Página 5 - 3M Productos - Sockets for ICs, Transistors

235-3019-02-0602

3M

CONN ZIG-ZAG ZIF 35POS GOLD

Type: Zig-Zag, ZIF (ZIP)
Number of Positions or Pins (Grid): 35 (1 x 17, 1 x 18)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 125°C

Paquete: -

En existencias3.276

35 (1 x 17, 1 x 18)

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 125°C

235-3019-01-0602

3M

CONN ZIG-ZAG ZIF 35POS GOLD

Type: Zig-Zag, ZIF (ZIP)
Number of Positions or Pins (Grid): 35 (1 x 17, 1 x 18)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 125°C

Paquete: -

En existencias5.778

35 (1 x 17, 1 x 18)

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 125°C

235-3019-52-0602

3M

CONN ZIG-ZAG ZIF 35POS GOLD

Type: Zig-Zag, ZIF (ZIP)
Number of Positions or Pins (Grid): 35 (1 x 17, 1 x 18)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 125°C

Paquete: -

En existencias4.680

35 (1 x 17, 1 x 18)

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 125°C

235-3019-51-0602

3M

CONN ZIG-ZAG ZIF 35POS GOLD

Type: Zig-Zag, ZIF (ZIP)
Number of Positions or Pins (Grid): 35 (1 x 17, 1 x 18)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 125°C

Paquete: -

En existencias5.004

35 (1 x 17, 1 x 18)

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 125°C

234-3034-02-0602

3M

CONN ZIG-ZAG ZIF 34POS GOLD

Type: Zig-Zag, ZIF (ZIP)
Number of Positions or Pins (Grid): 34 (2 x 17)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 125°C

Paquete: -

En existencias2.898

34 (2 x 17)

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 125°C

234-3034-01-0602

3M

CONN ZIG-ZAG ZIF 34POS GOLD

Type: Zig-Zag, ZIF (ZIP)
Number of Positions or Pins (Grid): 34 (1 x 34)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 125°C

Paquete: -

En existencias6.228

34 (1 x 34)

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 125°C

234-3034-52-0602

3M

CONN ZIG-ZAG ZIF 34POS GOLD

Type: Zig-Zag, ZIF (ZIP)
Number of Positions or Pins (Grid): 34 (2 x 17)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 125°C

Paquete: -

En existencias7.254

34 (2 x 17)

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 125°C

234-3034-51-0602

3M

CONN ZIG-ZAG ZIF 34POS GOLD

Type: Zig-Zag, ZIF (ZIP)
Number of Positions or Pins (Grid): 34 (2 x 17)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 125°C

Paquete: -

En existencias2.988

34 (2 x 17)

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 125°C

236-6225-50-0602

3M

SOCKET ZIP IN-LINE 36POS

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Paquete: -

En existencias5.778

-

239-5605-02-0602

3M

CONN ZIG-ZAG 39POS GOLD

Type: Zig-Zag
Number of Positions or Pins (Grid): 39 (1 x 19, 1 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 150°C

Paquete: -

En existencias3.472

39 (1 x 19, 1 x 20)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 150°C

232-2601-50-0602

3M

IN-LINE ZIP STRIP POCKETS 32 CON

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Paquete: -

En existencias4.680

-

239-5605-01-0602

3M

CONN ZIG-ZAG 39POS GOLD

Type: Zig-Zag
Number of Positions or Pins (Grid): 39 (1 x 19, 1 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 150°C

Paquete: -

En existencias3.960

39 (1 x 19, 1 x 20)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 150°C

239-5605-52-0602

3M

CONN SOCKET 39POS ZIP STRIP

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Paquete: -

En existencias3.526

-

232-1270-52-0602

3M

STAGGERED ZIP STRIP POCKETS 32 C

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Paquete: -

En existencias3.042

-

232-1270-51-0602

3M

STAGGERED ZIP STRIP POCKETS 32 C

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Paquete: -

En existencias4.230

-

232-1270-02-0602

3M

CONN SOCKET PGA ZIF 32POS GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 125°C

Paquete: -

En existencias3.472

32 (2 x 16)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 125°C

232-1270-01-0602

3M

CONN SOCKET PGA ZIF 32POS GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 125°C

Paquete: -

En existencias8.046

32 (2 x 16)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 125°C

239-5605-51-0602

3M

CONN SOCKET 39POS ZIP STRIP

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Paquete: -

En existencias6.876

-

284-1273-00-1102JH

3M

CONN SOCKET PLCC 84POS GOLD

Type: PLCC
Number of Positions or Pins (Grid): 84 (4 x 21)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -55°C ~ 105°C

Paquete: -

En existencias8.406

84 (4 x 21)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled

-55°C ~ 105°C

232-1297-00-3303

3M

CONN IC DIP SOCKET ZIF 32POS GLD

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 250µin (6.35µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 250µin (6.35µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyether Imide (PEI), Glass Filled
Operating Temperature: -55°C ~ 105°C

Paquete: -

En existencias5.580

32 (2 x 16)

0.100" (2.54mm)

Gold

250µin (6.35µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

250µin (6.35µm)

Beryllium Copper

Polyether Imide (PEI), Glass Filled

-55°C ~ 105°C

232-1271-00-1102JH

3M

OEM LCC SOCKETS 32 POS SOLID LID

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Paquete: -

En existencias6.264

-

8468-21B1-RK-TR

3M

CONN SOCKET PLCC 68POS TIN

Type: PLCC
Number of Positions or Pins (Grid): 68 (4 x 17)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160µin (4.06µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160µin (4.06µm)
Contact Material - Post: Copper Alloy
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -40°C ~ 105°C

Paquete: -

En existencias8.244

68 (4 x 17)

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Polybutylene Terephthalate (PBT), Glass Filled

-40°C ~ 105°C

8484-21A1-RK-TP

3M

CONN SOCKET PLCC 84POS TIN

Type: PLCC
Number of Positions or Pins (Grid): 84 (4 x 21)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160µin (4.06µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160µin (4.06µm)
Contact Material - Post: Copper Alloy
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -40°C ~ 105°C

Paquete: -

En existencias6.912

84 (4 x 21)

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Polybutylene Terephthalate (PBT), Glass Filled

-40°C ~ 105°C

8452-21B1-RK-TR

3M

CONN SOCKET PLCC 52POS TIN

Type: PLCC
Number of Positions or Pins (Grid): 52 (4 x 13)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160µin (4.06µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160µin (4.06µm)
Contact Material - Post: Copper Alloy
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -40°C ~ 105°C

Paquete: -

En existencias4.644

52 (4 x 13)

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Polybutylene Terephthalate (PBT), Glass Filled

-40°C ~ 105°C

8420-21B1-RK-TR

3M

CONN SOCKET PLCC 20POS TIN

Type: PLCC
Number of Positions or Pins (Grid): 20 (4 x 5)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160µin (4.06µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160µin (4.06µm)
Contact Material - Post: Copper Alloy
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -40°C ~ 105°C

Paquete: -

En existencias3.384

20 (4 x 5)

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Polybutylene Terephthalate (PBT), Glass Filled

-40°C ~ 105°C

8428-21A1-RK-TP

3M

CONN SOCKET PLCC 28POS TIN

Type: PLCC
Number of Positions or Pins (Grid): 28 (4 x 7)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160µin (4.06µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160µin (4.06µm)
Contact Material - Post: Copper Alloy
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -40°C ~ 105°C

Paquete: -

En existencias4.158

28 (4 x 7)

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Polybutylene Terephthalate (PBT), Glass Filled

-40°C ~ 105°C

8420-21A1-RK-TP

3M

CONN SOCKET PLCC 20POS TIN

Type: PLCC
Number of Positions or Pins (Grid): 20 (4 x 5)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160µin (4.06µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160µin (4.06µm)
Contact Material - Post: Copper Alloy
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -40°C ~ 105°C

Paquete: -

En existencias8.514

20 (4 x 5)

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Polybutylene Terephthalate (PBT), Glass Filled

-40°C ~ 105°C

4842-6004-CP

3M

CONN IC DIP SOCKET 42POS TIN

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 135µin (3.43µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 135µin (3.43µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyester, Glass Filled
Operating Temperature: -25°C ~ 85°C

Paquete: -

En existencias4.122

42 (2 x 21)

0.100" (2.54mm)

Tin

135µin (3.43µm)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

135µin (3.43µm)

Phosphor Bronze

Polyester, Glass Filled

-25°C ~ 85°C