Name: XCVC1702-1MLINSVG1369
Brand: AMD
SKU: XCVC1702-1MLINSVG1369
Availability: InStock
Rating: 5 (183 reviews)

XCVC1702-1MLINSVG1369

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Nº de pieza	XCVC1702-1MLINSVG1369
Fabricantes	AMD
Descripción	IC VERSAL AI-CORE FPGA 1369BGA
Hoja de datos
Paquete	-
ECAD
En existencias	0 piece(s)
Precio unitario	Request a Quote
Plazo de ejecución	Para ser confirmado
Tiempo estimado de entrega	dic 27 - ene 1 (Elija envío expedito)
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Especificaciones XCVC1702-1MLINSVG1369

Fabricantes	AMD
Categoría	Circuitos integrados - Integrado - Sistema en chip (SoC)
Paquete	-
ECAD
Serie	Versal™ AI Core
Arquitectura	MPU, FPGA
Procesador Core	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Tamaño de flash	-
Tamaño de RAM	256KB
Periféricos	DDR, DMA, PCIe
Conectividad	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Velocidad	600MHz, 1.3GHz
Atributos principales	Versal™ AI Core FPGA, 1M Logic Cells
Temperatura de funcionamiento	-40°C ~ 110°C (TJ)
Paquete / caja	1369-BFBGA, FCBGA
Paquete de dispositivo del proveedor	1369-FCBGA (35x35)

XCVC1702-1MLINSVG1369 Packaging

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCVC1702-1MLINSVG1369.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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XCVC1702-1MLINSVG1369

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