIP SOCKET 18POS GOLD

• Type: DIP, 0.2" (5.08mm) Row Spacing
• Number of Positions or Pins (Grid): 18 (2 x 9)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -

Paquete: -

16-1518-11

Aries Electronics

CONN IC DIP SOCKET 16POS GOLD

• Type: DIP, 0.2" (5.08mm) Row Spacing
• Number of Positions or Pins (Grid): 16 (2 x 8)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -

Paquete: -

08-1518-00

Aries Electronics

CONN IC DIP SOCKET 8POS GOLD

• Type: DIP, 0.2" (5.08mm) Row Spacing
• Number of Positions or Pins (Grid): 8 (2 x 4)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -

Paquete: -

07-0513-10T

Aries Electronics

CONN SOCKET SIP 7POS GOLD

• Type: SIP
• Number of Positions or Pins (Grid): 7 (1 x 7)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: -
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -

Paquete: -

04-0513-10H

Aries Electronics

CONN SOCKET SIP 4POS GOLD

• Type: SIP
• Number of Positions or Pins (Grid): 4 (1 x 4)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: -
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -

Paquete: -

02-0518-11

Aries Electronics

CONN SOCKET SIP 2POS GOLD

• Type: SIP
• Number of Positions or Pins (Grid): 2 (1 x 2)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -

Paquete: -

25-0625-30

Aries Electronics

0625 PIN-LINE HDR SCRW MACH CONT

• Connector Type: Header Strip
• Contact Type: Solder Cup
• Number of Positions: 25
• Pitch: 0.100" (2.54mm)
• Number of Rows: 1
• Row Spacing: -
• Mounting Type: Through Hole
• Termination: Solder
• Features: -
• Contact Finish: Tin
• Contact Finish Thickness: 200µin (5.08µm)
• Color: Black

Paquete: -

15-0625-70

Aries Electronics

0625 PIN-LINE HDR SCRW MACH CONT

• Connector Type: Header Strip
• Contact Type: Post
• Number of Positions: 15
• Pitch: 0.100" (2.54mm)
• Number of Rows: 1
• Row Spacing: -
• Mounting Type: Through Hole
• Termination: Solder
• Features: -
• Contact Finish: Tin
• Contact Finish Thickness: 200µin (5.08µm)
• Color: Black

Paquete: -

10-658-10

Aries Electronics

680 PROGRAM HEADERS/COVERS

• Accessory Type: Cap (Cover)
• Number of Positions: 10
• For Use With/Related Products: 680 Series
• Features: Top Slot

Paquete: -