The artificial intelligence (AI) revolution is changing the way we design and manufacture everything from data centers to servers and chips. Chip technology is also shifting from traditional analog circuit integration to using multiple chips or chiplets in a single package. While there is much discussion about the manufacturing of these advanced chips, there is less discussion about the evolution of the tools used to design them. At the annual Design Automation Conference (DAC) in San Francisco, Siemens, one of the leaders in electronic design automation (EDA), demonstrated its efforts to bring digital twin multiphysics and artificial intelligence to its Calibre and Solido EDA tools for complex chip design.
Siemens Background
Siemens is a 177-year-old multinational conglomerate that produces everything from light bulbs and telegraph equipment to generators and electric trains. As a technology solutions company, Siemens combines hardware, software and industry expertise to develop complex solutions for a wide range of applications. Siemens has made significant investments in software through internal development and acquisitions to become one of the industry leaders.
Siemens Investment in EDA Tools
Siemens acquired Mentor Graphics, an industry leader in EDA, in 2017 and has been a leader in the field since then. Siemens has invested heavily in EDA R&D and launched more than two dozen new EDA tools. Through a series of acquisitions, Siemens and the former Mentor Graphics have acquired more than 100 companies to create one of the top EDA tool sets in the industry. According to Siemens, Siemens EDA is the first company to integrate multi-physics simulation and digital twins in EDA.
Solido Simulation Suite
At the DAC conference, Siemens announced the introduction of the Solido Simulation Suite to its Solido family of design solutions. The Solido Simulation Suite is designed to meet the challenges of designing mixed-signal and custom chips, especially custom ICs that need to be developed at the transistor level. The Solido Simulation Suite includes three new AI-accelerated tools (Solido SPICE, Solido FastSPICE, and Solido LibSPICE) that provide more accurate simulations for large design models and can significantly increase simulation speed.
Calibre 3DThermal
To meet the challenges of 3D IC design, Siemens has added 3D IC thermal analysis capabilities to its Calibre design verification platform. By integrating Siemens Flotherm electronic cooling simulation software analysis tools into the Calibre IC verification suite, Siemens has achieved multi-physics simulation of 3D IC design. Calibre 3DThermal provides color maps and temperature annotations at the transistor level to analyze when the transistor exceeds thermal specifications.
Complex value chain
As system and silicon requirements continue to grow, the tools for designing next-generation integrated circuits and electronic systems are also changing. Siemens continues to develop new EDA technologies and tools that cover the entire life cycle from concept to verification and integration into more complex systems. The integration and complexity of integrated circuit design continue to increase through the use of artificial intelligence and digital twin multi-physics simulation.
Siemens' continued innovation and investment in EDA tools has enabled integrated circuit design and verification to reach new heights and promoted the rapid development of smart health and smart factory solutions. In the future, with the continuous breakthroughs in integrated circuit technology, Siemens will continue to lead the industry and provide strong support for the next generation of technological innovation.
